I-MRSI-705 Die Bonder: Iqonga le-5-Micron, Amandla kunye nezicelo

I-MRSI-705 yiplatifomu yokudibanisa iidayi ngokuchaneka okuphezulu kunye nokuhlanganiswa kweenxalenye enokulungiselelwa ngokusesikweni ebekwe ngokusemthethweni njenge-5-micron die bonder. Ukuchaneka kwayo kuvela kunxibelelwano lozinzo loomatshini, intshukumo elawulwayo, impendulo yendawo, ulawulo lwamandla, umbono womatshini, isoftware yezixhobo kunye nenkqubo endaweni yenkcazelo enye eyahlukileyo.

Ukubekwa kwe-5-micron kubhekisa kwindawo yokuma kweqonga ngokuchaneka. Akuchazi ubungakanani bedayi, kwaye akufuneki kudideke nesisombululo esicokisekileyo see-encoders zesikhundla somatshini. Iziphumo zokwenyani zeprojekthi zisaxhomekeke kwi-component, substrate, tooling, calibration, material behavior kunye nee-installed process modules.

Eli nqaku lichaza isiseko seqonga le-MRSI-705 esiqhelekileyo kunye nemiyalelo yaso ephambili yokuhlanganisa ngaphambi kokuba kuqale ukukhetha uqwalaselo oluthile lweprojekthi.

Yintoni i-MRSI-705

IMycronic ichonga iMRSI-705 njenge-5-micron die bonder eguquguqukayo, enokulungiswa ukuze kuhlanganiswe izinto ezichanekileyo. Ibonelela ngeqonga elilawulwayo lokukhetha izinto, ukuchonga indlela ezijongwa ngayo, ukuzilungelelanisa ne-substrate okanye ithagethi kunye nokugqibezela ucwangciso olufunekayo lokubekwa okanye ukubopha.

Lo matshini ufanelekile kwiinkqubo zokuncamathisela, ukuhlanganisa iitshiphusi kunye nezinye iinkqubo apho ukuphathwa kwezixhobo, ukulungelelaniswa, izixhobo kunye neemeko zokubopha zifuna ulawulo olusondeleyo.

Uyilo lwayo olunokulungiselelwa luvumela ukufakwa kwezinto, izixhobo, ubuchwepheshe bokubopha kunye namaqhinga okuvelisa ukuba kukhethwe malunga nendibano ekucetywayo kuyo. Igama lemodeli lichaza iqonga lokuchaneka, kodwa alibonisi yonke imodyuli efakwe kumatshini othile.

Oko Kuthethwa Yi-"5-Micron Die Bonder"

Ulwazi olusemthethweni luchaza ukuchaneka kokubekwa kwe-±5 microns okanye ngcono kwiqonga le-MRSI-705. Oku kuchaza udidi lwayo lokuchaneka kokubekwa phantsi kweemeko ezifanelekileyo zomatshini kunye nenkqubo.

Isisombululo se-encoder sichaza indlela inkqubo yolawulo enokulinganisa okanye ixele ngayo indawo ye-axis kakuhle. Ukuchaneka kokubekwa kubonisa inkqubo enkulu equka uzinzo lwesakhiwo, ukuziphatha kwe-axis, ukulungelelaniswa kombono, izixhobo, ukulinganiswa, iimpawu zecandelo kunye nokuhamba kwezinto.

Uvavanyo lweprojekthi olunentsingiselo ke ngoko ludibanisa iinkcukacha zeqonga elisemthethweni kunye nemeko yokwenyani yenkqubo. Ukuqina kwesixhobo, uzinzo lwesiseko, iziphumo zobushushu, umgangatho womfanekiso kunye nolandelelwano lokubopha olukhethiweyo konke oku kunokuchaphazela isiphumo sokugqibela.

Uyilo lweMishini lweNtshukumo eZinzileyo neLawulwayo

I-MRSI-705 isebenzisa isakhiwo esiqinileyo esixhaswa yi-granite. I-Granite inika isalathiso esizinzileyo soomatshini, ngelixa ulungiselelo oluphezulu luxhasa intshukumo elawulwayo ngaphezulu kwendawo yokusebenza yokubopha.

Iimoto ezicoliweyo ezingenasinyithi ezisebenza ngomgca ziqhuba inkqubo yokuhamba. Zibonelela ngentshukumo ethe ngqo ngaphandle kothumelo oluqhelekileyo loomatshini, ngelixa ukupholisa okusebenzayo kunceda ukulawula utshintsho lobushushu ngexesha lokusebenza.

