I-ASMPT MS100 Wafer Mapping Die Sorter: Oko Ikwenzayo Nento Omawuyijonge Ngaphambi Kokuba Uyithenge

I-ASMPT MS100, ekwadweliswa phantsi kwegama le-ASM MS100 elidala, idla ngokuchongwa kwiirekhodi zezixhobo ezisetyenzisiweyo zikawonke-wonke njenge-wafer mapping die sorter okanye i-map sorter. Indima yayo kukukhetha nokuhambisa ii-dies ngokolwazi lwemephu, inkqubo ecwangcisiweyo kunye nezixhobo zokuphatha ezifakwe kumatshini.

Olu hlobo lokuchonga lumisela udidi lwezixhobo ngokubanzi, kodwa amandla asebenzayo e-MS100 esetyenzisiweyo kufuneka amiselwe kwiyunithi nganye. Izixhobo zokuthathwa, ukuphathwa kwe-wafer okanye ifreyimu, umbono, isoftware, izixhobo, uqwalaselo lwemveliso kunye nokusetyenziswa kwangaphambili kunokwahluka phakathi koomatshini.

Inqaku lokuchaneka:Iseti yeenkcukacha ze-MS100 ethembekileyo efumanekayo ayifumaneki kubungqina bangoku. Ubungakanani bokusebenza, ukuchaneka, iifomathi zedayi okanye zewafer ezixhaswayo, imisebenzi yesoftware kunye nezinye izibango ezithile zomatshini kufuneka ziqinisekiswe kwi-nameplate, amaxwebhu okuqala, iimodyuli ezifakiweyo kunye nobungqina bokusebenza kweyunithi yokwenyani.

Luhlobo luni lomatshini i-ASM MS100?

I-ASM MS100 ichazwa ngokukhuselekileyo njengezixhobo ze-semiconductor ze-ASM ezindala ezisetyenziselwa ukuhlunga iidayi ezisekelwe kwimephu ye-wafer. Iipleyiti zamagama ezindala kunye neerekhodi zinokusebenzisa i-ASM, ngelixa uphendlo lwangoku lungasebenzisa i-ASMPT MS100. Ubume bomenzi obuboniswe kumatshini ngokwawo kufuneka buhlale buyindlela yokubonisa iyunithi nganye.

Kwisicelo esiqhelekileyo sokuhlela, ulwazi lwemephu okanye lweresiphi luchonga indawo yedayi efunekayo kunye nohlu lweentlobo ngeentlobo. Inkqubo yokuphatha efakiweyo emva koko ikhetha idayisi ize iyithumele kwindawo yokuthwala, isakhelo, inqanaba okanye indawo yokuphuma. Ulandelelwano oluchanekileyo luxhomekeke kwizixhobo ezibonelelweyo, isoftware kunye noqwalaselo lwenkqubo.

I-MS100, I-MS100 Plus, I-MS100 Plus IIkwayeMS90kufuneka ziphathwe njengeethagethi zemodeli ezahlukileyo. Iinkcukacha okanye izakhono ezipapashwe kwi-MS100 Plus akufuneki zidluliselwe kwi-MS100 ngaphandle kokuba amaxwebhu okuqala aqinisekisa ukuba ziyasebenza.

AbaHloli beeMephu zeWafer, abaPhathi boVavanyo kunye nabaHloli beeDie banemisebenzi eyahlukeneyo

Amagama ezixhobo ze-semiconductor awasoloko esetyenziswa rhoqo kuluhlu lokuthengisa kwakhona. Abathengi kufuneka baqale bachonge uxanduva oluphambili lwenkqubo yomatshini.

Umphathi wovavanyo lombane udla ngokusebenza neendawo zovavanyo ezihambelanayo, iisokhethi okanye iicontactors kunye nezixhobo zovavanyo oluzenzekelayo. I-die bonder incamathisela idayisi komnye umphezulu ngenkqubo yokubopha. Endaweni yoko, i-wafer mapping die sorter isebenzisa idatha yenkqubo ukulawula i-die pickup kunye ne-output routing.

