Isixhobo sokufaka i-wafer se-semiconductor seNitto DR3000III

Le yintshayelelo eneenkcukacha kwi-NEL SYSTEM™ DR3000III evela kwiNitto Denko. Ngumatshini wokufaka iteyiphu yokukhusela i-wafer osebenza ngokuzenzekelayo odlala indima ebalulekileyo ekuvelisweni kwe-semiconductor.

Uqwalaselo oluPhambili kunye neeNkcukacha zoBugcisa

Iinkcukacha eziphambili zobugcisa ze-DR3000III zezi zilandelayo:

Iinkcukacha zento/iiparameter

Uhlobo lweZixhobo: Isifaki seteyiphu esikhuselayo esizenzekelayo ngokupheleleyo kwiiwafers ezingama-300mm

Ubungakanani beWafer obusebenzayo: 300mm (12 intshi) / 200mm (8 intshi)

I-Wafer Esebenzayo Ubukhulu: 400μm okanye obukhulu

Isiphumo: ii-wafers ezingama-68 ngeyure

Itekhnoloji yoSetyenziso lweTape: Indlela edibeneyo yokulawula usetyenziso olungenaxinzelelo

Imigangatho Ehambelanayo: Ihlangabezana nokumakishwa kwe-CE kunye neenkcukacha ze-SEMI S2/S8

Nceda uqaphele: Ezi nkcukacha zingasentla zinokutshintsha ngokusekwe kwi-wafer, iteyiphu, kunye nezinye iimeko, kwaye zingabandakanya neempawu ezingeyomfuneko.

Iimpawu eziphambili kunye neeNzuzo

Iimpawu ezinamandla ze-DR3000III ziyibeka yahlukile kwicandelo lokuvelisa ngokuchanekileyo:

Iteknoloji yokusebenzisa engenaxinzelelo: Le yenye yeenzuzo zayo eziphambili zobuchwepheshe. Ukunciphisa uxinzelelo lweteyiphu ngaphambi kokuba i-lamination kulawula ngempumelelo i-wafer warpage emva kokugaywa ngasemva, nto leyo ibalulekileyo ekuphatheni ii-wafer ezinkulu nezincinci kakhulu.

Ulawulo lwe-lamination oluphantsi koxinzelelo: Ezi zixhobo zine-bonding ephantsi koxinzelelo kunye nolawulo lwe-adhesive stress, nto leyo enciphisa kakhulu umngcipheko wokonakala kwe-wafer pattern ngexesha le-lamination.

Ukuhambelana kwe-wafer: Nangona yenzelwe ii-wafers ezingama-300mm, ihambelana ngasemva nee-wafers ezingama-200mm kwaye ixhasa iinkqubo ezikhethekileyo ezineempawu ezikhethiweyo ezifana netafile ye-chuck eshushu (Ubuninzi be-100°C) kunye nee-rollers ezishushu (Ubuninzi be-60°C). Ngaphezu koko, iphatha ngokufanelekileyo ii-wafers ezigobileyo kunye nee-wafers ngomlinganiselo othile we-warpage.

Ukusebenza ngokuzenzekelayo okuphezulu kunye nobukrelekrele: Izixhobo zixhotyiswe ngezi zinto zilandelayo:

Ukuphathwa kwezinto ngokuzenzekelayo: Ixhasa iikhasethi ze-wafer ezivula ngaphambili (FOUP) / iikhasethi ezivulekileyo, kunye nengalo yerobhothi eyakhelwe ngaphakathi yokulayisha nokukhupha izinto ngokuzenzekelayo.

Ulungelelwaniso oluchanekileyo: Isebenzisa inkqubo yolungelelwaniso lwe-CCD engadibaniyo ukuqinisekisa ukuchaneka kwe-lamination.

Ukubeka esweni okukrelekrele: Ixhotyiswe ngomsebenzi wefayile yelog ukuze ilandelelwe idatha; ukufunyanwa kokugoba kwetheyiphu kuthintela ukungasebenzi kakuhle. Iskena semephu ye-wafer esinokuzikhethela sivumela ukuhlolwa kwezinto ezingenayo ngokuzenzekelayo.

Ihambelana neMigangatho yoShishino oluPhezulu: Ezi zixhobo ziyahambelana nemigangatho yokhuseleko kunye nokusingqongileyo ye-SEMI S2/S8 kwaye ziyafumaneka kunye neenkqubo zonxibelelwano ze-SECS/GEM ezikhethiweyo zokudibanisa ngaphandle komthungo kwiinkqubo zanamhlanje ze-semiconductor factory automation.