Ii-encoders ezithe nkqo ezinesisombululo esiphezulu zibuyisela ulwazi lwendawo kwinkqubo yolawulo. Ulwazi olusemthethweni luthi izikali ze-encoder zibonelela ngesisombululo se-0.1-micron. I-axis ye-Z isebenzisa itekhnoloji yomoya ukuxhasa intshukumo ethe nkqo ethe nkqo ngonxibelelwano oluncitshisiweyo loomatshini.

Ubudlelwane bungaqondwa ngolu hlobo:

Isakhiwo esizinzileyo → Intshukumo elawulwayo → Impendulo yesikhundla esihle → Ukuthathwa okuphindaphindiweyo, ukulungelelaniswa kunye nokubekwa

Inzuzo ivela kwisakhiwo segranite, iimoto, ii-encoders, uyilo lwe-vertical-axis, izixhobo kunye nesoftware yokulawula esebenza kunye. Akukho nto inye iqinisekisa ngokuzimeleyo isiphumo sokubekwa kokugqibela.

Ulawulo Lokunyanzeliswa Kwezinto Ezibuthathaka Nezinobuthathaka Kwinkqubo

I-MRSI-705 ibandakanya impendulo yamandla evaliweyo. Endaweni yokuxhomekeka kuphela kwindawo elawulwayo yokubopha-intloko, inkqubo yolawulo inokujonga amandla ngexesha lokudibana kwaye ilawule inkqubo ngokweemfuno ezicwangcisiweyo.

Ulwazi olusemthethweni luthi amandla enxalenye anokucwangciswa ukuya kuthi ga kwi-10 grams. Oku kunokuba luncedo kwiindawo ezincinci, ezibuthathaka okanye ezibuthathaka ezinokuthi zonakaliswe kukudibana kakhulu.

Amandla afanelekileyo asaxhomekeke kwinxalenye, izinto zokubopha, indlela yokwakheka kwamalungu kunye nezixhobo. Isixhobo esifanelekileyo kufuneka sixhase indawo yoqhagamshelwano ecetywayo ngaphandle kokonakalisa inxalenye okanye ukungenisa intshukumo engafunekiyo.

Umbono woMshini, Ukuchonga kunye noLungelelaniso

Umbono womatshini unceda ekuchongeni icandelo ngaphambi kokuba lithathwe kwaye limisele indlela elijongwa ngayo. Ulwazi olusemthethweni lweqonga luquka ukufunyanwa kwedayi esekwe kumbono kunye nokuqatshelwa kokujonga kwe-360-degree, okuvumela inkqubo ukuba iphendule xa icandelo liboniswa kwiindawo ezahlukeneyo zokujikeleza.

Ulungelelwaniso lwe-substrate-fiducial lubonelela ngereferensi ebonakalayo yokubeka i-component ngokumalunga ne-target. Endaweni yokuxhomekeka kuphela kwi-coordinate yomatshini egciniweyo, inkqubo inokufumana iimpawu zokwenyani kwi-substrate kwaye izisebenzise ngexesha lolungelelwaniso.

Ukukhanya okucwangcisiweyo kuxhasa ukuqatshelwa kwiindawo ezahlukeneyo, iimpawu, imiphetho kunye neendlela zobuchule. Ke ngoko, iresiphi yokukhanya kunye nokubona okusebenzayo inokwahluka ukusuka kwimveliso ukuya kwenye.

Umgangatho wokubona uphenjelelwa yi-optics, umahluko weempawu, ukulinganiswa, uzinzo lwezixhobo kunye nolwalamano phakathi kweempawu ezilinganisiweyo kunye nendawo yokugqibela yokubopha. Ayinakuzihlawulela ngokwayo nge-substrate engazinzile, isixhobo esingafanelekanga okanye isalathiso sokulungelelanisa esingachazwanga kakuhle.

Inkxaso yokufaka izinto kunye nezixhobo zokuxhasa i-High-Mix Assembly

Ngokuxhomekeke kulungiselelo olufakelweyo, iqonga le-MRSI-705 linokufumana izinto ngokusebenzisa iifomathi ze-wafer, iipakethi ze-waffle, iiGel-Paks, ii-tape feeders okanye ezinye iindlela zokubonisa ezicwangcisiweyo.