Ngoko ke i-MS100 kufuneka ihlolwe ikakhulu njenge-wafer mapping die sorter ngaphandle kokuba amaxwebhu oomatshini bokuqala kunye noqwalaselo olufakiweyo lumisela olunye ulwazi oluqinisekisiweyo lwenkqubo.

Indlela Esebenza Ngayo Indlela Yokuhlela Iidayi Esekelwe Kwimephu Ye-Wafer

Indlela yokuhlela imephu ye-wafer ngokubanzi ingalandela olu landelelwano:

1. Nika umatshini ifomathi ye-wafer exhaswayo okanye ifreyimu yefilimu.

2. Layisha okanye ukhethe imephu efanelekileyo kwaye uyisebenzisele ukucubungula iresiphi.

3. Fumana indawo yedayi echongiweyo yidatha yenkqubo.

4. Khetha idayisi usebenzisa i-pickup efakiweyo kunye ne-ejector.

5. Lungelelanisa okanye uhlole idayisi apho inkqubo ilungiselelwe khona ukwenza njalo.

6. Beka idayisi kwindawo yokuthwala, kwisakhelo, kwinqanaba okanye kwindawo yokuphuma enikiweyo.

7. Hlaziya irekhodi yenkqubo uze uqhubeke nolandelelwano lokuhlela.

Le yingcamango yenkqubo ngokubanzi, ayilonkcazo echanekileyo yoomatshini kuyo yonke i-MS100. Ulungelelwaniso, ukuhlolwa, ukuhanjiswa kwemveliso kunye nemisebenzi yokurekhoda ixhomekeke kwi-hardware kunye nesoftware enikezelwa kumatshini ngamnye.

Oko Kwenziwa yiMaphu yeWafer kwiNkqubo yokuHlela

Imephu ye-wafer inokuba nedatha yendawo yedayi, ulwazi lohlulo okanye lwenqanaba kunye nemeko yenkqubo esetyenziswa ngumsebenzi wokuhlela olungiselelweyo. Umatshini ungasebenzisa olu lwazi ukumisela ukuba yeyiphi idayisi ekufuneka ikhethwe kunye nendawo ekufuneka idluliselwe kuyo.

Idatha yohlulo ingavela kuvavanyo lombane oluphezulu okanye kwinkqubo yokuhlola ize isetyenziswe ngexesha lokuhlela olusezantsi. Ukubakho kwemephu ye-wafer ngoko ke kuchonga indlela yokusebenza yokuhlela, kungekhona umsebenzi wovavanyo lombane ngaphakathi kwi-MS100 ngokwayo.

Iifomathi zefayile ezixhaswayo, ujongano lwesoftware, izakhiwo zeresiphi kunye neendlela zonxibelelwano kufuneka ziqinisekiswe kwinkqubo yokwenyani. Iinkcazo zokuthengisa kwakhona eziqhelekileyo zifanelekile ukuchongwa kwemodeli kodwa akufuneki zithathwe njengobungqina bezakhono ezithile zemephu okanye zesoftware.

Kutheni igama lemodeli ye-MS100 linganele

Oomatshini ababini abanegama elifanayo lemodeli ye-MS100 banokuba nezakhono ezahlukeneyo zenkqubo. Umahluko ungabandakanya intloko yepickup, ulungiselelo lwe-ejector, ii-collets okanye ii-nozzles, itafile ye-wafer, inkqubo yokuphatha isakhelo, iikhamera, izibane, abathwali bemveliso kunye noyilo lwe-binning.

Iinguqulelo zesoftware, iiresiphi, iilayisenisi, imeko yokulinganisa, izixhobo zokuguqula kunye nezicelo zangaphambili zinokuchaphazela ngakumbi ukufaneleka. Umatshini olungiselelwe idayisi enye, ifreyimu ye-wafer okanye indlela yokukhupha unokufuna izixhobo ezahlukeneyo kunye nokulungiswa kwenkqubo kwenye iprojekthi.

