Ekyuma ekigatta waya ekya K&S ICONN PLUS

K&S IConn PLUS ye waya emanyiddwa ennyo, mu bujjuvu mu ngeri ya otomatiki, eya wakati okutuuka ku ya waggulu mu mulimu gw’okupakinga semikondokita. Emanyiddwa olw’okukuze, tekinologiya omutebenkevu n’omulimu ogw’enjawulo, ekola ng’omutala ogwesigika wakati w’enkola eziteereddwawo n’ebyetaago ebigenda bivaayo, ekigifuula eky’okulonda eky’omugaso mu kunoonyereza n’okukulaakulanya n’okufulumya ebintu mu bitundu ebitono.

Tekinologiya Omukulu: Yinginiya ow’obutuufu n’okukola dizayini ey’obuyiiya

IConn PLUS ekozesa tekinologiya wa thermosonic bonding —ng’agatta amaanyi g’amaloboozi amangi, ebbugumu, ne puleesa —okuteekawo enkolagana y’amasannyalaze wakati wa chip ne lead frame okuyita mu ceramic capillary. Omulimu gwayo ogw’ekika ekya waggulu guva ku bintu bino wammanga ebikulu mu dizayini:

Dual-frequency Transducer: Esobozesa okulonda okukyukakyuka kwa frequency bbiri ku buli kifo kya bond, okusobozesa okufuga okutuufu ku masoboza ag’okusiba n’okulongoosa enkola za material-sensitive bonds.

Power Series Advanced Loops: Etuuka ku loopu eza wansi okuyita mu kufuga okutuufu okw'ensonga ya "final kink"; mode ya low-loop esobola okukendeeza ku buwanvu bwa loop ey’omu maaso okutuuka wansi wa 40 μm (nga tukozesa waya ya 0.6 mil).

WAVI (Wide Angle Vertical Illumination): Ekozesa enkola y’okutaasa LED emmyufu/bbululu esobola okuteekebwa mu pulogulaamu okutumbula ennyo obusobozi bw’okutegeera ebifaananyi mu bitundu byonna eby’ebintu ne langi ez’enjawulo.

1pF Auto-BITS (Auto-Bond Integrity Test System): Enkola ey’amagezi ey’okukebera oluvannyuma lw’okusiba n’obutuufu bwa 1pF eyiga mu ngeri ey’otoma n’okulongoosa ebipimo by’okukwatagana okukakasa omutindo gw’enkola. Ebikulu ebikwata ku nsonga eno mu kutunula

Olubu Ekintu Ebikwata ku nsonga eno mu bujjuvu

Enkola y’emirimu emikulu Obutuufu bw’okuteeka ±2.0 μm @ 3 sigma

Obugulumivu bwa Loop Obutono Nga wansi nga 40 μm (nga okozesa waya ya zaabu 0.6 mil)

Ekitono ennyo ekya Pad Pitch Awagira 35 μm ultra-fine eddoboozi

Ebipimo by’Ebyuma Ebipimo by’Ekyuma (W×D×H) . 889mm × 1009mm × nga. 1600mm (nga tobaliddeemu signal tower)

'Machine Weight' - Kino kye kimu kiragiro kya mukozesa ky'ekigambo ekikozesebwa mu kimu Nga. kkiro 590

Ebikwata ku by’amasannyalaze Bbaasa Omutendera gumu 200–240 VAC oba 100–115 VAC @ 50/60 Hz

Amaanyi Ekipimo: 1.5 kVA; Entikko: KVA 2.6

Ebyetaago by’okugabira abantu empewo Empewo Enkalu Enyigirizibwa (CDA) . Puleesa: 0.45–0.6 MPa; Omuwendo gw’amazzi agakulukuta: nga. 185 L/eddakiika

Omutabula gwa Nayitrojeni ne Haidrojeni Puleesa: 0.3–0.5 MPa; Omuwendo gw’amazzi agakulukuta: 0.6–1.5 L/min

Obusobozi bw’okukwatagana Zaabu Waya Diameter 0.6 – 2.0 mil (nga 15.2 – 50.8 μm) .

Diameter ya Waya y’ekikomo 0.7 – 1.0 mil (nga 17.8 – 25.4 μm) .

