BESI Datacon 2200 EVO die bonding machine

 The BESI Datacon 2200EVO is a fully automated, ultra-high-precision, multifunctional die-bonding system used in the semiconductor back-end packaging process. Its core task is no longer dicing, but "bonding."

Its main functions include:

Die Bonding (Die Attach): Picks individual diced dies from the wafer frame and precisely places them onto a substrate, leadframe, or another die.

Surface Mount (SMT): In addition to bare dies, it can also bond packaged components, but this is not its primary function.

Multiple Process Applications: It not only performs traditional die bonding (using adhesives such as epoxy resin) but also a variety of advanced packaging processes.

Simply put, it's an assembly robot responsible for the delicate micromanipulation of semiconductor fabs, achieving micron-level accuracy.

II. Core Technologies, Features, and the Meaning of "EVO"

"EVO" typically stands for "Evolution," signifying that this generation of platforms offers significant improvements in speed, accuracy, and flexibility compared to previous generations.

1. Ultra-High Precision & Flexibility

Accuracy: Placement accuracy typically reaches ±15 μm @ 3σ or better. This is crucial for placing increasingly smaller chips with finer pin pitches.

Versatile Platform: The 2200EVO is a modular platform that can adapt to a wide range of applications, from traditional die placement to the most complex flip-chip processes, by replacing different placement heads and configurations.

2. Advanced Placement Technology

Thermocompression Bonding (TC): This is one of its core advanced technologies. During the placement process, heat and pressure are simultaneously applied to the chip, creating a reliable electrical and mechanical connection between the chip's bumps and the substrate's pads. This is widely used in flip-chip processes, especially in high-density, 3D packaging.

Laser-Assisted Bonding (LAB): Using a laser as a highly localized heat source for heating, it achieves faster ramp rates and reduces thermal stress, making it ideal for temperature-sensitive, ultra-thin chips or components.

Mass Reflow: The chips are placed first and then soldered in a reflow oven.

3. Powerful Vision and Alignment System

Multi-Camera System: Equipped with a high-resolution upward-looking camera (for detecting the location of pads on the substrate) and a downward-looking camera (integrated in the placement head for detecting the location of bumps on the chip).

Real-Time Image Processing: Using sophisticated algorithms, the system calculates the deviation (X, Y, and θ) between the chip bumps and the substrate pads in real time and compensates for it before placement, ensuring perfect alignment.

Flip Chip Alignment: Its vision system can see through the die (for certain materials) and directly view the bump array on the bottom, which is key to achieving high-precision flip chip placement.

4. Modularity and Configurability

Users can choose the following based on production needs:

Different Placement Heads: Dedicated placement heads for different sizes and processes (such as TC and LAB).

Feeding System: Supports wafer-on-frame loading and various types of substrate transport systems (rails, worktables, etc.).

Dispensing System (Optional): Integrated precision dispensing valves enable precise application of flux or underfill to substrates prior to placement.

5. Productivity and Reliability

High Throughput: Optimized motion control and high-speed placement heads achieve high production cycles (UPH) while maintaining ultra-high precision.

High Reliability (Uptime): Designed for the harsh environments of 24/7 continuous industrial production, it offers high mean time between failures (MTBF) and low mean time to repair (MTTR).

III. Typical Applications

The BESI Datacon 2200EVO is primarily used in high-end and advanced packaging applications:

Flip Chip: This is its most classic application, widely used in the packaging of chips such as CPUs, GPUs, and high-end ASICs.

2.5D/3D Integrated Packaging: Used for attaching chips to silicon interposers or performing chip-on-chip stacking.

Heterogeneous Integration: Integrates chips with different process nodes and functions (such as logic chips, memory chips, and RF chips) into a single package.

Sensor Packaging: Used for precision assembly of products such as CIS (image sensors) and MEMS sensors.

Optoelectronics Packaging: Applications such as the assembly of lasers and optical modules.

IV. Market Position and Summary

BESI Datacon is a global leader in flip chip and advanced die attach technology.

Technology Leadership: BESI Datacon holds strong technical advantages and market share, particularly in advanced processes such as thermocompression bonding (TCB) and laser-assisted bonding (LAB).

Targeting the High-End: The 2200EVO platform targets high-end applications requiring the highest precision, reliability, and process capabilities, competing with companies such as ASM Pacific Technology.

Driving Innovation: Its equipment is an essential manufacturing tool for many advanced packaging architectures, such as 2.5D/3D ICs.

In summary, the BESI Datacon 2200EVO is a fully automated die attach system for advanced semiconductor packaging, featuring ultra-high precision and advanced process capabilities, particularly thermocompression bonding. It represents the current state-of-the-art in die attach technology and is a core component of manufacturing products such as high-end processors, artificial intelligence chips, and high-speed communication chips.