Olu xhomekeko loqwalaselo luqhelekile kulo lonkeabaphathi be-semiconductor pick-and-placeIgama leqonga lichaza usapho lwezixhobo, ngelixa iimodyuli ezifakiweyo kunye nezixhobo zimisela indlela engasetyenziswa ngayo inkqubo.

Abathengi kufuneka bahlole iifoto, ipleyiti yegama, izixhobo ezifakiweyo, imeko yesoftware, izixhobo kunye nobubanzi bokuhanjiswa kwezixhobo ze-ASMPT MS100 ezikhoyo ngaphambi kokuba bagqibe ekubeni zingafanelana na nenkqubo ekujoliswe kuyo.

Ulwazi olufunekayo ukuze uvavanye i-MS100 kwiNkqubo yakho

Uphando oluluncedo lwe-MS100 lufanele luchaze inkqubo ekujoliswe kuyo kunokubuza nje kuphela ukuba imodeli iyafumaneka na.

I-Target Die

Nika ubungakanani kunye nobukhulu bedayi, uhlobo lwezinto okanye isixhobo, imeko yomphezulu, ulwalathiso olufunekayo kunye nazo naziphi na iindawo ezibuthathaka okanye ezithintelweyo zokuthathwa. Ezi zinto zichaphazela izixhobo zokuthathwa, ulungiselelo lwe-ejector kunye nendlela yokuphatha enokuthi ifuneke.

Imidiya yokufaka

Chonga ifomathi ye-wafer okanye yefreyimu yefilimu, ubukhulu befreyimu, imeko ye-wafer, indlela yokulayisha kunye nolwazi olufumanekayo lwemephu okanye lweresiphi. Ezi mfuno kufuneka zithelekiswe netafile ye-wafer kunye noqwalaselo lokuphatha ifreyimu olufakwe kumatshini.

Indlela yokuphuma

Cacisa ukuba ingaba iidayi ezihleliweyo kufuneka zithuthelwe kwindawo yokuthwala, kwisakhelo, kwitreyi, kwibhini okanye kwindawo yodidi. Ukujongwa okufunekayo, ukuphathwa kokulahlwa kunye nokwahlulwahlulwa kwemveliso nako kufuneka kuchazwe.

Iimfuno zeNkqubo

Chaza ingqiqo yokuhlela, iimfuno zokulungelelanisa okanye zokuhlola, imfuneko yokulandelela, injongo yemveliso kunye notshintsho olulindelekileyo. Ezi ziphumo zimisela oko kufuneka kuboniswe ngexesha lophononongo lwezixhobo.

Ukubonelela ngolu lwazi akuthethi ukuba i-MS100 ixhasa yonke ifomathi edwelisiweyo. Inika umthengisi umxholo owaneleyo wokuthelekisa iprojekthi kunye noqwalaselo lokwenyani lomatshini.

Yintoni Omele Uyijonge kwi-ASM MS100 Esetyenzisiweyo

Uphononongo lomatshini osetyenzisiweyo kufuneka luqinisekise ukuba yintoni efakiweyo, yintoni esebenzayo kunye nento eza kubandakanywa ekuhanjisweni. Imeko yokuvula umbane yodwa inika inxalenye encinci yobo bungqina.

Ividiyo evulayo inokuqinisekisa ukuba umatshini uyaqalisa ukusebenza kwaye ezinye iinkqubo ziyaphendula. Ayibonisi ukuhambelana nedayi yomthengi, ayiqinisekisi ukusetyenziswa ngokupheleleyo kwezixhobo okanye ibonisa ukulungela imveliso.

