Ekyuma kya KAIJO ekikola polimeeri wa waya FB-i28

KAIJO FB-i28 ye kyuma kya sipiidi eya wakati okutuuka ku ya waggulu, ey’obutuufu obw’amaanyi, ekwata ku waya ez’ebbugumu mu ngeri ey’obwengula mu bujjuvu, okusinga ekoleddwa mu kupakinga kwa density enkulu, eddoboozi eddene, n’ery’obutono n’eza wakati. Ekola bbalansi wakati w’embiro, obutuufu, n’omuwendo, ekigifuula omusingi omukulu ogw’okufulumya ebintu mu bungi mu byuma ebikozesebwa, analog ICs, LEDs, n’ebyuma ebitali bimu.

I. Okuteeka mu kifo n’okukozesebwa okukulu

Positioning: Ekyuma ekikwata omupiira/wedge bonding mu bujjuvu otomatiki, precision ya waggulu, okukendeeza ku ssente nnyingi, medium-to-high-speed universal model.

Enkozesa eya bulijjo:

Ebyuma ebikozesebwa: IC z’amasimu/tabuleti, chips eziddukanya amaanyi (PMICs), sensa.

Analog/Mixed-Signal ICs: Amplifier ezikola, ADCs/DACs, IC za ddereeva.

Ebyuma ebikozesebwa mu kulaba: LEDs, laser diodes, ebitundu bya modulo y’amaaso.

Ebyuma ebitali bimu: MOSFETs, diodes, transistors, transistors ezirina obubonero obutono.

Waya ezikwatagana: Waya ya zaabu (Φ15–30μm), waya ya kikomo (Φ20–30μm), waya ya ffeeza eya aloy (eky’okwesalirawo).

II. Ebikwata ku Musingi (2026 Ensengeka Entongole)

Ekitundu ky’okusiba waya: 56mm (X) × 88mm (Y)

Ekifo we bakolera: 295mm × 100mm (kisaanira ku fuleemu/substrates entono n’eza wakati)

Sipiidi y’okusiba waya: sekondi 0.045/layini (layini 1333/eddakiika)

Okuddiŋŋana: ±2.0μm (3σ); Ebanga erisinga obutono mu paadi 35μm

Obuwanvu bwa layini/Obugulumivu bwa Arc: Obuwanvu bwa layini obusinga obunene 8mm; Obugulumivu bwa arc 0.5–5mm (bufugibwa)

Enkola y’okuweta: Thermo-sonic omupiira okusiba/wedge okusiba; Ultrasonic ya frequency bbiri (eya mutindo) .

Ebipimo by’omubiri (W×D×H): 1065×1175×1725mm (2025mm nga kw’otadde n’ettaala ya alamu)

Obuzito: Nga 550kg

III. Enzimba ne Tekinologiya Omukulu

1. High-rigidity lightweight omutwe gw’okuweta (ekifo ekikulu okutunda)

Composite material Z-arm: High rigidity + Low inertia, okunyigiriza okukankana okulungi ennyo, n’okutebenkera okw’amaanyi mu nkola za fine-pitch.

Enteekateeka ya puleesa y’okukuba entono: Obutuufu bw’okufuga puleesa y’okusiba ±0.1N, puleesa y’okuweta esinga obutono ≤1.2N, okukuuma ebitundu ebigonvu/ebitundu ebikutuka.

Ekika 1701 ultrasonic resonator: Low thermal drift, stable output, ekwatagana ne copper / ffeeza alloy waya, n'amakungula stable.

2. Enkola y’okulaba kw’amaaso (α-Eye Vision System).

Enkola y’okutegeera ey’omulembe oguddako: Anti-reflective, anti-dirt, and anti-color difference; obutuufu bw’okutegeera ±1μm; omuwendo gw’okutegeera substrate ogw’enjawulo entono ≥99.9%.

Okuyiga kwa template eziwera: Kuwagira ppini enzito, paadi ezitali za bulijjo, n’ensengeka z’ensengekera; atereeza offset/rotation mu ngeri ey’otoma.

3. Omutendera gwa Bond Sequence (Eddaala ku Mutendera Welding Visualization) .

Visualization of all welding process parameters: Amaanyi ga Ultrasonic, puleesa, obudde, n’ebbugumu bitereezebwa mu bitundu.

Okufuga okutuufu okwa dayamita y’omupiira, obugazi bwa wedge, n’enkula ya waya arc, esaanira enkola ya fine-pitch (35μm) ne high-density scenarios.

4. Otomatiki n’okuyunga

Okutikka n’okutikkula mu bujjuvu: ebibbo by’ebintu 2–3 (obugazi bwa mm 30–115), okuwuuta mu ngeri ey’otoma, okusiimuula empiso, n’okuyonja emisuwa.

Industry 4.0 Standard Features: SECS/GEM, KISS (KAIJO Equipment Management System), okulondoola mu kiseera ekituufu, okulondoola, n’okukebera okuva ewala.

Windows 10 Touchscreen Interface: screen ennene ya yinsi 15, ekola nga yeesigamiziddwa ku bifaananyi, okuyingira mu parameter nga onyiga omulundi gumu, ebibalo by’amakungula, ne alamu za anomaly.

IV. Okugeraageranya ebirungi (vs FB-e20N / FB-x26)

Sipiidi: i28 (0.045s/layini) ≈ e20N (0.043s/layini) > x26 (0.045–0.055s/layini)

Obutuufu: i28 (± 2.0μm) > e20N (± 3.0μm) ≈ x26 (± 2.5μm)

Ekitundu ky’okusonda: i28 (56×88mm) < x26 (56×95mm) > e20N (56×80mm)

Obuwanvu bwa layini: i28 (mm 8) = e20N (mm 8) < x26 (mm 12)

Obuzito: i28 (550kg) < e20N / x26 (approx. 850kg) → Ekigere ekitono, okuteekebwa mu nkola okukyukakyuka

Ebisale: i28 Omugerageranyo gw’omuwendo n’omutindo ogusinga obunene, ogusaanira okufulumya mu bitundu eby’omu makkati, eby’enjawulo.

V. Ebiteeso mu bufunze n’okulonda

Core Values: Obutuufu obw’amaanyi (±2μm), sipiidi eya wakati-wa waggulu, okukuba entono, omuwendo omunene-okukola, okugonjoola ensonga z’obulumi mu fine-pitch/high-density packaging, amakungula ≥99.5%.

Ebiteeso by’okulonda:

Ebyuma ebikozesebwa, analog ICs, LEDs/ebyuma ebitali bimu → FB-i28

Eddoboozi eddungi (35μm), fuleemu entono okutuuka ku za wakati, okufulumya mu bungi mu kibinja eky’omu makkati → FB-i28

Waya ezikwatagana eza sayizi/ebanga eddene ennyo (>8mm) → FB-x26

Ultra-high speed short-arc mass production (LEDs/ebyuma ebitali bimu) → FB-e20N