K&S ICONN PLUS wire bonding machine

The K&S IConn PLUS is a widely recognized, fully automatic, mid-to-high-end wire bonder in the semiconductor packaging industry. Renowned for its mature, stable technology and exceptional performance, it serves as a reliable bridge between established processes and emerging requirements, making it a practical choice for both R&D and small-batch production.

Core Technology: Precision Engineering and Innovative Design

The IConn PLUS utilizes thermosonic bonding technology—combining ultrasonic energy, heat, and pressure—to establish electrical connections between the chip and the lead frame via a ceramic capillary. Its superior performance stems from the following key design features:

Dual-frequency Transducer: Enables the flexible selection of two frequencies for each bond point, allowing for precise control over bonding energy and optimizing processes for material-sensitive bonds.

Power Series Advanced Loops: Achieves low-profile loops through precise control of the "final kink" point; the low-loop mode can reduce forward loop height to below 40 μm (using 0.6 mil wire).

WAVI (Wide Angle Vertical Illumination): Employs a programmable red/blue LED lighting system to significantly enhance image recognition capabilities across substrates of varying materials and colors.

1pF Auto-BITS (Auto-Bond Integrity Test System): An intelligent post-bond inspection system with 1pF precision that automatically learns and optimizes bonding parameters to ensure process quality. Key Specifications at a Glance

Category Item Detailed Specifications

Core Performance Placement Accuracy ±2.0 μm @ 3 sigma

Minimum Loop Height As low as 40 μm (using 0.6 mil gold wire)

Minimum Pad Pitch Supports 35 μm ultra-fine pitch

Mechanical Dimensions Machine Dimensions (W×D×H) 889mm × 1009mm × approx. 1600mm (excluding signal tower)

Machine Weight Approx. 590 kg

Electrical Specifications Voltage Single-phase 200–240 VAC or 100–115 VAC @ 50/60 Hz

Power Rated: 1.5 kVA; Peak: 2.6 kVA

Air Supply Requirements Compressed Dry Air (CDA) Pressure: 0.45–0.6 MPa; Flow rate: approx. 185 L/min

Nitrogen-Hydrogen Mix Pressure: 0.3–0.5 MPa; Flow rate: 0.6–1.5 L/min

Bonding Capabilities Gold Wire Diameter 0.6 – 2.0 mil (approx. 15.2 – 50.8 μm)

Copper Wire Diameter 0.7 – 1.0 mil (approx. 17.8 – 25.4 μm)

Max. Wire Length 7.6 mm (using 1.0 mil wire)

Bonding Area X-axis: 56 mm; Y-axis: 80 mm; expanded area available via LA/ELA versions

Changeover & Programming Same-frame changeover < 4 minutes

Different-frame changeover < 8 minutes

Core Application Areas

LED Packaging: Mass bonding of LED chips; compatible with various SMD leadframes.

Memory Manufacturing: Suitable for multi-chip stacking and ultra-low loop profile memory device packaging.

Integrated Circuits (IC): Gold/copper wire bonding for optical communication ICs, power devices, and sensors.

Advanced Packaging: Compatible with SiP, QFN, BGA, and other package types as well as complex substrates.

Core Features and Market Value

The advantage of the IConn PLUS lies in its precise positioning within the "mature" and "reliable" market segment. **Proven Stability:** As a model long-validated by the market, it boasts system stability and a low failure rate. Particularly in the Chinese market—where it served as an early workhorse—there is a vast pool of technical engineers and abundant talent support.

**Efficiency Offsets Speed:** While its UPH (units per hour) falls short of the latest flagship models, its exceptional changeover efficiency—under 4 minutes for the same lead frame and under 8 minutes for different ones—effectively compensates for the slight speed gap, resulting in outstanding overall efficiency.

**Technical Capability & Cost-Effectiveness:** Features such as support for copper/silver wire bonding and 35μm ultra-fine pitch capabilities allow it to meet mid-to-high-end production needs, while its price point on the secondary market is a major highlight. For instance, a 2016-model K&S ICONN PLUS is listed on secondary market platforms for approximately $49,000 (actual transaction prices vary based on configuration and condition).

**Market Status & Procurement Advice**

**Market Positioning:** Within the K&S product lineup, the IConn PLUS is positioned as a mid-to-high-end mass production workhorse—a "proven performer" bridging mature processes and cutting-edge challenges. Compared to new flagship models, its second-hand price is far more attractive.

**Selection Comparison:** If higher throughput and large-substrate capabilities are required, its successor, the RAPID Pro ELA, is the better choice (offering a 90mm Y-axis travel range and more efficient intelligent algorithms). However, for cost-sensitive projects, the IConn PLUS is undoubtedly a highly cost-effective option.

**Risk Warning:** When purchasing used equipment, it is crucial to verify the manufacturing year, total operating hours, and spindle condition, and to engage a professional third party for equipment inspection.

In summary, the IConn PLUS is a classic model that strikes an excellent balance between performance and cost. If you are seeking a reliable, technologically mature, and cost-controlled workhorse for your production line, it remains a choice well worth considering.