KAIJO FB-x26 umugozi

KAIJO FB-x26 ni imashini ihuza insinga za thermo-ultrasonic ifite ubuso bunini kandi ikora neza cyane iva muri KAIJO yo mu Buyapani. Yagenewe ahanini modules zikoresha ingufu nyinshi, ibikoresho by'ikoranabuhanga by'imodoka, ama-IC manini, n'ibikoresho byo guhuza insinga kure. Ibyiza byayo by'ingenzi birimo agace ka Y-axis nini cyane ka 95mm, Z-arm ifite imbaraga nyinshi, yoroheje, umuvuduko muke, hamwe no kudahungabana kw'umurambararo muremure. Ishobora kandi gukurwa mu mashini ya FB-x26 BUMP wafer bumping, bigatuma iba igikoresho cy'ingenzi cyo gukoresha ingufu n'ibikoresho bigezweho.

I. Gushyira mu mwanya n'ikoreshwa ry'ingenzi

Aho ishyirwa: Imashini ihuza umupira wa thermo-ultrasonic/wedge ikora byikora, ifite ubuso bugari, ifite umurambararo muremure, kandi ifite imiterere yihariye.

Porogaramu zisanzwe:

Ingufu zikoresha amashanyarazi: IGBTs, MOSFETs, modules za SiC/GaN (imirongo miremire, fremu nini).

Ibyuma by'ikoranabuhanga mu modoka: Ibikoresho bya MCU by'imodoka, ibikoresho byo gucunga ingufu, amatara/ibipfunyika by'amajwi mu modoka.

ICS nini: Memory, SoCs, ASICs nyinshi (ubugari bw'amashusho kugeza kuri mm 105).

Pakingi igezweho: Stud Bump, Multi-chip Stacking, Arc ikora kure (kugeza kuri 12mm).

Insinga zihuye: Insinga za zahabu (Φ15–30μm), Insinga y'umuringa (Φ20–30μm), Insinga ya Silver alloy (ni ngombwa).

II. Ibisobanuro by'ingenzi (Imiterere rusange ya 2026)

Ubuso bw'ifatanirizo: 56mm (X) × 95mm (Y); Ubugari ntarengwa bw'urukiramende ni 105mm.

Ubuso bwo gukoreraho: 295mm × 105mm (ku dusanduku tunini/udusanduku).

Umuvuduko wo guhuza: Ibisanzwe ni amasegonda 0.045–0.055/umurongo (imirongo 1090–1333/umunota).

Gusubiramo: ± 2.5μm (3σ); Intera ntoya ya pad ni 35μm.

Uburebure bw'umurongo/Uburebure bw'umurambararo: Uburebure ntarengwa bw'umurongo ni mm 12; Uburebure bw'umurambararo ni mm 0.5–5 (bugenzurwa). Uburyo bwo gusudira: Guhuza umupira wa Thermo-sonic/wedge; ultrasonic ifite frequency ebyiri (isanzwe).

Ingano z'umubiri (Ubugari × Ubwinshi × Ubwinshi): Hafi 1200 × 800 × 1600 mm; Uburemere hafi 850 kg.

III. Imiterere n'ikoranabuhanga ry'ingenzi

1. Umutwe wo gusudira woroheje kandi uhamye (aho ugurisha cyane)

Ukuboko kw'ibikoresho bivanze: Uburimbane bwinshi + ubushyuhe buke, guhindagura guke mu gihe cyo kugenda cyane, kwiyongera kwa 40% mu guhagarara neza kw'umurambararo muremure.

Resonator ya 1701 ultra-miniature: Itanga umusaruro uhamye, ihindagurika ry'ubushyuhe buke, ijyanye n'insinga z'umuringa/ifeza, gusudira umuvuduko muto (≤1.5N), irinda uduce duto tw'icyuma/uduce duto tw'icyuma.

Gutahura umuvuduko mwinshi: Gusuzuma umuvuduko mu gihe nyacyo, kugenzura umuvuduko neza ± 0.1N, bigabanya ibyago byo gucika kw'udupira.

