KAIJO ngocingo umatshini polymerization FB-i28

I-KAIJO FB-i28 ngumatshini wokubopha intambo ye-ultrasonic osebenza ngesantya esiphakathi ukuya kwesiphezulu, ochanekileyo kakhulu, osebenza ngokuzenzekelayo kwihlabathi liphela, owenzelwe ngokukodwa ukupakisha okuxineneyo, okuncinci, kunye nobukhulu obuncinci ukuya kobuphakathi. Ilungelelanisa isantya, ukuchaneka, kunye neendleko, okwenza ukuba ibe yimodeli ephambili yemveliso enkulu kwi-elektroniki yabathengi, ii-IC ze-analog, ii-LED, kunye nezixhobo ezizimeleyo.

I. Ukubekwa Kwendawo kunye Nezicelo Eziphambili

Indawo: Umatshini wokubopha ibhola/wedge ozenzekelayo ngokupheleleyo, ukuchaneka okuphezulu, ukusebenza kakuhle kweendleko, imodeli yehlabathi jikelele ukusuka kwisantya esiphakathi ukuya kwisantya esiphezulu.

Izicelo eziqhelekileyo:

Izixhobo ze-elektroniki zabathengi: Ii-IC zefowuni/zethebhulethi, iitships zolawulo lwamandla (ii-PMIC), ii-sensors.

Ii-IC ze-Analog/Mixed-Signal: Ii-amplifiers ezisebenzayo, ii-ADC/DAC, ii-IC zomqhubi.

Ii-Optoelectronics: ii-LED, ii-laser diodes, izinto ze-optical module.

Izixhobo ezingabonakaliyo: iiMOSFET, iidiode, iitransistors, iitransistors ezineesignali ezincinci.

Iintambo ezihambelanayo: Ucingo lwegolide (Φ15–30μm), ucingo lobhedu (Φ20–30μm), ucingo lwesilivere oluxutyiweyo (ukhetho).

II. Iinkcukacha zeCore (Uqwalaselo oluPhambili luka-2026)

Indawo yokubopha ucingo: 56mm (X) × 88mm (Y)

Indawo Yokusebenza: 295mm × 100mm (ifanelekile kwiifreyimu/iisubstrate ezincinci neziphakathi)

Isantya sokuBopha ngeNtambo: 0.045 imizuzwana/umgca (imigca eli-1333/umzuzu)

Ukuphinda-phinda: ±2.0μm (3σ); Ubuncinci besithuba sephedi yi-35μm

Ubude boMgca/Ukuphakama kwe-Arc: Ubude bomgca obuphezulu yi-8mm; Ukuphakama kwe-Arc yi-0.5–5mm (iyalawuleka)

Indlela yokuWelda: Ukubopha ibhola nge-thermo-sonic/ukubopha i-wedge; i-ultrasonic ephindwe kabini (eqhelekileyo)

Ubukhulu bomzimba (W×D×H): 1065×1175×1725mm (2025mm kuquka nesibane se-alamu)

Ubunzima: Malunga ne-550kg

III. Ulwakhiwo kunye neeTekhnoloji eziphambili

1. Intloko yokuwelda ekhaphukhaphu enobunzima obuphezulu (indawo yokuthengisa ephambili)

Izinto ezidityanisiweyo i-Z-arm: Ukuqina okuphezulu + Ukungabi namandla okubamba okuphantsi, ucinezelo oluhle kakhulu lokungcangcazela, kunye nozinzo oluqinileyo kwizicelo zepitch encinci.

Uyilo loxinzelelo olunempembelelo ephantsi: Ukuchaneka kolawulo loxinzelelo lwe-Bonding ± 0.1N, uxinzelelo oluncinci lwe-welding ≤1.2N, lukhusela iitships ezincinci/ii-substrates ezibuthathaka.

I-resonator ye-ultrasonic yohlobo lwe-1701: Ukushukuma okuphantsi kobushushu, imveliso ezinzileyo, ehambelana neentambo ze-alloy zobhedu/zesilivere, kunye nemveliso ezinzileyo.