Max. Obuwanvu bwa Waya 7.6 mm (nga okozesa waya ya 1.0 mil)

Ekitundu ky’okukwatagana X-ekisiki: mm 56; Y-ekisiki: mm 80; ekitundu ekigaziyiziddwa ekisangibwa nga kiyita mu nkyusa za LA/ELA

Enkyukakyuka & Okukola pulogulaamu Okukyusa mu fuleemu y’emu < eddakiika 4

Enkyukakyuka mu fuleemu ez’enjawulo < eddakiika 8

Ebitundu Ebikulu eby’Okusaba

Okupakinga kwa LED: Okukwatagana mu bungi (mass bonding) kwa chips za LED; ekwatagana ne leadframes za SMD ez’enjawulo.

Okukola Memory: Esaanira okusiba chip eziwera n’okupakinga ekyuma ekijjukira loopu eya wansi ennyo.

Integrated Circuits (IC): Okuyunga waya za zaabu/ekikomo ku IC z’empuliziganya ey’amaaso, ebyuma by’amaanyi, ne sensa.

Okupakinga okw’omulembe: Kukwatagana ne SiP, QFN, BGA, n’ebika by’okupakinga ebirala wamu ne substrates enzibu.

Ebintu Ebikulu n’Omuwendo gw’Akatale

Enkizo ya IConn PLUS eri mu kifo kyayo ekituufu mu kitundu ky'akatale "ekikuze" era "ekyesigika". **Proven Stability:** Nga model ebadde ekakasibbwa akatale okumala ebbanga, yeewaanira ku system stability ate nga tegulemererwa nnyo. Naddala mu katale k’Abachina —gye yaweereza ng’embalaasi y’emirimu eyasooka —waliwo ekibinja ekinene ennyo ekya bayinginiya ab’ekikugu n’obuyambi obw’ebitone bungi.

**Efficiency Offsets Speed:** Wadde nga UPH yaayo (units per hour) egwa wansi ku models zaayo eza flagship ezisembyeyo, efficiency yaayo ey’enjawulo ey’okukyusa-wansi wa ddakiika 4 ku lead frame y’emu ate wansi wa ddakiika 8 ku za njawulo-effectively compensates for the slight speed gap, result in outstanding overall efficiency.

**Technical Capability & Cost-Effectiveness:** Ebintu nga okuwagira copper/silver wire bonding ne 35μm ultra-fine pitch capabilities zigisobozesa okutuukiriza ebyetaago by’okufulumya okuva mu makkati okutuuka ku mutindo gwa waggulu, ate nga ekifo kyayo eky’ebbeeyi ku katale ak’okubiri kye kikulu nnyo. Okugeza, 2016-model K&S ICONN PLUS ewandiikiddwa ku mikutu gy’akatale ak’okubiri ku ddoola nga 49,000 (emiwendo egy’amazima egy’okutunda gyawukana okusinziira ku nsengeka n’embeera).

**Embeera y'akatale n'okubuulirira ku kugula ebintu**

**Okuteeka mu katale:** Mu nsengeka y'ebintu bya K&S, IConn PLUS eteekeddwa ng'embalaasi ekola emirimu egy'amaanyi okuva mu makkati okutuuka ku mutindo ogwa waggulu-"omukozi akakasiddwa" ng'egatta enkola ezikuze n'okusoomoozebwa okw'omulembe. Bw’ogeraageranya n’emmotoka empya ez’omulembe, bbeeyi yaayo ey’omulembe esikiriza nnyo.

**Okugeraageranya okulonda:** Singa obusobozi obw’okuyita waggulu n’obunene-substrate bwetaagibwa, ekidda mu bigere byayo, RAPID Pro ELA, y’esinga okulonda (ewa 90mm Y-axis travel range n’enkola ez’amagezi ezisingako obulungi). Wabula ku pulojekiti ezitasaasaanya ssente nnyingi, awatali kubuusabuusa IConn PLUS nkola ekendeeza ku ssente nnyingi.

**Okulabula ku kabi:** Bw’oba ​​ogula ebyuma ebikozesebwa, kikulu nnyo okukakasa omwaka gw’okukola, essaawa zonna awamu ez’okukola, n’embeera ya spindle, n’okukwatagana n’omuntu ow’okusatu ow’ekikugu okukebera ebyuma.

Mu bufunze, IConn PLUS model ya classic ekola balance ennungi wakati w’omutindo n’omuwendo. Bw’oba ​​onoonya embalaasi ey’okukola eyeesigika, ekuze mu tekinologiya, era efugirwa ssente nnyingi ku layini yo ey’okufulumya, esigala nga y’esinga okulowoozebwako.