I-K&S IConn PLUS yi-wire bonder eyaziwayo, ezenzekelayo ngokupheleleyo, ephakathi ukuya kwephezulu kushishino lokupakisha lwe-semiconductor. Idume ngobuchwepheshe bayo obuvuthiweyo nobuzinzileyo kunye nokusebenza kwayo okugqwesileyo, isebenza njengebhulorho ethembekileyo phakathi kweenkqubo ezimiselweyo kunye neemfuno ezivelayo, okwenza ukuba ibe lukhetho olusebenzayo kwi-R&D nakwimveliso encinci.
Itekhnoloji ePhambili: Ubunjineli obuchanekileyo kunye noYilo oluNtsha
I-IConn PLUS isebenzisa itekhnoloji yokubopha i-thermosonic—idibanisa amandla e-ultrasonic, ubushushu, kunye noxinzelelo—ukuseka unxibelelwano lombane phakathi kwe-chip kunye nesakhelo se-lead nge-capillary ye-ceramic. Ukusebenza kwayo okuphezulu kuvela kwiimpawu zoyilo ezilandelayo:
I-Dual-frequency Transducer: Ivumela ukhetho oluguquguqukayo lweefrikhwensi ezimbini kwindawo nganye yebhondi, ivumela ulawulo oluchanekileyo kumandla ebhondi kunye neenkqubo zokuphucula iibhondi ezinobuthathaka kwizinto eziphathekayo.
IiLoops eziPhambili zePower Series: Zifikelela kwiiloops ezisezantsi ngokulawula ngokuchanekileyo indawo "yokugqibela yekink"; imo yeloop esezantsi inokunciphisa ubude beloop yangaphambili ukuya ngaphantsi kwe-40 μm (kusetyenziswa ucingo lwe-0.6 mil).
I-WAVI (I-Wide Angle Vertical Illumination): Isebenzisa inkqubo yokukhanyisa ye-LED ebomvu/eluhlaza okwesibhakabhaka ecwangcisiweyo ukuphucula kakhulu amandla okubona imifanekiso kuzo zonke izinto ezahlukeneyo kunye nemibala.
I-1pF Auto-BITS (Inkqubo yoVavanyo loBulungisa be-Auto-Bond): Inkqubo yohlolo olukrelekrele lwe-post-bond enobunono be-1pF efunda ngokuzenzekelayo kwaye ilungise iiparameter zokubopha ukuqinisekisa umgangatho wenkqubo. Iinkcukacha eziphambili ngokujonga nje
Udidi Into Iinkcukacha ezineenkcukacha
Ukusebenza okuPhambili Ukuchaneka kokubekwa ±2.0 μm @ 3 sigma
Ubude obuphantsi beLuphu Ingaphantsi kwe-40 μm (kusetyenziswa ucingo lwegolide oluyi-0.6 mil)
Ubuncinci bePad Pitch Ixhasa i-35 μm i-ultra-fine pitch
Ubukhulu boomatshini Ubukhulu bomatshini (W×D×H) 889mm × 1009mm × malunga ne-1600mm (ngaphandle kwenqaba yesignali)
Ubunzima bomatshini Malunga ne-590 kg
Iinkcukacha zoMbane I-Voltage I-VAC yesigaba esinye engama-200–240 okanye i-VAC eyi-100–115 kwi-50/60 Hz
Amandla Ilinganiswe: 1.5 kVA; Incochoyi: 2.6 kVA
Iimfuneko zoMbane woMoya Umoya Owomileyo Ocinezelweyo (i-CDA) Uxinzelelo: 0.45–0.6 MPa; Isantya sokuhamba: malunga ne-185 L/min
Umxube weNitrogen-Hydrogen Uxinzelelo: 0.3–0.5 MPa; Isantya sokuhamba: 0.6–1.5 L/min
Amandla okubopha Ububanzi beNtambo yeGolide 0.6 – 2.0 mil (malunga ne-15.2 – 50.8 μm)
Ububanzi bentambo yobhedu 0.7 – 1.0 mil (malunga ne-17.8 – 25.4 μm)
Ubude beNtambo obuphezulu 7.6 mm (kusetyenziswa ucingo lwe-1.0 mil)
Indawo yokudibanisa I-X-axis: 56 mm; I-Y-axis: 80 mm; indawo eyandisiweyo ifumaneka ngeenguqulelo ze-LA/ELA
Utshintsho kunye nokuCwangcisa Ukutshintshwa kwefreyimu efanayo < imizuzu emi-4
Utshintsho lwesakhelo esahlukileyo < imizuzu esi-8
Iindawo eziPhambili zoSetyenziso
Ukupakisha kwe-LED: Ukubopha okukhulu kweetships ze-LED; kuhambelana neefreyimu ezahlukeneyo ze-SMD.
