ASM MS100 Plus test handler

As an upgraded version of the MS100, the ASM MS100 Plus is also a wafer-mapped chip sorting and placement machine. Its core operation is an automated "pick-sort-place" process, but through a series of hardware and software improvements, its operational stability and processing power have been significantly enhanced:

Powerful Control System: Employing microprocessor-controlled electronic components and servo drive mechanisms, it provides a more stable computing platform and motion control for various operations.

Precision-Executing Robotic Arm: Equipped with a more powerful die-cutting head, it can more accurately control and monitor speed, direction, and pressure.

Flexible Dual-Head Configuration (Speculated): Equipped with two independent chip placement heads. While it is unclear whether it can work in parallel like the MS100, this provides greater flexibility for handling different tasks simultaneously.

Integrated Quality Inspection System: Equipped with an integrated vision system for inspecting placement quality, and using a chip inspection instrument and vision system for dual alignment accuracy checks before placement.

User-Friendly Interface: Provides an intuitive and easy-to-use full-color touchscreen controller, allowing operators to quickly switch programs and monitor equipment status.

Key Features Overview

The ASM MS100 Plus enhances the high-speed architecture of the base model's "dual-arm cooperative operation" system in two main aspects:

Features | Feature Description | Key Benefits

Rugged and Durable Construction | A high-strength steel frame with rubber shock-absorbing supports effectively resists impacts and vibrations, ensuring accuracy and long-term stability during high-speed sorting.

Dual Independent Connectors | Equipped with two independent connectors, supporting single-needle or dual-needle dispensing configurations. Higher parallel processing capacity, more flexible dispensing methods, and higher throughput per hour (UPH).

Wide Material Compatibility | Adjustable cutting height and length allow handling of a wide range of materials, from thin foil to thick plates. Suitable for chips or components of various thicknesses and materials, providing high production flexibility.

Enhanced Low-Pressure Alarm | The equipment is equipped with a low-pressure alarm function, immediately stopping operation upon detection of an abnormality. Effectively protects substrates and materials, preventing product damage caused by pressure issues.

Enhanced Component Handling | Equipped with an adjustable-height support to accommodate 8-inch eutectic wafers. Capable of precisely handling larger and more complex components, thus expanding the equipment's application range.

Efficient program management: It can store up to 200 program files and supports complex parameter settings. This facilitates rapid product changeover, reduces changeover time, and adapts to the needs of multi-variety, small-batch production.

Key Technical Specifications

Based on available information, the main parameters are summarized as follows:

Parameter Category | Detailed Specifications

Equipment Model | ASM MS100 Plus

Equipment Type | Wafer Mapping Chip Sorter

Operating Mode | Fully Automatic

Chip Pickup Cycle | Up to 100 cycles per minute (6,000 UPH)

Bond Force Range | 40g - 250g

Chip Rotation Accuracy | ±1°

Supported Wafer/Thin Film Sizes | 2 - 6 inches (Standard 2-4 inches, Max 6 inches)

Maximum Program Storage Capacity | 200 program files

Power Consumption | 1300W (110VAC)

Input Voltage | 100-240 VAC, 50/60Hz

Compressed Air Requirements | 87 PSI (6 bar)

Compressed Air Consumption | 155 LPM

Version Comparison: MS100 vs. MS100 Plus

So, how do you choose between the MS100 and MS100 Plus? The following table summarizes their main differences: Size Comparison

MS100 (Standard)

MS100 Plus (Enhanced)

Core Design

Pursuing ultimate speed, optimized specifically for LED I-Flow processes

Balancing speed, comprehensively improving the ability to handle complex, high-value chips

Cycle/Capacity

Ultra-high capacity, cycle time up to 120 milliseconds (30K UPH)

Standard capacity, 100 cycles per minute (6K UPH)

Structural Strength

High-strength steel frame

High-strength steel frame + rubber shock-absorbing bracket

Process Optimization

Comprehensive functionality, meeting LED sorting standard requirements

Equipped with dual independent mounting heads and integrated vision inspection for higher reliability

Applicable Scenarios

High-volume standardized LED chip sorting

High-quality chip sorting such as MEMS, sensors, advanced LEDs, and RF modules

In summary, the ASM MS100 Plus, building upon the MS100, is no longer just a high-speed sorter, but a highly reliable "precision expert" through enhanced structure, upgraded control system, dual attachment heads, and vision inspection. It offers greater stability and flexibility to handle more complex chip sorting challenges, making it particularly suitable for scenarios with higher requirements for placement accuracy, component complexity, and process quality control.

Therefore, the two can be used in different scenarios:

The MS100 is the "sprint champion" pursuing ultimate speed.

The MS100 Plus, on the other hand, is a comprehensively enhanced "all-rounder," suitable for handling higher-value, larger-sized, or more complex chips.