Isikhokelo soQwalaselo lwe-MRSI-705: Ukudibanisa ii-Inputs, iiNkqubo zokudibanisa kunye neemfuno zeMveliso

Uqwalaselo olusebenzayo lwe-MRSI-705 luqala ngeprojekthi yokuhlanganisa, kungekhona ngokukhetha iseti enkulu yeenketho zomatshini. Iqonga elifanayo linokulungiswa lijikeleze i-wafer input, ii-waffle packs, ii-Gel-Paks, izinto ezifakwe kwi-tape, iiteknoloji ezahlukeneyo zokubopha kunye neendlela ezahlukeneyo zokuvelisa.

Ulwazi olusemthethweni lweqonga luchaza oko kunokucwangciswa, kodwa aluchazi matshini uqhelekileyo omnye. Ulungiselelo olufanelekileyo lulandela icandelo, isiseko, izinto zokubopha, imfuneko yokulungelelanisa, ulandelelwano lwenkqubo kunye nenjongo yemveliso.

Esi sikhokelo sichaza indlela ezo ziphumo zeprojekthi eziguqulela ngayo kwiindawo zokuphatha izinto, ukubopha, izixhobo, isoftware kunye nemveliso ekufuneka zihlolwe ngaphambi kokuba kukhethwe umatshini wokwenyani.

Qala ngeProjekthi yoKuhlanganisa

Isigqibo sokuqala asikokuba umatshini udinga i-wafer feeder, inkqubo yokukhupha okanye isixhobo sokutshintsha esinokukhethwa. Sichaza ukuba inkqubo kufuneka idityaniswe njani, indlela enikezelwa ngayo inxalenye kunye nendlela indibano egqityiweyo ekufuneka ihambe ngayo kwimveliso.

Ezi zinto zifakwayo maziqwalaselwe kunye. Inxalenye inokuba lula ukuyikhetha kodwa kube nzima ukuyilungelelanisa, ngelixa indlela efanelekileyo yokubopha isenokungasebenzi kakuhle xa ukuhamba kwe-substrate okucetywayo kudala ukuphathwa okugqithisileyo okanye umsebenzi wokutshintsha.

Injongo yophononongo lokuqala ayikokuchaza zonke iiparameter zobunjineli. Kukuchonga ukuba zeziphi iindawo zeqonga ezifuna uphando olunzulu kwaye zeziphi iindlela eziya kongeza ixabiso elincinci.

Ukufakwa kweCandelo lokuTshatisa, Ukuphathwa kweWafer kunye nokuhamba kweSubstrate

Ukufakwa kwecandelo kunye nokuthuthwa kwesiseko sendawo zizigqibo ezahlukeneyo zokumisela. Umthombo wokufakwa umisela indlela idayi okanye icandelo elibekwe ngayo, elikhethwe ngayo nelijongiswe ngayo. Ukuhamba kwesiseko sendawo kumisela indlela ekujoliswe ngayo kwindibano evezwa ngayo, exhaswa ngayo kwaye ishukunyiswa ngayo kwimveliso.

Ukufakwa kweCandelo eliSele liSingulated

Ulwazi olusemthethweni lwe-MRSI-705 lubandakanya imiyalelo yokufaka efana neepakethi ze-waffle, iiGel-Paks kunye nee-tape feeders. Ifomathi nganye idala ubudlelwane obahlukileyo phakathi kwendawo yecandelo, ukufikelela kwi-pickup, ukuqhelaniswa kunye nokutshintsha.

Iipakethi zeWaffle kunye neeGel-Paks zibonisa iindawo ezahlukeneyo kwiindawo ezicwangcisiweyo, kodwa i-pocket geometry, imeko yomphezulu kunye nokujongwa kwenxalenye kunokuchaphazela ukufikelela kwizixhobo. I-tape input ingenisa ukutya, ukukhomba kunye nezixhobo zokubonisa ekufuneka zihambelane nenxalenye kunye nolandelelwano lwemveliso.

Olu khetho kufuneka lubonise okungaphezulu kokulula kokulayisha. Luchaphazela uyilo lwezixhobo zokuthathwa, ukuchongwa kwenxalenye, umngcipheko wokuphatha kunye nexesha elifunekayo lokuhamba phakathi kweemveliso.

