KAIJO FB-x26 wire bonder

KAIJO FB-x26 ndi makina olumikizira waya a thermo-ultrasonic omwe ali ndi malo ambiri, olondola kwambiri ochokera ku KAIJO Japan. Amapangidwira makamaka ma module amphamvu kwambiri, zamagetsi zamagalimoto, ma IC akuluakulu, ndi ma waya olumikizirana mtunda wautali. Ubwino wake waukulu ndi monga malo olumikizirana a 95mm ultra-large Y-axis, Z-arm yolimba kwambiri, yopepuka, kuthamanga kochepa, komanso kukhazikika kwa arc yayitali. Itha kupangidwanso mwachindunji mu makina olumikizirana a FB-x26 BUMP, zomwe zimapangitsa kuti ikhale chipangizo chachikulu chamagetsi komanso chopangira zinthu zapamwamba.

I. Kuyika Malo ndi Ntchito Zazikulu

Malo Oyikira: Makina olumikizirana a mpira wa thermo-ultrasonic omwe amapangidwa okha, okhala ndi malo ambiri, aatali, komanso olondola kwambiri.

Mapulogalamu Odziwika:

Ma Power Semiconductors: Ma IGBT, Ma MOSFET, Ma module amagetsi a SiC/GaN (ma lead aatali, chimango chachikulu).

Zamagetsi Zagalimoto: Ma MCU agalimoto, ma IC owongolera mphamvu, kuyika magetsi/ma sensa agalimoto.

Ma IC Aakulu: Memory, SoCs, ma ASIC okhala ndi ma pin-count ambiri (m'lifupi mwa chimango mpaka 105mm).

Kupaka Kwapamwamba: Stud Bump, Multi-chip Stacking, Long-Distance Arc (mpaka 12mm).

Mawaya Ogwirizana: Waya wagolide (Φ15–30μm), Waya wa mkuwa (Φ20–30μm), Waya wa siliva (ngati mukufuna).

II. Mafotokozedwe a Pakati (2026 Mainstream Configuration)

Malo Olumikizirana: 56mm (X) × 95mm (Y); M'lifupi mwa chimango chachikulu ndi 105mm.

Malo Ogwirira Ntchito: 295mm × 105mm (ya ma substrates/ma tray akuluakulu).

Liwiro Logwirizanitsa: Nthawi zambiri 0.045–0.055 sec/line (1090–1333 lines/min).

Kubwerezabwereza: ±2.5μm (3σ); Kutalikirana kochepa kwa pad ndi 35μm.

Utali wa Mzere/Kutalika kwa Arc: Utali waukulu wa mzere ndi 12mm; Utali wa Arc ndi 0.5–5mm (wosasinthika). Njira zowotcherera: Kulumikiza mpira wa Thermo-sonic/wedge; ultrasound ya dual-frequency (yokhazikika).

Miyeso ya thupi (W×D×H): Pafupifupi 1200×800×1600mm; Kulemera pafupifupi 850kg.

III. Kapangidwe ndi Ukadaulo Wofunika

1. Mutu wowotcherera wopepuka komanso wolimba kwambiri (malo ogulitsira)

Mkono wozungulira wa zinthu zophatikizika: Kulimba kwambiri + kusakhala ndi mphamvu zambiri, kugwedezeka kochepa panthawi yoyenda mwachangu, kukhazikika kwa 40% kwa arc yayitali.

Mtundu wa 1701 ultra-miniature resonator: Yotulutsa bwino, kutentha pang'ono, yogwirizana ndi mawaya a mkuwa/siliva, kuwotcherera kotsika (≤1.5N), kuteteza tchipisi topyapyala/zosalimba.

Kuzindikira kukhudzana ndi liwiro lalikulu: Kuyankha kwa kuthamanga kwa nthawi yeniyeni, kulondola kwa kuwongolera kuthamanga kwa maukonde ± 0.1N, kuchepetsa chiopsezo cha kusweka kwa chip.

