KAIJO FB-e20N Wire Bonder

High-Speed Automatic Thermosonic Wire Bonder for Semiconductor & LED Packaging

The KAIJO FB-e20N is a fully automatic thermosonic ball bonding and wedge bonding machine designed for high-speed    semiconductor packaging and precision wire bonding applications. Built for short-loop, high-density, and mass    production environments, the FB-e20N delivers outstanding bonding stability, ultra-fast cycle times, and high    production efficiency.

This advanced wire bonder supports gold wire, copper wire, and silver alloy wire applications, making it ideal for    LED packaging, semiconductor devices, consumer ICs, and electronic component manufacturing.

Key Advantages of the KAIJO FB-e20N

Ultra-High-Speed Bonding Performance

The FB-e20N achieves:

• 0.043 sec/wire bonding speed

• Up to 1395 wires per minute

• Stable short-loop bonding performance

• High production efficiency for mass manufacturing

Suitable for:

• COB LED packaging

• Mini LED production

• Discrete semiconductor devices

• Consumer electronics ICs

• Sensor and PMIC packaging

Advanced Thermosonic Bonding Technology

The machine uses thermo-ultrasonic bonding technology, combining:

• Controlled heating

• Ultrasonic vibration

• Precision bonding pressure

This process creates stable atomic bonding between the bonding wire and pad surface while reducing pad damage and    improving long-term reliability.

Supported wire materials:

• Gold Wire (Φ15–30μm)

• Copper Wire (Φ20–30μm)

• Silver Alloy Wire (Optional)

High-Precision Vision Alignment System

α-Eye Intelligent Vision Technology

The FB-e20N features KAIJO’s advanced α-Eye vision system with:

• Real-time pad recognition

• Automatic offset correction

• Rotation compensation

• Dense pad alignment capability

• High-speed image processing

Precision Performance

• Repeatability: ±2.0μm (3σ)

• Recognition accuracy: ±1μm

• Minimum pad spacing: 35μm

The system ensures stable and accurate bonding even in fine-pitch semiconductor applications.

Core Features

Dual-Frequency Ultrasonic System

The dual-frequency ultrasonic bonding system automatically adapts to different wire materials and bonding    conditions.

Benefits include:

• Stable gold wire bonding

• Improved copper wire bonding reliability

• Reduced pad damage risk

• Better short-loop consistency

• Higher bonding stability

Intelligent Process Library

The built-in process library supports rapid setup for:

• LED packages

• Discrete devices

• Consumer electronics ICs

• Semiconductor components

Operators can quickly recall optimized bonding parameters for faster production changeovers.

Fully Automatic Operation

The FB-e20N supports:

• Automatic loading and unloading

• Automatic wire threading

• Needle cleaning

• Capillary cleaning

• Real-time monitoring

• Production traceability

• Alarm monitoring and diagnostics

This helps reduce downtime and improve manufacturing efficiency.

Technical Specifications

Typical Applications

LED Packaging

• COB LED

• Mini LED

• Surface Mount LED

• High-density LED modules

Semiconductor Devices

• MOSFETs

• Diodes

• Transistors

• Sensors

• Analog ICs

• PMICs

Consumer Electronics

The FB-e20N is widely used in high-volume consumer electronics production requiring stable and reliable wire bonding    performance.

Stable Short-Loop Bonding Capability

The machine is optimized for short-loop bonding applications with:

• Precise arc shape control

• Adjustable ultrasonic power

• Segmented pressure control

• Stable wire loop consistency

• Reduced wire sweep risk

This makes it ideal for compact semiconductor packaging and dense interconnect designs.

Reliable Production Automation

The FB-e20N helps manufacturers improve productivity with:

• Faster cycle times

• Lower defect rates

• Stable bonding quality

• Reduced operator workload

• Intelligent process monitoring

Its automation features make it suitable for continuous mass production environments.

KAIJO wire bonding machine FAQ

1. What wire materials can the FB-e20N support?

   The machine supports gold wire, copper wire, and optional silver alloy wire applications.

2. What industries commonly use the FB-e20N?

   The FB-e20N is commonly used in LED packaging, semiconductor manufacturing, consumer electronics, sensor production, and discrete device assembly.

3. What is the bonding accuracy of the machine?

   The machine provides ±2.0μm repeatability (3σ) with vision recognition accuracy up to ±1μm.

4. Is the FB-e20N suitable for short-loop bonding?

   Yes. The machine is specifically designed for short-loop and high-density wire bonding applications.

5. Does the machine support automatic operation?

   Yes. It supports automatic loading/unloading, automatic threading, cleaning functions, and intelligent production monitoring.

6. What are the main advantages of the dual-frequency ultrasonic system?

   The dual-frequency system improves bonding stability, supports different wire materials, reduces pad damage, and enhances bonding consistency.