Ifomathi ekhethiweyo ichaphazela indlela ezifumaneka ngayo izinto, ezikhethwayo nezijongiswe ngayo, ukuba zeziphi izixhobo ezifunekayo kunye nendlela esebenza kakuhle ngayo inkqubo phakathi kweemveliso. Inkqubo esekelwe kwi-wafer ingadinga idatha ye-die-position kunye nokuphathwa kwe-wafer okuzinikeleyo, ngelixa iipakethi ze-waffle, iiGel-Paks kunye nezixhobo ezifakwe kwi-tape zizisa iimfuno ezahlukeneyo zokubonisa kunye nokutshintsha.

Izixhobo zokuthatha nokubeka nazo zihambelana nesicelo. Imiphezulu yazo yokunxibelelana, ubukhulu kunye nezinto kufuneka zihambelane nenxalenye, ngelixa izixhobo zokubopha zinokufuna ukuxhasa ubushushu, amandla okanye ezinye iimeko zenkqubo.

Ukuguquguquka kweqonga kuvumela umatshini ukuba ucwangciswe ngokwezicwangciso ezahlukeneyo zezinto, kodwa isixhobo sokufaka esifunekayo, isixhobo kunye nezixhobo zokuguqula kufuneka zichongwe kwindibano yokwenyani.

IiTekhnoloji zeNdibano eziDibene ne-MRSI-705

Ukubopha nge-Eutectic

I-Eutectic bonding isebenzisa izinto ezilawulwayo kunye nenkqubo yobushushu ukwenza i-joint phakathi kwe-component kunye ne-target. Le nkqubo inokubandakanya imisebenzi yokufudumeza, izixhobo kunye nolawulo olukhethiweyo kwinkqubo yezinto.

I-Epoxy Die Attachment

I-Epoxy die attach isebenzisa inkqubo yezinto ezinamathelayo ukuze iqinise icandelo kwindawo elijolise kuyo. Izinto ezisetyenzisiweyo zingasetyenziswa ngokusasaza okanye ngenye indlela elawulwayo ngaphambi kokuba zibekwe, apho ukucocwa kuphathwa ngokwenkqubo yokuncamathelisa ekhethiweyo.

Ukubopha kwe-UV ngaphakathi kweSitu

Ukubopha kwe-UV okungaphakathi kudibanisa izinto ezinokunyangwa yi-UV kunye nezixhobo zokuvezwa ezihambelanayo. Ulandelelwano kufuneka lugcine ulungelelwano ngelixa izinto zisetyenziswa, zibekwe kwaye zinyangwa.

Indibano yeFlip-Chip

Ukuhlanganiswa kwe-flip-chip kubeka icala elisebenzayo okanye elidibeneyo ledayi ngasemphezulu wokudibana. Oku kutshintsha iimfuno ze-pickup, i-orientation, i-alignment, inkxaso kunye ne-bonding-tool.

Ukubopha okuxineneyo kobushushu

Ukubopha okuxineneyo kobushushu kudibanisa ubushushu obulawulwayo kunye namandla ukwenza uqhagamshelo. Uyilo lwezixhobo, ulawulo lobushushu, indlela izinto ezisebenza ngayo kunye nexesha lenkqubo zonke zinegalelo kwisiphumo.

Ezi ziindlela zobuchwepheshe beqonga endaweni yoluhlu lwemisebenzi efakwe kwi-MRSI-705 nganye. Inkqubo nganye ifuna i-hardware efanelekileyo, isoftware, izixhobo kunye nolandelelwano olufanelekileyo.

Ubuchule bePlatform ePhambili kunye noCwangciso oluFakiweyo

I-MRSI-705 ibonelela ngesiseko esichanekileyo esifanayo: isakhiwo esizinzileyo, intshukumo elawulwayo, impendulo yesikhundla esincinci, ulawulo lwamandla oluvaliweyo kunye nombono womatshini. Ezi zakhono zixhasa imiyalelo emininzi yokuhlanganisa, kodwa azenzi uqwalaselo olunye lomatshini oluqhelekileyo.

I-flip-chip assembly ingadinga izixhobo ze-orientation kunye nezixhobo ze-process. I-Eutectic bonding ingadinga intloko eshushu okanye indawo yokusebenza. I-Epoxy assembly ingadinga izixhobo zokukhupha, ngelixa inkqubo ye-UV ekwi-situde ifuna izixhobo zokulungisa ezihambelanayo. I-thermal-compression bonding izisa amandla ayo, ubushushu kunye neemfuno zezixhobo.