Ukwenziwa kweeMemori: Ifanelekile ukupakisha ii-chip ezininzi kunye nokupakisha izixhobo zememori zeprofayili ye-ultra-low loop.
Iisekethe eziDibeneyo (IC): Intambo yegolide/yobhedu ebotshelelwe kwii-IC zonxibelelwano lwe-optical, izixhobo zamandla, kunye neesensa.
Ukupakisha Okuphambili: Kuhambelana neSiP, QFN, BGA, kunye nezinye iintlobo zeepakeji kunye nee-substrates ezintsonkothileyo.
Iimpawu eziPhambili kunye neXabiso leMarike
Inzuzo ye-ICOnn PLUS ikwindawo yayo echanekileyo kwicandelo lemarike "elivuthiweyo" nelithembekileyo". **Uzinzo oluqinisekisiweyo:** Njengomzekelo osele uqinisekiswe yimarike, inesiseko esizinzileyo senkqubo kunye nesantya esiphantsi sokusilela. Ingakumbi kwimarike yaseTshayina—apho yayisebenza khona njengehashe lokuqala—kukho iqela elikhulu leenjineli zobugcisa kunye nenkxaso eninzi yetalente.
**Isantya sokuSebenza kakuhle:** Nangona i-UPH yayo (iiyunithi ngeyure) ingafikeleli kwiimodeli zamva nje eziphambili, ukusebenza kwayo okugqwesileyo kokutshintsha-ngaphantsi kwemizuzu emi-4 kwisakhelo esifanayo sokukhokela kunye nangaphantsi kwemizuzu esi-8 kwezahlukeneyo- kulungisa ngokufanelekileyo umsantsa omncinci wesantya, nto leyo ekhokelela ekusebenzeni kakuhle okubalaseleyo.
**Ubuchule bobuchwephesha kunye nokusebenza kakuhle kweendleko:** Iimpawu ezifana nokuxhasa ukubopha ucingo lwekopolo/isilivere kunye nobuchule bepitch obuyi-35μm obuyi-ultra-fine buyivumela ukuba ihlangabezane neemfuno zemveliso eziphakathi ukuya kweziphezulu, ngelixa ixabiso layo kwimarike yesibini liyinto ephambili. Umzekelo, i-K&S ICONN PLUS yohlobo luka-2016 idweliswe kumaqonga emarike yesibini malunga ne-$49,000 (amaxabiso okwenyani entengiselwano ayahluka ngokusekelwe kulwakhiwo kunye nemeko).
**Imeko yeMarike kunye neengcebiso zokuthenga**
**Ukubekwa Kwemarike:** Kuluhlu lweemveliso ze-K&S, i-IConn PLUS ibekwe njengomsebenzi osebenzayo phakathi ukuya kwizinga eliphezulu—"umdlali onamava" ohlanganisa iinkqubo ezivuthiweyo kunye nemingeni ephambili. Xa kuthelekiswa neemodeli ezintsha eziphambili, ixabiso layo elisetyenzisiweyo linomtsalane ngakumbi.
**Uthelekiso loKhetho:** Ukuba kufuneka amandla aphezulu okukhupha kunye nobuchule be-substrate enkulu, indawo yayo elandelayo, i-RAPID Pro ELA, lolona khetho lungcono (olubonelela ngoluhlu lokuhamba lwe-90mm Y-axis kunye ne-algorithms ekrelekrele esebenza ngcono). Nangona kunjalo, kwiiprojekthi ezinomngcipheko weendleko, i-IConn PLUS ngokungathandabuzekiyo lukhetho olungabizi kakhulu.
**Isilumkiso soMngcipheko:** Xa uthenga izixhobo ezisetyenzisiweyo, kubalulekile ukuqinisekisa unyaka wokwenziwa kwazo, iiyure zokusebenza zizonke, kunye nemeko ye-spindle, kunye nokuqesha umntu wesithathu oqeqeshiweyo ukuze ahlole izixhobo.
Ngamafutshane, i-IConn PLUS yimodeli yakudala elungelelanise kakuhle ukusebenza kunye neendleko. Ukuba ufuna ihashe elisebenzayo elithembekileyo, elivuthiweyo kwezobuchwepheshe, nelilawula iindleko kumgca wakho wemveliso, lihlala lilukhetho olufanelekileyo ukuqwalaselwa.













