KAIJO FB-x26 ekiyungo kya waya

KAIJO FB-x26 ye kyuma ekigatta waya mu kitundu ekigazi, ekikola obulungi mu bujjuvu mu ngeri ey’otoma thermo-ultrasonic okuva mu KAIJO Japan. Okusinga ekoleddwa ku modulo ez’amaanyi amangi, ebyuma by’emmotoka, IC ennene, n’okukozesa waya ez’ewala. Ebirungi byayo ebikulu mulimu ekitundu ekinene ennyo ekya mmita 95 ekya Y-axis bonding area, omukono gwa Z ogw’obugumu obw’amaanyi, omutono, puleesa y’okukuba entono, n’okunyweza mu arc empanvu. Era esobola okuggibwa butereevu mu kyuma ekikuba wafer ekya FB-x26 BUMP, ekigifuula ekyuma ekikulu eky’amaanyi n’okupakinga eby’omulembe.

I. Okuteeka mu kifo n’okukozesebwa okukulu

Positioning: Fully automatic thermo-ultrasonic omupiira bonding / wedge bonding ekyuma, ekitundu ekigazi, empanvu-arc, high-precision eyeewaddeyo model.

Enkozesa eya bulijjo:

Semikondokita z’amaanyi: IGBTs, MOSFETs, modulo z’amaanyi ga SiC/GaN (ebikulembeze ebiwanvu, fuleemu ennene).

Ebyuma ebikozesebwa mu mmotoka: MCU z’emmotoka, IC eziddukanya amaanyi, amataala g’emmotoka/okupakinga sensa.

IC ennene: Memory, SoCs, ASICs ezirina omuwendo omunene (obugazi bwa fuleemu okutuuka ku mm 105).

Okupakinga okw’omulembe: Stud Bump, Multi-chip Stacking, Arc ey’ebanga eddene (okutuuka ku mm 12).

Waya ezikwatagana: Waya ya zaabu (Φ15–30μm), Waya ya kikomo (Φ20–30μm), Waya ya ffeeza eya aloy (eky’okwesalirawo).

II. Ebikwata ku Musingi (2026 Ensengeka Entongole)

Ekitundu ky’okusiba: mm 56 (X) × mm 95 (Y); Obugazi bwa fuleemu obusinga obunene 105mm.

Ekifo we bakolera: 295mm × 105mm (ku substrates ennene/trays).

Sipiidi y’okukwatagana: Eya bulijjo 0.045–0.055 sec/layini (1090–1333 layini/eddakiika).

Okuddiŋŋana: ±2.5μm (3σ); Ebanga erisinga obutono mu paadi 35μm.

Obuwanvu bwa layini/Obugulumivu bwa Arc: Obuwanvu bwa layini obusinga obunene 12mm; Obugulumivu bwa arc 0.5–5mm (bufugibwa). Enkola z’okuweta: Okusiba omupiira ogw’ebbugumu n’amaloboozi/okusiba ku wedge; dual-frequency ultrasonic (omutindo gw’amaloboozi).

Ebipimo by’omubiri (W×D×H): Nga. 1200×800×1600mm, nga zino ziri mu mmita 1200×800×1600; Obuzito nga. kkiro 850.

III. Enzimba ne Tekinologiya Omukulu

1. High-rigidity lightweight omutwe gw’okuweta (ekifo ekikulu okutunda)

Composite material swing arm: High rigidity + low inertia, okukankana okutono mu kiseera ky’okutambula ku sipiidi enkulu, 40% okulongoosa mu long-arc stability.

Ekika 1701 ultra-miniature resonator: Okufuluma okunywevu, okuwuguka okw’ebbugumu okutono, okukwatagana ne waya za ekikomo/ffeeza alloy, okuweta kwa puleesa entono (≤1.5N), okukuuma ebitundu ebigonvu/ebitundu ebikutuka.