Izixhobo zokufaka izinto kufuneka zihambelane neprojekthi. Umatshini olungiselelwe iipakethi zewaffle usenokungabi nazo iimodyuli ezifunekayo zokufaka iwaffle okanye iteyiphu. Isoftware, iilayisenisi kunye neeresiphi zidibanisa izixhobo ezifakiweyo kulandelelwano olucetywayo lokuhlanganisa.

Iqonga lichaza oko kunokwakhiwa malunga ne-MRSI-705, ngelixa uqwalaselo olufakiweyo lumisela oko umatshini ngamnye anokukwenza.

I-MRSI-705 kunye ne-MRSI-705HF nazo mazihlale zihlukile kwiinkcukacha zobugcisa. Ulwazi olunamandla aphezulu okanye olushushu oludityaniswe nohlobo lwe-HF akufuneki ludluliselwe kwi-MRSI-705 eqhelekileyo ngaphandle kobungqina obuthile bomzekelo.

Icebo lokukhetha izixhobo kunye nemveliso

IMycronic ichaza i-turret enomthamo ophezulu enokukhetha ukubamba izixhobo ezili-12. Ngokugcina izixhobo ezininzi zifumaneka kwinkqubo enye ecwangcisiweyo, inokunciphisa amanyathelo ahlukeneyo okutshintsha izixhobo kwiindibano ezisebenzisa izixhobo ezininzi ezilandelelanayo.

I-turret inokuxhasa uluhlu oluphezulu lwemveliso, ulandelelwano oluntsonkothileyo lokuhlanganisa okanye iindlela zemveliso ebezifuna utshintsho oluphindaphindwayo lwezixhobo. Ayisiyonto iqhelekileyo kuyo yonke i-MRSI-705 kwaye ayimiseli mfanekiso omnye wemveliso jikelele.

Indawo yokusebenza enokulungiswa ikwayenza iqonga libe luncedo kuphando, uphuhliso lwenkqubo kunye nokwaziswa kwemveliso emitsha. Iinjineli zinokuhlengahlengisa ukuboniswa kwezinto, izixhobo, iindlela zokupheka umbono kunye namanyathelo okubopha njengoko ukuhlanganiswa kukhula.

Ngoqwalaselo olufanelekileyo, i-MRSI-705 inokuxhasa imveliso yomthamo ophantsi ukuya kophakathi, kwaye kwiimeko ezithile, amaqhinga omthamo ophezulu. Ukufaneleka kuxhomekeke kumxube wemveliso, ukubonakaliswa kwezinto, inani lamanyathelo enkqubo, utshintsho lwezixhobo, iimfuno zokuhlola kunye nomjikelo weenjongo.

Iindawo eziMele izicelo

Izinto ezisemthethweni zidibanisa i-MRSI-705 neemodyuli ze-microwave, ukupakishwa kwe-photonics, ii-amplifiers zamandla e-RF, ii-infrared kunye nee-pressure sensors, i-MEMS, ukupakishwa kwe-semiconductor, ii-electronics ze-hybrid, iimodyuli ze-multichip kunye ne-laser-diode bonding.

Ezi zicelo zingazuza kwindawo echanekileyo, ulawulo lokuqondisa, ukuphathwa kwezinto ezibuthathaka kunye nobuchwepheshe bokubopha obuguquguqukayo. Ii-Photonics kunye nee-laser-diode assemblies zinokubandakanya ukulungelelaniswa okunzima kunye noqhagamshelwano olulawulwayo, ngelixa iimodyuli ze-hybrid kunye ne-multichip zinokudibanisa iintlobo ezahlukeneyo zezakhi kunye namanyathelo enkqubo.

Ileyibhile yesicelo imisela ukufaneleka okunokwenzeka endaweni yokuhambelana nemveliso ethile. I-die yokwenyani, i-substrate, iireferensi zokulungelelanisa, indlela yokubopha, inkqubo yezinto kunye nezixhobo zimisela ukuba iqonga linokulungiselelwa na iprojekthi.

Ukusuka kuPhando lwePlatform ukuya kuHlolo loCwangciso

Uhlolo olujoliswe kwiprojekthi ethile luba luncedo xa sele ichaziwe icandelo, isiseko kunye nenjongo yokubopha. Ulwazi lokuqala kufuneka lubandakanye ubungakanani becandelo kunye nezinto ezisetyenzisiweyo, isiseko ekujoliswe kuso, ukuchaneka kokubekwa okufunekayo, ulwalathiso, indlela yokubopha kunye nezinto ezifunekayo.