Ukukhethwa kweWafer ngqo kunye nokukhethwa kweDie

Ukuchongwa kwe-wafer ngqo kuyafaneleka xa iprojekthi kufuneka ikhethe iidayi ezivela kwi-wafer endaweni yephakheji okanye iteyiphu ephakathi. Kunokunciphisa ukuphathwa okongezelelekileyo kwaye kugcine ulwazi lwendawo yedayi lunxulumene nenkqubo ye-wafer.

Le ndlela ingafuna inkxaso efanelekileyo ye-wafer, indlela yokutya okanye yokulayisha, inkqubo ye-ejector, izixhobo zokuthatha kunye nesoftware edibanisa idatha yokukhetha idayisi kunye ne-wafer ebonakalayo.

Ngokuxhomekeke kwinkqubo, ukhetho lwedayi lunokusebenzisa imephu ye-wafer, ukuqondwa kwe-inki-dot okanye enye indlela evunyiweyo. Imephu inokubonelela ngolwazi lwendawo kunye nolwazi olwaziwayo, ngelixa ukuqondwa kwe-inki-dot kuxhomekeke kumanqaku abonakalayo aveliswa ngexesha lenkqubo ephezulu.

Idatha kunye ne-wafer ebonakalayo kufuneka zihlale zihambelana. Ulwalathiso lwemephu, iindawo zedayi kunye ne-logic yokukhetha kufuneka zihambelane ne-wafer eboniswe kumatshini. Iimpawu ezibonakalayo ziluncedo kuphela xa i-optics, ukukhanya kunye nendlela yokuziqonda zinokuzibona ngokuthembekileyo.

Iidayi ezibhityileyo, izinto ezibuthathaka kunye nomphezulu ongasemva obuthathaka nazo zinokutshintsha iimfuno zenkxaso, i-ejector kunye ne-pickup. Ubukhulu be-wafer, iifomathi zemephu kunye nolungiselelo lwe-ejector kufuneka ziqinisekiswe kwiprojekthi endaweni yokuqikelelwa kwigama lemodeli.

I-Substrate kunye nokuhamba kwePakeji

I-substrate okanye iphakheji ingaphathwa ngendlela ezimeleyo, emgceni okanye ekhasethini ukuya kwikhasethini. Ezi ndlela zichaza indlela i-assembly target ehamba ngayo kwimveliso; azichazi apho idayisi ivela khona.

Ukusebenza kwedwa kungafanela uphuhliso, ukufikelela rhoqo ngesandla okanye umsebenzi omncinci. Ukuhambisa ngaphakathi emgceni kunokuxhasa ukulungelelaniswa nezixhobo ezingqongileyo xa ulawulo kunye neendawo zokunxibelelana zihambelana. Ukuphathwa kwekhasethi kunokufaneleka xa ii-substrates sele zicwangcisiwe ngokwendlela yokuvelisa.

Akukho mntu ungcono ngokwemvelo. Ukhetho lulandela ifomathi yemveliso, umngcipheko wokuphatha, uyilo lomgca kunye nephethini yotshintsho olulindelekileyo.

Nxibelelanisa Inkqubo yoQhagamshelo neeModyuli ezifunekayo

Indlela yokubopha ichaphazela ukusetyenziswa kwezinto, ukuphathwa kwecandelo, ulawulo loqhagamshelwano, izixhobo kunye nolandelelwano lwenkqubo. Ukukhetha iteknoloji edibeneyo ke ngoko kuchazwa izigqibo ezininzi zokumisela ezidibeneyo.

Ukubopha nge-Eutectic

Ukubopha nge-Eutectic kusebenzisa izinto ezilawulwayo kunye nenkqubo yobushushu ukwenza i-joint. Ulungiselelo olufanelekileyo lunokubandakanya izixhobo ezifudunyezwayo, indawo yokusebenza efudumeleyo okanye enye indlela yobushushu, kunye nezixhobo ezithile zenkqubo kunye nolawulo lomoya apho inkqubo yezinto ifuna khona.

Ubushushu, amandla kunye nexesha zezenkqubo yezinto ezifanelekileyo endaweni yokuseta i-MRSI-705 enye.

