KAIJO FB-e20N Wire Bonder

I-High-Speed ​​​​Automatic Thermosonic Wire Bonder yeSemiconductor kunye ne-LED Packaging

I-KAIJO FB-e20N ngumatshini wokubopha ibhola we-thermosonic ozenzekelayo ngokupheleleyo kunye nomatshini wokubopha we-wedge owenzelwe ukupakisha kwe-semiconductor ekhawulezayo kunye nokusetyenziswa kwe-wire bonding echanekileyo. Yakhelwe iimeko ezimfutshane, ezinoxinano olukhulu, kunye nemveliso yobuninzi, i-FB-e20N inika uzinzo olubalaseleyo lwe-bonding, amaxesha omjikelo akhawulezayo kakhulu, kunye nokusebenza kakuhle kwemveliso.

Oku kuqhubele phambiliibhondi yentamboixhasa usetyenziso lwentambo yegolide, ucingo lwekopolo, kunye nocingo lwesilivere oluxutyiweyo, okwenza ukuba ilungele ukupakisha i-LED, izixhobo ze-semiconductor, ii-IC zabathengi, kunye nokuveliswa kwezinto ze-elektroniki.

Izinto ezilungileyo ezingundoqo ze-KAIJO FB-e20N

Ukusebenza kokubopha ngesantya esiphezulu kakhulu

I-FB-e20N ifezekisa oku:

• Isantya sokubopha ucingo se-0.043 sec/wire

• Ukuya kuthi ga kwi-1395 iingcingo ngomzuzu

• Ukusebenza kokubopha okufutshane okuzinzileyo

• Ukusebenza kakuhle kwemveliso yokuvelisa ngobuninzi

Ifanelekile kwi:

• Ukupakishwa kwe-COB LED

• Imveliso ye-LED encinci

• Izixhobo ze-semiconductor ezizimeleyo

• Ii-IC ze-elektroniki zabathengi

• Ukupakishwa kweSensor kunye nePMIC

Ubuchwepheshe obuPhambili bokudibanisa iThermosonic

Lo matshini usebenzisa iteknoloji yokubopha ye-thermo-ultrasonic, edibanisa:

• Ubushushu obulawulwayo

• Ukungcangcazela kwe-ultrasonic

• Uxinzelelo lokubopha ngokuchanekileyo

Le nkqubo idala ukubopha okuzinzileyo kweathomu phakathi kocingo lokubopha kunye nomphezulu wephedi ngelixa kunciphisa umonakalo wephedi kwaye kuphucula ukuthembeka kwexesha elide.

Izixhobo zentambo ezixhaswayo:

• Ucingo lweGolide (Φ15–30μm)

• Ucingo lweCopper (Φ20–30μm)

• Ucingo lweSilivere lweAlloy (Uyazikhethela)

INkqubo yoLungelelwaniso loMbono oluchanekileyo

Itekhnoloji yoMbono oBukrelekrele we-α-Eye

I-FB-e20N inenkqubo yokubona ye-α-Eye ephucukileyo ye-KAIJO ene:

• Ukuqatshelwa kwephedi ngexesha langempela

• Ukulungiswa kwe-offset ngokuzenzekelayo

• Imbuyekezo yokujikeleza

• Ubuchule bokulungelelanisa iiphedi ezixineneyo

• Ukucutshungulwa kwemifanekiso ngesantya esiphezulu

Ukusebenza ngokuchanekileyo

• Ukuphinda-phinda: ±2.0μm (3σ)

• Ukuchaneka kokuqaphela: ± 1μm

• Ubuncinci besithuba sephedi: 35μm

Le nkqubo iqinisekisa ukubopha okuzinzileyo nokuchanekileyo nokuba kusetyenziswe i-semiconductor ye-fine-pitch.

Iimpawu eziPhambili

Inkqubo ye-Ultrasonic ephindaphindwa kabini

Inkqubo yokubopha ye-ultrasonic ephindaphindwa kabini iyaziqhelanisa ngokuzenzekelayo nezixhobo ezahlukeneyo zentambo kunye neemeko zokubopha.

Iingenelo ziquka:

• Ukubopha ucingo lwegolide oluzinzileyo

• Ukuthembeka kokubopha ucingo lwekopolo okuphuculweyo

• Umngcipheko wokonakala kwephedi oncitshisiweyo

• Ukuzinza okungcono kwe-short-loop

• Uzinzo oluphezulu lokubopha

Ithala leeNcwadi leNkqubo eNgqondileyo

Ilayibrari yenkqubo eyakhelwe ngaphakathi ixhasa ukuseta ngokukhawuleza kwe:

• Iiphakheji ze-LED

• Izixhobo ezingabonakaliyo

• Ii-IC ze-elektroniki zabathengi

• Izixhobo ze-semiconductor

Abaqhubi banokukhumbula ngokukhawuleza iiparameter zokubopha ezilungiselelweyo ukuze kukhawuleziswe utshintsho lwemveliso.