Ubungqina bokusebenza bufanele bubonise ukusetyenziswa okucetywayo ngokusondeleyo nangokusebenzayo. Ulandelelwano olulawulwayo lokuthatha, ukubeka kunye nokulandelelanisa iziphumo kusetyenziswa izixhobo ezifanelekileyo lubonelela ngolwazi oluluncedo ngakumbi kunomboniso wentshukumo ye-axis eqhelekileyo.

Kutheni uvavanyo lwe-Target-Die lubonelela ngobungqina obuqinileyo

Apho kufanelekileyo, uvavanyo lwenkqubo emeleyo lubonelela ngobungqina obunamandla bokuhambelana kunegama lemodeli, inkcazo yokuthengisa kwakhona okanye ividiyo esisiseko yokuqalisa.

Uvavanyo oluluncedo lunokubandakanya idayi ejoliswe kuyo okanye emeleyo, ifomathi ye-wafer okanye yesakhelo esicetywayo, izixhobo ezifanelekileyo, imephu ehambelanayo okanye iresiphi kunye nomthwali wemveliso ofunekayo. Isiphumo singabonisa ukuba i-pickup efakiweyo, ulungelelwaniso kunye noqwalaselo lwe-routing lufanelekile na kwiprojekthi.

Ububanzi bovavanyo olufumanekayo buxhomekeke kwimeko yomatshini, izixhobo, izinto zesampulu, ukufikelela kwisoftware, amandla omthengisi kunye nexesha leprojekthi. Ayizizo zonke iimatshini ezinokuvavanywa ngezinto zokwenyani zomthengi zokuvelisa.

Iimfuno zovavanyo kufuneka kuvunyelwane ngazo ngaphambi kokuba umatshini uchazwe njengofanelekileyo. Xa uvavanyo olupheleleyo lwenkqubo lungenakwenzeka, iingozi eziseleyo zokuhambelana kufuneka zichongwe ngokucacileyo ukuze kuqinisekiswe kamva.

Xa i-MS100 isenokungabi yindawo efanelekileyo yokuqala

Olunye ulwalathiso lwezixhobo lunokufuneka xa umsebenzi ophambili kukuvavanya ngombane nge-ATE, iisokhethi okanye iicontactor endaweni yokucwangcisa idayethi ngokusekelwe kwimephu ye-wafer.

I-MS100 isenokungafaneleki xa ifomathi ye-wafer, ifreyimu, idaye okanye i-output efunekayo ingenakuxhaswa, ukuhambelana kwemephu okanye isoftware kungenakumiselwa, i-conversion hardware ayifumaneki okanye i-process station efunekayo ayifakwanga.

Iqonga lamva okanye uyilo olwahlukileyo lokuphatha lunokufaneleka ngakumbi kwezinye iimeko, kodwa indlela yokutshintsha kufuneka ilandele i-die, i-input media, iimfuno zenkqubo kunye nemveliso endaweni yegama lemodeli kuphela.

Jonga uqwalaselo lwe-ASM MS100 ekhoyo

Lungisa ulwazi olulandelayo ngaphambi kokuba ucele uphononongo lwezixhobo:

• Ubukhulu kunye nobukhulu be-die

• Ifomathi yewafer okanye yefreyimu

• Iimfuneko zemephu okanye iresiphi

• Iimfuneko zokuthathwa kunye nokulungelelaniswa

• Indlela yokuphatha imveliso ecetywayo okanye indlela yokuhlela

• Izixhobo ezikhoyo

• Imveliso ekujoliswe kuyo

• Ulwazi lwendawo kunye nolwazi lwendawo

• Ubungqina obufunekayo bokusebenza okanye bokuhlola

Qhagamshelana nathi ngeWhatsApp ukuze uhlole ubume bomatshini we-ASM MS100 obukhoyo, kuquka iifoto zangoku, ulwazi lwepleyiti yegama, izixhobo ezifakiweyo, ubungqina bokusebenza obukhoyo, izixhobo ezibandakanyiweyo, imeko yokuhlolwa kunye nobubanzi bokuhanjiswa.