2. Inkqubo yokubona ngamehlo ye-α

I-algorithm yokuqaphela yesizukulwana esilandelayo: Umahluko ochasene nokukhanya, ukungcola, kunye nombala ochasene nombala; ukuchaneka kokuqaphela ±1μm; izinga lokuqaphela i-substrate eliphantsi ≥99.9%.

Ukufunda ngeetemplate ezininzi: Ixhasa iiphini ezixineneyo, iipadi ezimile ngendlela engaqhelekanga, kunye noyilo lwee-array; ilungisa ngokuzenzekelayo i-offset/rotation.

3. Ulandelelwano lweBond yeNyathelo (Umboniso weWelding weNyathelo ngeNyathelo)

Ukubona zonke iiparameter zenkqubo yokuwelda: Amandla e-ultrasonic, uxinzelelo, ixesha, kunye nobushushu ziyahlengahlengiswa ngokwamacandelo.

Ulawulo oluchanekileyo lobubanzi bebhola, ububanzi be-wedge, kunye nesimo se-wire arc, zilungele iimeko ze-fine-pitch (35μm) kunye ne-high-density.

4. Ukuzenzekelayo kunye noQhagamshelo

Ukulayisha nokukhulula izinto ngokuzenzekelayo ngokupheleleyo: Iibhini zezinto ezi-2–3 (ububanzi obuyi-30–115mm), ukuxovula izinto ngokuzenzekelayo, ukusula iinaliti, kunye nokucoca i-capillary.

Iimpawu ezisemgangathweni ze-Industry 4.0: I-SECS/GEM, i-KISS (iNkqubo yoLawulo lweZixhobo ze-KAIJO), ukujonga ngexesha langempela, ukulandelelwa, kunye nokuxilongwa okukude.

I-Windows 10 Touchscreen Interface: Isikrini esikhulu se-intshi ezili-15, ukusebenza okusekwe kwi-icon, ukufikelela kwiiparameter zokucofa kanye, izibalo ze-yield, kunye nee-alamu ezingaqhelekanga.

IV. Iingenelo zokuthelekisa (xa kuthelekiswa neFB-e20N / FB-x26)

Isantya: i28 (0.045s/umgca) ≈ e20N (0.043s/umgca) > x26 (0.045–0.055s/umgca)

Ukuchaneka: i28 (±2.0μm) > e20N (±3.0μm) ≈ x26 (±2.5μm)

Indawo yeSolder: i28 (56×88mm) < x26 (56×95mm) > e20N (56×80mm)

Ubude boMgca: i28 (8mm) = e20N (8mm) < x26 (12mm)

Ubunzima: i28 (550kg) < e20N / x26 (malunga ne-850kg) → Unyawo oluncinci, ukufakelwa okuguquguqukayo ngakumbi

Ixabiso: i28 Umlinganiselo ophezulu weendleko-ukusebenza, ofanelekileyo kwimveliso ephakathi, eyahlukeneyo.

V. Isishwankathelo kunye neengcebiso zokukhetha

Amaxabiso angundoqo: Ukuchaneka okuphezulu (±2μm), isantya esiphakathi ukuya phezulu, impembelelo ephantsi, ukusebenza ngexabiso eliphezulu, ukusombulula iindawo ezibuhlungu kwiphakheji ethambileyo/exineneyo, isivuno ≥99.5%.

Iingcebiso zokukhetha:

Izixhobo ze-elektroniki zabathengi, ii-analog ICs, ii-LED/izixhobo ezifihlakeleyo → FB-i28

Iphimbo elincinci (35μm), iifreyimu ezincinci ukuya kweziphakathi, imveliso yobunzima obuphakathi → FB-i28

Iingcingo zokubopha ezinkulu kakhulu/ezikude kakhulu (>8mm) → FB-x26

Imveliso yobunzima obufutshane obuhamba ngesantya esiphezulu (ii-LED/izixhobo ezifihlakeleyo) → FB-e20N