Ukusebenza okulula: Isikrini esikhulu sokuchukumisa esidityaniswe nomsebenzi weresiphi senza ukusebenza kube lula kwaye kube lula. Abasebenzisi kufuneka babize iresiphi yemveliso ehambelanayo ukuze bagqibezele ngokuzenzekelayo zonke izicwangciso zeparameter.

Umgaqo Wokusebenza: Ngaphambi kwenkqubo yokugaya emva, i-DR3000III inamathela ngokuchanekileyo iteyiphu yokukhusela kwicala elineepateni ze-wafer isebenzisa indlela engenaxinzelelo ukuthintela umonakalo woomatshini okanye ungcoliseko lweekhemikhali kwicala elingaphambili le-wafer ngexesha lokusila okukhawulezayo okulandelayo.

Iindawo Zokusetyenziswa: I-DR3000III isetyenziswa kakhulu kwezi ndawo zilandelayo ziphambili:

Ukwenziwa kweeSemiconductor: Iitships zeLogic kunye neetships zememori (iDRAM, iNAND Flash, njl.njl.): Ukukhusela isakhiwo sesekethe esithambileyo kwicala elingaphambili le-wafer kwiinkqubo eziphambili. Ukupakisha Okuphambili: Kubonelela ngokhuseleko lwe-wafer ngexesha leenkqubo zokupakisha ezikhula ngokukhawuleza ze-300mm ye-wafer (iFan-In WLP, iFan-Out WLP, njl.njl.).

I-MEMS kunye neeSensors: Ikhusela izakhiwo ze-micromechanical kunye neendawo zesensor ngexesha leenkqubo zokunciphisa umva.

Izixhobo zePower Semiconductor: Zicubungula iiwafers zezixhobo zamandla ezifana nee-IGBTs kunye neeMOSFET, zinciphisa ukumelana nobushushu kwaye ziphucula ukusasazwa kobushushu ngokuncitshiswa.

Intsebenziswano nezinye izixhobo: Kwimigca yokupakisha ye-semiconductor, i-DR3000III isebenza ngokudibeneyo nezixhobo ezilandelayo:

Intsebenziswano neZixhobo zoSetyenziso lweFilimu: Isebenza kunye nezixhobo zokususa iteyiphu yeNitto NEL-MA3000-III ngaphambi nasemva kwenkqubo yokuncitshiswa. I-DR3000III ifaka iteyiphu yokukhusela kuqala ukukhusela i-wafer ekonakalisweni ngexesha lokuncitshiswa; emva kokuncitshiswa, i-NEL-MA3000-III iyisusa ngokuchanekileyo iteyiphu yokukhusela, iqinisekisa ukuthembeka kunye nokhuseleko lwe-wafer ebhityileyo kakhulu kuyo yonke inkqubo.

Intsebenziswano neZixhobo zokuPolisha: Isebenza ngokusondeleyo noomatshini bokupolisha njengenyathelo lokukhusela. Emva kokuba ii-wafers zigqunywe ngeefilimu zokukhusela yi-DR3000III, emva koko zifakwa kumatshini wokusila ukuze zincitshiswe ngasemva, ukuqinisekisa ngokuthembekileyo ukhuseleko kunye nokuzinza kwenkqubo yokusila.

Ngokubanzi, iNitto DR3000III yinkqubo yokukhusela i-wafer ekhethekileyo, ezenzekelayo, nesebenza kakuhle. Ngokusebenzisa itekhnoloji yayo yokugquma ifilimu engenaxinzelelo, isombulula ngempumelelo imiba eqhelekileyo yokugoba kunye nokutshipha okudityaniswe nee-wafer ezinkulu ngexesha lenkqubo yokuncitshiswa kwecala elingasemva. Idlala indima ebalulekileyo kushishino lwe-semiconductor, isebenza njengesixhobo esibalulekileyo sokuqinisekisa imveliso kunye nokuthembeka kokwenziwa kwee-chip eziphambili. Ngeekowuteshini okanye imibuzo yobuchwephesha, nceda unxibelelane nabameli abasemthethweni beNitto okanye abasasazi abagunyazisiweyo eTshayina ngokuthe ngqo.