Impendulo mayisekelwe kumatshini othile. Ukuhambelana, ixabiso, ixesha lokuhambisa, imeko yokuhlaziywa kunye nokusebenza okulindelekileyo kufuneka kuqinisekiswe kuphela emva kokuba iimfuno zeyunithi ekhoyo kunye neprojekthi zihlolisisiwe.

Imibuzo Ebuzwa Rhoqo Malunga ne-ASMPT MS100

Loluphi uhlobo lomatshini i-ASM MS100?

Iirekhodi zezixhobo ezisetyenzisiweyo zikawonke-wonke zihlala ziyichaza njenge-wafer mapping die sorter, i-map sorter okanye i-device mapper sorter. Amandla eyunithi nganye axhomekeke kwi-hardware yayo efakiweyo, isoftware kunye nezixhobo.

Ngaba i-ASM MS100 ngumvavanyi wovavanyo lombane?

Ayizizo ngokuzenzekelayo. Uvavanyo lombane lufuna iindawo zovavanyo ezihambelanayo, izixhobo zonxibelelwano, unxibelelwano lwabavavanyi kunye nesoftware. Ukuhlelwa okusekwe kwimephu ye-wafer kunokusebenzisa idatha yokwahlulahlula ngaphandle kokwenza uvavanyo lombane oluphezulu ngokwalo.

Ngaba i-MS100 yenza imephu ye-wafer?

Eli qonga lidla ngokuchazwa njenge-wafer mapping die sorter. Iifomathi zemephu ezixhaswayo, indlela yokusebenza kwesoftware kunye ne-data interfaces kufuneka zijongwe kumatshini wokwenyani kunye namaxwebhu awo.

Zeziphi ii-wafer kunye nee-die sizes ezinokuthi ziphathwe yi-MS100?

Uluhlu oluqhelekileyo alufanele lusetyenziswe kumatshini ngamnye. Ukuhambelana kuxhomekeke kwitafile ye-wafer efakiweyo, ukuphathwa kwefreyimu, i-ejector, izixhobo zokuthatha, inkqubo yokubona, isoftware kunye nehardware yokuguqula.

Yintoni ekufuneka ihlolwe ngaphambi kokuba uthenge i-ASM MS100 esetyenzisiweyo?

Jonga ubume bomatshini, ubume obufakiweyo, imeko yoomatshini kunye nombono, ukufikelela kwisoftware, ukuphathwa kwemephu, izixhobo, indlela yokuphuma, ubungqina bokusebenza kunye nobubanzi bokuhanjiswa ngokuchanekileyo.

Ngaba i-ASM MS100 kunye ne-MS100 Plus ziyafana?

Hayi. Ziithagethi zemodeli ezahlukeneyo. Iinkcukacha okanye amandla apapashwe kwi-MS100 Plus okanye kwi-MS100 Plus II akufuneki asetyenziswe kwi-MS100 ngaphandle kwamaxwebhu axhasayo okuqala.

Isiphelo:I-ASMPT okanye i-ASM MS100 idla ngokuchongwa njenge-wafer mapping die sorter, kodwa ukuhambelana okusebenzayo kuxhomekeke kumatshini ngamnye. Ukuhlelwa kwe-wafer-map, uvavanyo lombane kunye ne-die bonding ziindima ezahlukeneyo zenkqubo, ngelixa i-pickup hardware, umbono, isoftware, izixhobo kunye noqwalaselo lwemveliso zinokwahluka phakathi kweeyunithi ezisetyenzisiweyo. Abathengi kufuneka bacele irekhodi echanekileyo yomatshini, bahlole ubungqina bokusebenza obufanelekileyo kwaye basebenzise uvavanyo lwenkqubo emele apho kufanelekileyo ngaphambi kokuqinisekisa ukufaneleka okanye ukucela ikowuteshini yokugqibela.