Ukusasazwa kwe-Epoxy

Ukusasaza izinto kuhambisa izinto ezibophayo ngempompo, indlela yolwelo kunye nenaliti okanye umlomo. Inkqubo kufuneka ihambelane nobukhulu bezinto, i-depositi geometry efunekayo, indlela yokucoca kunye nendawo yokuvelisa.

Ulawulo lwezinto kunye nokucocwa kwazo kufuneka kuhambelane nolandelelwano olucetywayo. Isalathiso se-epoxy die attach asiqinisekisi ukuba izixhobo zokuhambisa ezifunekayo zifakiwe.

Ukunyathela i-Epoxy

Ukunyathela kudlulisa izinto ngesixhobo esikhethekileyo endaweni yokukhupha isandi. Kunokuba luncedo xa inkqubo ifuna imo yokudlulisa echaziweyo okanye ukulandwa kwezinto ezilawulwayo ukusuka kumphezulu womboniso.

Uyilo lwezixhobo, ukubonakaliswa kwezinto, ijiyometri yokudlulisa kunye necebo lokucoca ligqiba ukuba ukustampa kuyasebenziseka na. Kusebenza injongo enxulumene nokukhupha, kodwa ezi ndlela zimbini azitshintshi.

Ukubopha kwe-UV ngaphakathi kweSitu

Inkqubo ye-UV ekwi-situde idibanisa izinto ezihambelanayo zokubopha kunye nokubekwa okulawulwayo kunye nokuvezwa kwe-ultraviolet. Ulungiselelo lomatshini kufuneka lubonelele ngokufikelela kokupholisa ngelixa lugcina ukulungelelaniswa kwecandelo kulo lonke ixesha lokuvezwa.

Indlela yokusebenzisa izinto, i-hardware yokunyanga kunye nolandelelwano lwesoftware kufuneka zisebenzisane kwinkqubo yokuncamathelisa ekhethiweyo.

Indibano yeFlip-Chip

I-flip-chip assembly ibeka icala elisebenzayo okanye elidibeneyo le-die ukuya kwi-substrate. Oku kunokungenisa izixhobo ze-die-orientation, umbono osezantsi, izixhobo ezikhethekileyo zokuthatha, ulungelelwaniso lwe-substrate kunye nesoftware elungelelanisa ulandelelwano olupheleleyo lokuphatha.

Umphezulu ovelileyo unokufuna ukhuseleko ngexesha lokuthathwa nokudluliselwa, nto leyo eyenza ukuba uqhagamshelwano lwezixhobo kunye nenkxaso ibe yinxalenye yesigqibo sokumisela.

Ukubopha okuxineneyo kobushushu

Uxinzelelo lobushushu ludibanisa ubushushu obulawulwayo kunye namandla kunye nolwakhiwo olufunekayo lwamalungu. Olu lungiselelo lunokubandakanya izixhobo ezifudunyezwayo, impendulo yamandla, ulawulo lokuphakama kunye nolawulo olucokisekileyo lwenkxaso yesiseko kunye nokuhambelana.

Ubuchule obuchanekileyo behardware kunye nenkqubo kufuneka busekwe kumaxwebhu obuchwephesha kunye nomatshini oqwalaselwayo.

Ezi zikhokelo zenkqubo zisebenzisa indibaniselwano eyahlukeneyo yehardware, isoftware, izixhobo kunye neemeko zenkqubo eziphuhlisiweyo. Akufanele ziphathwe njengephakheji enye esemgangathweni okanye kucingelwe ukuba zisebenza kunye ngaphandle kophononongo lobunjineli.

Amandla oLawulo, Ubude, Ukulingana kunye noLungelelaniso

Umgangatho wokubopha uxhomekeke kwindlela icandelo elisondela ngayo kwindawo ekujoliswe kuyo, indlela efunyanwa ngayo uqhagamshelwano kunye nendlela imeko yokugqibela yokubeka elawulwa ngayo. Ezi zinto zidibanisa ubuchwepheshe bokubopha obukhethiweyo kunye nokuhamba komatshini, izixhobo kunye nokuseta umbono.

