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ASM Wire Bonder AB550 is a high performance ultrasonic wire bonder with many advanced functions and features
ASM Eagle Aero Reel to Reel is a high-performance wire bonding machine designed for semiconductor packaging and testing production
Features●Micro-pitch wire bonding capability, specialized in advanced packaging products●High-precision rotary welding head design●Zhuanli "PR on the Fly" function●Extremely large effective ...
Features●30% UPH improvement●Application based on typical copper wire●22μm solder ball●Expert skills, solder ball can be as small as 22μm in the case of 0.5mil line●High-end application of ultra-fine ...
Features● High-speed wire bonding capability● 1588 (128 lines) hourly capacity: 21,500+ lines● Double eight-shaped digital tube (16 lines): 14,500+ lines● Equipped with 4" diameter wire range to ...
Features●LED-specific high-speed wire bonding system●New hardware architecture, easy to maintain●High resolution of welding head, accuracy can reach 40nm●Innovative EFO cabinet adopts segmented spark ...
FeaturesExcellent performance●UPH increased by up to 30%●In traditional copper wire applications●Ball size up to 22 μm●Professional engineering design reduces ball diameter to 22 μm at 0.5mil wire dia...
KS MAXUM PLUS wire bonding machine is a fully automatic wire bonding machine, mainly used for internal lead welding of light-emitting diodes, small and medium-sized power transistors, integrated cir...
KS Wire Bonder 8028PPS is a fully automatic wire bonding machine, mainly used in the field of LED packaging equipment. It has the characteristics of high power and can handle high power 1W, 3W integr...
KAIJO-FB900 is a fully automatic gold wire bonding machine, mainly used for gold wire bonding in the LED packaging production process
ASM Wire Bonder AB550 is a high performance ultrasonic wire bonder with many advanced functions and features
ASM Eagle Aero Reel to Reel is a high-performance wire bonding machine designed for semiconductor packaging and testing production
Features●Micro-pitch wire bonding capability, specialized in advanced packaging products●High-precision rotary welding head design●Zhuanli "PR on the Fly" function●Extremely large effective wire bonding range●Supports diversified fixture design
Features●30% UPH improvement●Application based on typical copper wire●22μm solder ball●Expert skills, solder ball can be as small as 22μm in the case of 0.5mil line●High-end application of ultra-fine 30μm solder jointsOther configurations to adapt to the
Features● High-speed wire bonding capability● 1588 (128 lines) hourly capacity: 21,500+ lines● Double eight-shaped digital tube (16 lines): 14,500+ lines● Equipped with 4" diameter wire range to save loading and unloading time● Micro-pad handling cap
Our clients are all from large publicly listed companies.
SMT Technical Articles
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Wire bonding equipment FAQ
MORE+Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
Why do regular maintenance on Fuji smt mounters? In fact, many people ignore this point. In the mode
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
In today’s fast-paced world of electronics manufacturing, staying ahead of the competition requires
Why do so many people choose to work with GeekValue?
Our brand is spreading from city to city, and countless people have asked me, "What is GeekValue?" It stems from a simple vision: to empower Chinese innovation with cutting-edge technology. This is a brand spirit of continuous improvement, hidden in our relentless pursuit of detail and the delight of exceeding expectations with every delivery. This almost obsessive craftsmanship and dedication is not only the persistence of our founders, but also the essence and warmth of our brand. We hope you will start here and give us an opportunity to create perfection. Let us work together to create the next "zero defect" miracle.
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