Okuzuula okukwatagana okw’amaanyi: Okuddamu kwa puleesa mu kiseera ekituufu, obutuufu bw’okufuga puleesa y’okukwatagana ±0.1N, okukendeeza ku bulabe bw’okukutuka kwa chip.

2. Enkola y’okulaba kw’amaaso α-Eye

Enkola y’okutegeera ey’omulembe oguddako: Anti-reflective, anti-color difference, okutegeera obutuufu ±1μm, low-contrast/dirty substrate recognition rate ≥99.9%.

Okuyiga kwa template eziwera: Kuwagira ppini enzibu, pads ezitali za bulijjo, ne dense arrays, okutereeza offset/rotation mu ngeri ey’otoma.

3. Omutendera Bond Sequence (Visualized Step-by-Step Bonding): Full-enkola parameter visualization: Segmented adjustable ultrasonic amaanyi, puleesa, obudde, n'ebbugumu okufuga obulungi omupiira diameter, wedge obugazi, n'enkula ya waya arc.

Dedicated long/high arc process library: Okukwatagana kwa waya okunywevu ku mabanga amawanvu ennyo aga mm 10–12, awatali kugwa kwa waya/okumenya.

4. Automation n'okuyunga: Okutikka n'okutikkula mu bujjuvu otomatiki: bbokisi z'ebintu 25-ebitundu × 2, otomatiki waya threading, otomatiki ppini okuyonja, n'otoma capillary okuyonja.

Ebintu ebiri ku mutindo gw’amakolero 4.0: SECS/GEM, KISS (KAIJO Equipment Management System), okulondoola mu kiseera ekituufu, okulondoola, n’okukebera okuva ewala.

Windows 10 touch interface: screen ennene ya yinsi 15, ekola nga yeesigamiziddwa ku bifaananyi, okujjukira parameter nga onyiga omulundi gumu, ebibalo by’amakungula, ne alamu za anomaly.

IV. FB-x26 BUMP Ebiva mu Mulongooti

FB-x26 BUMP1: Okukuba wafer eya yinsi 6 (Stud Bump) mu ngeri ey’otoma mu bujjuvu, okutikka n’okutikkula mu ngeri ey’otoma, obuwanvu bw’okukuba 5–50μm, obutuufu ±1μm.

FB-x26 BUMP2/BUMP3: Semi-automatic wafer bumping ya yinsi 8, ekwatagana n’okupakinga okw’omulembe (WLCSP, Fan-out).

V. Okugeraageranya ebirungi (vs. Mainstream General-Purpose Machine FB-e20N) .

Ekitundu ky’okusoda: x26 95mm (Y) vs e20N 80mm (Y) → Kirungi nnyo ku fuleemu ennene/arcs empanvu.

Soldering Head: x26 obugumu obw’amaanyi ate nga buzitowa + okukuba okutono vs e20N standard rigidity → Esinga okunywevu ku chips ennyimpi/module z’amaanyi.

Obuwanvu bwa waya: x26 12mm vs e20N 8mm → Ekyokulonda kyokka ku kusiba waya ez’ebanga eddene.

Obutuufu: x26 ±2.5μm vs e20N ±3.0μm → Amakungula amangi.

Sipiidi: x26 egenda mpola katono (esaanira ku arcs empanvu) vs e20N esingako (ku short-arc mass production).

VI. Ebiteeso mu bufunze n’okulonda

Core Values: Ekitundu ekigazi, arc empanvu, impact entono, precision enkulu, okugonjoola ensonga z’obulumi bwa waya bonding mu power modules / ICs ennene, amakungula ≥99.5%.

Ebiteeso by’okulonda:

Module z’amaanyi, ebyuma by’emmotoka, okusiba waya ez’ebanga eddene → FB-x26

Okukuba wafer eya yinsi 6–8 → FB-x26 BUMP1/2/3

Okufulumya mu bungi ku sipiidi ennyimpi (LEDs/discrete devices) → Londa FB-e20N