Icebo lendawo-ukunyanzela lisebenzisa ithagethi yamandla ecwangcisiweyo ukulawula uqhagamshelwano. Linokuba luncedo apho icandelo okanye ijoyinti lifuna umthwalo ochaziweyo, kodwa indawo echanekileyo ilandela amandla ecandelo, ijiyometri yesixhobo kunye nendlela yokubopha.

Indawo ukusuka kwindawo ukuya kwindawo ephezulu isebenzisa isiphelo esisekelwe kwindawo ethile okanye esisekelwe kubude. Oku kunokufaneleka xa i-geometry yokuhlanganisa izinzile, nangona ubukhulu be-substrate, i-warpage kunye notshintsho lwe-fixture lunokutshintsha imeko yokwenyani yoqhagamshelwano.

Ukulingana kufuneka kuqwalaselwe ngaxeshanye. I-substrate egobileyo, inkxaso engalinganiyo okanye into ehleli kakubi inokubangela unxibelelwano olungalinganiyo nokuba ukuphakama okucwangcisiweyo kufikeleleke ngokuchanekileyo.

Indlela yokulungelelanisa kufuneka iyilwe ngokujikeleze iimpawu ezikhoyo kwicandelo nakwithagethi. Umgangatho we-fiducial, umahluko womphezulu, ukukhanya, ukufikelela kwicala elisezantsi, ukulinganiswa kunye nokuhamba kobushushu konke oku kunokuchaphazela isiphumo. Ngoko ke umbono uyinxalenye yesicwangciso sokulawula inkqubo endaweni yokhetho lwekhamera ezimeleyo.

Khetha icebo lokusebenzisa izixhobo kunye nelokutshintsha izixhobo

Indibano enye ingadinga izixhobo ezininzi. Iikholethi zokuthatha izinto, izixhobo zokubeka izinto, izixhobo ezifudunyezwayo kunye nezixhobo zokunyathela zinokusebenza izigaba ezahlukeneyo, ngelixa iimveliso ze-multichip zinokuzisa iintlobo ezahlukeneyo zezakhi ngaphakathi kweresiphi enye.

Iibhanki zezixhobo zeModular zinokubonelela ngokuguquguquka okwaneleyo kwi-R&D, i-NPI kunye nemveliso entsonkothileyo xa inani lezixhobo lihlala lilawuleka kwaye ixesha lokutshintsha izixhobo alingomqobo omkhulu kumjikelo.

IMycronic ikwachaza i-turret enomthamo ophezulu enokukhetha ukubamba izixhobo ezili-12. Inokuba luncedo xa kusetyenziswa izixhobo ezininzi ngokulandelelana, uhlobo lwemveliso luphezulu okanye utshintsho oluphindaphindwayo lwezixhobo luphazamisa inkqubo.

I-turret ayiqhelekanga, kwaye izixhobo ezongezelelweyo aziyiphuculi ngokuzenzekelayo imveliso. Ixesha lokubopha, umbono, ukunyanga, ukusasaza, ukulayisha izinto kunye nokuhamba kwe-substrate kunokuhlala kuyimiba ephambili yomjikelo. Kwimveliso ezinzileyo enezidingo ezimbalwa zezixhobo, ulungiselelo olulula lunokuba lula ukuyisebenzisa nokuyigcina.

Lungiselela imeko-bume yemveliso

Isoftware, Iiresiphi kunye nokulandeleka

Iimodyuli zehardware ziba luncedo kuphela xa isoftware inokuzilungelelanisa njengenkqubo enye ephinda-phindwayo. Uhlolo loqwalaselo kufuneka lugubungele inguqulelo yesoftware, iilayisensi, iindlela zokupheka zenkqubo, iindlela zokupheka zombono, iinkcazo zezixhobo kunye nolwakhiwo lokufikelela komsebenzisi.

Ukucubungula i-wafer kunokungenisa ukuphathwa kwemephu kunye nobuchule bokukhetha iidayi. Ukutshintshwa kwemveliso kufuna iindlela zokupheka ezilawulwayo kunye nokunikezelwa kwezixhobo ezichanekileyo. Ukulandelela okanye ukulandeleka kwezinto kunokufuna ukuchongwa kwemveliso, iirekhodi zemveliso kunye notshintshiselwano lwedatha oluxhaswayo nezinye iinkqubo.