Iimfuno zamandla okanye zokufudumeza, ifomathi yokufaka, izixhobo, iimfuno zokuhlola okanye zokunyanga, umxube wemveliso kunye nomthamo wemveliso olindelekileyo nazo zichaphazela uqwalaselo. Zizonke, ezi zinto zimisela ukuba zeziphi izixhobo zokuphatha izinto, ukuseta umbono, iimodyuli zenkqubo kunye nezixhobo zemveliso ekufuneka ziqwalaselwe.

Inyathelo elilandelayoUqwalaselo lwe-MRSI-705uphononongo olusekelwe kwindibano yokwenyani. Nxibelelana neqela lobuchwephesha nge-imeyile okanye nge-WhatsApp ukuze nixoxe ngale projekthi. Imizobo yecandelo, ulwazi lwesiseko, iifoto zezixhobo kunye namaxwebhu enkqubo anokuqhotyoshelwa emva kokuba incoko ivuliwe.

Ukuhambelana, iindlela ezifakiweyo, ukusebenza kwenkqubo, ixabiso kunye nokuhanjiswa kufuneka kuxoxwe kuphela emva kokuba iimfuno zeprojekthi kunye noqwalaselo olufanelekileyo lomatshini zithelekisiwe.

Imibuzo Ebuzwa Rhoqo Malunga ne-MRSI-705

Yintoni i-MRSI-705?

Liqonga elinokulungiswa elinokubopha ii-die-bonding ezichanekileyo nezihlanganisiweyo elibekwe ngokusemthethweni yiMycronic njenge-die bonder ye-5-micron.

Kutheni i-MRSI-705 ibizwa ngokuba yi-5-micron die bonder?

Eli gama libhekisa kumagama asemthethweni okubeka-ngokuchanekileyo e-±5 microns okanye ngaphezulu. Alichazi ubukhulu bedayi okanye aliqinisekisi isiphumo esifanayo kuyo yonke inkqubo ecwangcisiweyo.

Ngaba isisombululo se-encoder ye-0.1-micron siyafana nokuchaneka kokubekwa?

Hayi. Isisombululo se-encoder sichaza ubunono besikali sempendulo ye-axis-position. Ukuchaneka kokubekwa kubonisa inkqubo epheleleyo yoomatshini, umbono, izixhobo, ukulinganiswa kunye nenkqubo.

Ingaba i-MRSI-705 flip-chip iyakwazi?

I-flip-chip assembly yindlela ehambelanayo neqonga, ngelixa ubuchule obusebenzisekayo bufuna i-orientation hardware, tooling, software kunye ne-bonding configuration echanekileyo.

Ingaba i-turret enezixhobo ezili-12 isemgangathweni kwi-MRSI-705?

Hayi. Lulungiselelo olunomthamo ophezulu olunokuthwala izixhobo ezili-12 kwaye lunciphise amanyathelo ahlukeneyo okutshintsha izixhobo kuloo nkqubo ixhotyisiweyo.

Yintoni umahluko phakathi kwe-MRSI-705 kunye ne-MRSI-705HF?

Ziimodeli ezahlukeneyo. Iinkcukacha zokufudumeza ezinamandla aphezulu okanye ezinde ezinxulumene ne-MRSI-705HF akufuneki zisetyenziswe kwi-MRSI-705 eqhelekileyo.

Isiphelo:I-MRSI-705 yiplatfomu yokubophelela i-die-bonding ye-5-micron enokulungiswa apho indawo yayo esemthethweni ye-±5-micron-okanye-engcono ichaza ukuchaneka kokubekwa endaweni yobukhulu be-die. Uyilo lwayo oluxhaswa yi-granite, ii-linear motors, isisombululo se-encoder ye-0.1-micron, i-air-bearing Z axis, impendulo yamandla evaliweyo kunye nombono womatshini zakha isiseko esichanekileyo esiqhelekileyo. Izinto ezifakwayo, izixhobo kunye neetekhnoloji zokubophelela zihlala zicwangcisiwe, ngelixa i-turret yezixhobo ezili-12 ezikhethiweyo inokuchaphazela icebo lemveliso ngaphandle kokuchaza inqanaba elinye lemveliso jikelele. Uphononongo loqwalaselo oluthile lweprojekthi linyathelo elilandelayo elifanelekileyo xa sele kwaziwa icandelo, i-substrate, indlela yokubophelela kunye neemfuno zemveliso.