2. α-Uburyo bwo kureba amaso

Uburyo bwo kumenya ibimenyetso bw'ikinyejana gikurikira: Irwanya kugarura urumuri, itandukaniro ry'amabara, uburyo bwo kumenya neza ± 1μm, igipimo cyo kumenya ibimenyetso by'itandukaniro rito/ibyanduye ≥99.9%.

Kwiga hakoreshejwe ibishushanyo mbonera byinshi: Bishyigikira udupira duto, udupira dufite imiterere idasanzwe, n'udupira twinshi, bigakosora mu buryo bwikora uburyo bwo gusimbuza/guzunguruka.

3. Urukurikirane rw'Intambwe z'Umugozi (Guhuza Intambwe ku Ntambwe): Kugaragaza ibipimo byuzuye: Ingufu za ultrasonic zishobora guhindurwa mu byiciro, igitutu, igihe, n'ubushyuhe kugira ngo hagenzurwe neza umurambararo w'umupira, ubugari bw'umugozi, n'imiterere y'umugozi w'insinga.

Isomero ryihariye ry’imikorere y’insinga ndende/ndende: Insinga zihamye zifatanye mu ntera ndende cyane ya mm 10–12, nta gucika kw’insinga cyangwa gusenyuka.

4. Kwikora no Guhuza: Gupakira no gupakurura byihuse: udusanduku tw'ibikoresho 25 × 2, gukurura insinga byikora, gusukura udupira mu buryo bwikora, no gusukura imiyoboro y'amaraso mu buryo bwikora.

Ibiranga bisanzwe bya Industry 4.0: SECS/GEM, KISS (Kaijo Equipment Management System), igenzura ryihuse, gukurikirana amakuru, no gusuzuma amakuru ari kure.

Interineti ya Windows 10: Ecran nini ya santimetero 15, imikorere ishingiye ku gishushanyo, kwibuka parametre rimwe, imibare y’ubwiyongere, n’ibirango by’uburangare.

IV. FB-x26 BUMP Derivative Series

FB-x26 BUMP1: Gufunga wafer ya santimetero 6 mu buryo bwikora (Stud Bump), gupakira no gupakurura mu buryo bwikora, uburebure bwa bump ni 5–50μm, ubuziranenge ± 1μm.

FB-x26 BUMP2/BUMP3: Ifite uburyo bwo gukurura wafer ya santimetero 8 ikora mu buryo bwikora, ijyanye n'ipaki igezweho (WLCSP, Fan-out).

V. Igereranya ry'Ibyiza (ugereranije n'imashini ikoreshwa mu buryo rusange FB-e20N)

Ubuso bwo gusodera: x26 95mm (Y) vs e20N 80mm (Y) → Bikunda gukoreshwa ku mashusho manini/imirongo miremire.

Umutwe wo gusoda: x26 ifite ubukana bwinshi kandi yoroheje + ifite ingaruka nke ugereranije n'ubukana busanzwe bwa e20N → Ihamye cyane kuri chips/power modules zoroshye.

Uburebure bw'insinga: x26 12mm ugereranije na e20N 8mm → Amahitamo yonyine yo guhuza insinga n'intera ndende.

Ubuziranenge: x26 ±2.5μm ugereranije na e20N ±3.0μm → Umusaruro mwinshi.

Umuvuduko: x26 igenda buhoro (ikwiriye imirongo miremire) ugereranije na e20N yihuta (ku musaruro mugufi w'imirongo).

VI. Incamake n'inama zo guhitamo

Agaciro k'ingenzi: Ubuso bunini, umurambararo muremure, ingaruka nke, ubuziranenge bwo hejuru, gukemura ibibazo by'insinga mu miyoboro y'amashanyarazi/IC nini, umusaruro ≥99.5%.

Ibyifuzo byo guhitamo:

Module z'amashanyarazi, ibikoresho by'ikoranabuhanga by'imodoka, insinga zihuza intera ndende → FB-x26

Uduce twa wafer twa santimetero 6–8 duto cyane → FB-x26 BUMP1/2/3

Umusaruro w'amatara magufi yihuta cyane (LED/ibikoresho byayo) → Hitamo FB-e20N