Ugcino kunye nokubuyisela izinto kwakhona kubalulekile. Umatshini ofanelekileyo ngobuchwephesha usenokwenza umngcipheko wokuqalisa xa iiresiphi, idatha yokulinganisa okanye iziqinisekiso zokufikelela zingenakulondolozwa kwaye zibuyiselwe.

Imveliso ekwi-intanethi inokongeza ulawulo lokuhambisa kunye nokulungelelaniswa kwezixhobo ezisezantsi okanye ezisezantsi. Ujongano olufana ne-SMEMA kufuneka lufakwe kuphela kwisicwangciso seprojekthi xa lubhalwe phantsi ukuze luqwalaselwe ngokufanelekileyo. Unxibelelwano lwe-host okanye lwefektri lukwafuna ubungqina obuvela kwindawo yokwenyani yesoftware.

Imveliso ye-R&D, i-High-Mix kunye ne-Volume

Umsebenzi wophando nophuhliso lwenkqubo uhlala uxhamla kwizixhobo eziguquguqukayo, ukufikelela lula kunye nokukwazi ukuvavanya iindlela ezahlukeneyo zokufaka izinto okanye zokubopha. Utshintsho oluqhelekileyo lweresiphi lulindelekile, kwaye ubungqina benkqubo bunokubaluleka ngaphezu kwemveliso ephezulu.

Imveliso exutywe kakhulu okanye ephantsi ukuya kwephakathi igxininisa kakhulu ekutshintsheni okulawulwayo, iindlela zokupheka ezininzi, iindlela zokufaka eziguquguqukayo kunye nokulandeleka. Izixhobo ezininzi zokuthatha izinto zingaba luncedo ngaphandle kokuqinisekisa ukuba kukho i-turret ekhethwayo.

Imveliso ephezulu ingatshintsha ingqalelo iye ekuhambeni kwezinto okuzinzileyo, ukulibaziseka okufutshane kokutshintsha izixhobo, ukuphathwa kwe-intanethi okanye ikhasethi kunye nokulungelelaniswa nezixhobo ezingqongileyo. I-turret ekhethiweyo inokuba negalelo apho utshintsho lwezixhobo luyinxalenye ebalulekileyo yomjikelo.

Umthamo wodwa awuchazi ulungelelwaniso lomatshini. Umxube wemveliso, ubude bokubopha, ukunyanga, ukuhlolwa, ukubonakaliswa kwecandelo kunye neemfuno zokudibanisa zinokuba nefuthe elifanayo, ngoko ke ukuphunyezwa kwayo akunantsingiselo ingako ngaphandle kwenkcazo epheleleyo yenkqubo.

Qinisekisa uQwalaselo oluCetywayo Ngaphambi kokukhetha

Ngaphambi kokuba umatshini ukhethwe okanye ucatshulwe, thelekisa iprojekthi neemodyuli zokufaka ezifakiweyo, izixhobo zokucubungula i-wafer, iibhanki zezixhobo okanye i-turret, izixhobo zokuqokelela kunye nokubopha, indawo yokujonga kunye neemodyuli zenkqubo.

Olu phononongo lufanele lugubungele ukufudumeza, ukukhupha, ukustampa, izixhobo ze-UV, imisebenzi ye-flip-chip, isoftware, iilayisensi, iindlela zokupheka, imo yokuphatha i-substrate, ukulandeleka kunye nokudibanisa imveliso. Inkxaso yeqonga inciphisa indlela; irekhodi lezixhobo limisela oko kukhoyo.

Isampulu emeleyo okanye uvavanyo lwenkqubo lunokuba luncedo xa kukho izixhobo ezifanelekileyo, izixhobo, ukufikelela kumatshini kunye nemigaqo yokwamkelwa. Uvavanyo olunjalo lungabonisa ukuba ilungiselelo elicetywayo lifanelwe ngumsebenzi wobunjineli onzulu na, kodwa ukwenzeka kwalo kufuneka kuqale kumiselwe kulwazi lweprojekthi kunye noomatshini.

Ukuqala iUqwalaselo lwe-MRSI-705uphononongo, nxibelelana neqela lobuchwephesha nge-imeyile okanye nge-WhatsApp malunga nobukhulu becandelo, izinto ezisetyenzisiweyo, ifomathi yokufaka, isiseko, indlela yokubopha, imfuneko yokuchaneka, iimfuno zezixhobo, ubungakanani bemveliso kunye neemfuno zokuhlola okanye zokudibanisa.