Ukusebenza ngokuzenzekelayo ngokupheleleyo

I-FB-e20N ixhasa:

• Ukulayisha nokukhulula izinto ngokuzenzekelayo

• Ukucofa ucingo ngokuzenzekelayo

• Ukucoca inaliti

• Ukucocwa kwe-capillary

• Ukubeka iliso ngexesha langempela

• Ukulandeleka kwemveliso

• Ukubeka iliso kunye nokuxilongwa kwe-alamu

Oku kunceda ukunciphisa ixesha lokungasebenzi kunye nokuphucula ukusebenza kakuhle kwemveliso.

IiNgcaciso zobuGcisa

Usetyenziso oluqhelekileyo

Ukupakishwa kwe-LED

• I-COB LED

• I-LED encinci

• I-LED yokuHamba kumphezulu

• Iimodyuli ze-LED ezinoxinano oluphezulu

Izixhobo zeSemiconductor

• IiMOSFET

• Iidiode

• Iitransista

• Izinzwa

• Ii-IC ze-Analog

• IiPMIC

I-Electronics yabathengi

I-FB-e20N isetyenziswa kakhulu kwimveliso ye-elektroniki yabathengi ebiza kakhulu efuna ukusebenza okuzinzileyo nokuthembekileyo kwe-wire bonding.

Ubuchule bokubopha obufutshane obuzinzileyo

Lo matshini wenzelwe ukusetyenziswa kwezicelo zokubopha ezifutshane nge:

• Ulawulo oluchanekileyo lwemilo ye-arc

• Amandla e-ultrasonic ahlengahlengiswayo

• Ulawulo loxinzelelo oluhlukaniswe ngokwezigaba

• Ukuqina kweluphu yentambo ezinzileyo

• Umngcipheko wokukhukulwa kweengcingo oncitshisiweyo

Oku kuyenza ilungele ukupakisha ii-semiconductor ezincinci kunye noyilo lwe-dense interconnect.

Ukuzenzekelayo kweMveliso okuThembekileyo

I-FB-e20N inceda abavelisi ukuphucula imveliso ngoku:

• Amaxesha okujikeleza akhawulezayo

• Amanani aphantsi eziphene

• Umgangatho wokubopha ozinzileyo

• Umthwalo womsebenzi ophantsi wabaqhubi

• Ukubeka esweni inkqubo ekrelekrele

Iimpawu zayo zokwenza izinto ngokuzenzekelayo ziyenza ifaneleke kwiindawo eziqhubekayo zokuvelisa ngobuninzi.

Imibuzo ebuzwa rhoqo ngomatshini wokudibanisa iingcingo weKAIJO

1. Zeziphi izinto zocingo ezinokuxhaswa yi-FB-e20N?

   Lo matshini uxhasa ucingo lwegolide, ucingo lwekopolo, kunye nezinye izinto ezingasetyenziswayo kwiintambo zesilivere.

2. Ngawaphi amashishini adla ngokusebenzisa i-FB-e20N?

   I-FB-e20N isetyenziswa kakhulu ekupakisheni ii-LED, ukuvelisa ii-semiconductor, izixhobo ze-elektroniki zabathengi, ukuvelisa iisensor, kunye nokudibanisa izixhobo ezizimeleyo.

3. Ithini indlela echanekileyo ngayo i-bonding yomatshini?

   Lo matshini unika ukuchaneka kokuqaphela umbono okufika kwi-±2.0μm (3σ).

4. Ngaba i-FB-e20N ifanelekile kwi-short-loop bonding?

   Ewe. Lo matshini wenzelwe ngokukodwa ukusetyenziswa kweentambo ezimfutshane nezixineneyo.

5. Ngaba umatshini uyawuxhasa umsebenzi ozenzekelayo?

   Ewe. Ixhasa ukulayisha/ukukhulula izinto ngokuzenzekelayo, ukufaka imisonto ngokuzenzekelayo, imisebenzi yokucoca, kunye nokubeka esweni imveliso ngobuchule.

6. Ziziphi iingenelo eziphambili zenkqubo ye-dual-frequency ultrasonic?

   Inkqubo ye-dual-frequency iphucula uzinzo lwe-bonding, ixhasa izixhobo ezahlukeneyo zentambo, inciphisa umonakalo we-pad, kwaye iphucula ukuhambelana kwe-bonding.