2. α- Dongosolo la maso

Njira yodziwira zinthu ya m'badwo wotsatira: Yosawunikira, yotsutsana ndi mitundu, yolondola yodziwira zinthu ± 1μm, kusiyana kochepa/kuipitsidwa kwa substrate ≥99.9%.

Kuphunzira kwa ma template ambiri: Kumathandizira ma pini ovuta, ma pad osawoneka bwino, ndi ma arrays okhuthala, kukonza zokha offset/rotation.

3. Kutsatana kwa Chigwirizano cha Gawo (Kugwirizanitsa Gawo ndi Gawo): Kuwonetsa magawo onse a njira: Mphamvu ya ultrasonic yosinthika, kuthamanga, nthawi, ndi kutentha kuti muwongolere bwino kukula kwa mpira, m'lifupi mwa wedge, ndi mawonekedwe a waya.

Laibulale yodzipereka yokonza njira zazitali/zazitali: Kulumikiza waya kokhazikika pamtunda wautali kwambiri wa 10–12mm, popanda kugwa/kusweka kwa waya.

4. Kulumikiza ndi Kukhazikitsa Makina: Kutsegula ndi kutsitsa zinthu zokha: Mabokosi azinthu 25 × 2, kulumikiza waya wokha, kuyeretsa mapini wokha, ndi kuyeretsa ma capillary wokha.

Zinthu zomwe zili mu Industry 4.0 ndi izi: SECS/GEM, KISS (KAIJO Equipment Management System), kuyang'anira nthawi yeniyeni, kutsata, komanso kuzindikira matenda patali.

Chida cholumikizira cha Windows 10: Chinsalu chachikulu cha mainchesi 15, ntchito yozikidwa pa zizindikiro, kukumbukira magawo ofunikira kudina kamodzi, ziwerengero za phindu, ndi ma alarm osazolowereka.

IV. FB-x26 BUMP Derivative Series

FB-x26 BUMP1: Kugunda kwa wafer wa mainchesi 6 okha (Stud Bump), kukweza ndi kutsitsa zinthu zokha, kutalika kwa gunda 5–50μm, kulondola ±1μm.

FB-x26 BUMP2/BUMP3: Kugundana kwa wafer wa mainchesi 8 okha, komwe kumagwirizana ndi ma phukusi apamwamba (WLCSP, Fan-out).

V. Kuyerekeza kwa Ubwino (motsutsana ndi Makina Omwe Amagwiritsidwa Ntchito Pantchito Zambiri FB-e20N)

Malo Osokera: x26 95mm (Y) vs e20N 80mm (Y) → Amakonda mafelemu akuluakulu/ma arc aatali.

Mutu Wosokera: x26 kulimba kwambiri komanso kopepuka + kutsika pang'ono poyerekeza ndi kulimba kwa e20N → Kukhazikika kwambiri pa ma chips/ma modules owonda.

Utali wa Waya: x26 12mm vs e20N 8mm → Chisankho chokhacho cha waya wolumikizira mtunda wautali.

Kulondola: x26 ±2.5μm vs e20N ±3.0μm → Kuchuluka kwa zokolola.

Liwiro: x26 pang'onopang'ono (yoyenera ma arc aatali) poyerekeza ndi e20N mwachangu (popanga ma arc afupiafupi).

VI. Chidule ndi Malangizo Osankha

Miyezo Yaikulu: Malo otakata, arc yayitali, kugwedezeka kochepa, kulondola kwambiri, kuthetsa ululu wa waya mu ma module amphamvu/ma IC akuluakulu, phindu ≥99.5%.

Malangizo Osankha:

Ma module amphamvu, zamagetsi zamagalimoto, ma waya olumikizirana mtunda wautali → FB-x26

Kupindika kwa wafer wa mainchesi 6–8 → FB-x26 BUMP1/2/3

Kupanga kwamphamvu kwa ma small-short-arc mwachangu kwambiri (ma LED/zipangizo zobisika) → Sankhani FB-e20N