Ulwazi lwe-wafer, imizobo, iifoto zecandelo, iifayile ze-substrate, imifanekiso yezixhobo kunye namaxwebhu enkqubo zinokuqhotyoshelwa emva kokuba incoko ivuliwe. Ukuhambelana, ukwenzeka kokuguqulwa, ububanzi bovavanyo, ukuveliswa, ixabiso kunye nokuhanjiswa kufuneka kulandele uphononongo lobuchwephesha.

Imibuzo Ebuzwa Rhoqo Malunga Noqwalaselo lwe-MRSI-705

Loluphi ulwazi olufunekayo ukuze kumiselwe i-MRSI-705?

Qala ngemilinganiselo yecandelo, ubukhulu kunye nezinto, ifomathi yokufaka, isiseko, izinto zokubopha, indlela yokubopha, imfuneko yokuchaneka, izixhobo, iimfuno zokuhlola, umxube wemveliso kunye nomthamo wemveliso olindelekileyo.

Zeziphi iifomathi zokufaka izinto ezisetyenziswa yi-MRSI-705?

Ulwazi olusemthethweni lweqonga luquka i-wafer, i-waffle-pack, i-Gel-Pak kunye nemiyalelo yokufaka iteyiphu. Isixhobo sokutya, inkxaso, ukukhomba kunye nezixhobo zokuthathwa ezifunekayo kwiprojekthi kufuneka zijongwe ngokuthelekisa noqwalaselo olucetywayo.

Ngaba i-MRSI-705 pick ingafa ngqo kwi-wafer?

Ukulandwa kwe-wafer ngqo kunokulungiswa xa inkxaso efanelekileyo ye-wafer, izixhobo ze-ejector, izixhobo zokulanda kunye nemephu ehambelanayo okanye imisebenzi yokukhetha i-inki-dot iyafumaneka.

Yintoni umahluko phakathi kokusasazwa kwe-epoxy kunye nokunyatheliswa kwe-epoxy?

Ukusasaza izinto kuhambisa izinto ngempompo kunye nomlomo, ngelixa ukunyathela kuzidlulisela ngesixhobo esikhethekileyo. Indlela efanelekileyo ilandela izinto, i-geometry yediphozithi, ulawulo lwenkqubo kunye neemfuno zemveliso.

Yintoni efunekayo ukuze kuhlanganiswe ii-flip-chip?

Uqwalaselo lwe-flip-chip lunokubandakanya izixhobo zokujolisa kwi-die-orientation, umbono osezantsi, izixhobo ezifanelekileyo, ulungelelwaniso lwe-substrate, iindlela zokupheka zesoftware kunye nokukhuselwa komphezulu we-die osebenzayo.

Ingaba i-turret enezixhobo ezili-12 isemgangathweni kwi-MRSI-705?

Hayi. Lulungiselelo olunomthamo ophezulu olunokukhethwa. Ixabiso lalo lixhomekeke kwinani lezixhobo, ulandelelwano lwenkqubo, ipateni yokutshintsha kunye neminye imida yomjikelo.

Isiphelo:Uqwalaselo lwe-MRSI-705 luqala ngemveliso kunye nenkqubo endaweni yenani leendlela ezikhoyo. Ukufakwa kwecandelo, ukuphathwa kwe-wafer kunye nokuhamba kwe-substrate kufuneka kucwangciswe ngokwahlukeneyo, ngelixa indlela nganye yokubopha izisa iimfuno zayo zezinto, izixhobo kunye nolawulo. Amandla, ukuphakama, ukuhambelana kunye nokulungelelaniswa kufuneka kuthathwe njengengxaki enye yokulawula inkqubo, kwaye izixhobo, isoftware kunye nendlela yokuvelisa kufuneka ilandele umxube wemveliso wokwenyani. Umatshini okhethwe kakhulu awulungelanga ngokuzenzekelayo; ukufaneleka kokugqibela kuxhomekeke ekuthelekiseni iprojekthi yokudibanisa yokwenyani kunye noqwalaselo lomatshini olucetywayo.