ASMPT MS100 Map Sorter | Used Wafer Die Sorting Equipment

The ASM MS100, also searched as the ASMPT MS100, is a wafer mapping die sorter used to pick selected die from an incoming wafer or film-frame presentation and place them into the required sorted output. In the used-equipment market, the model is also described as a map sorter, mapper sorter, device mapper sorter or pick-and-place sorting system.

ASM MS100 Equipment Overview

The MS100 belongs to map-based die handling rather than the thermal, contact and ATE functions normally associated with a packaged-device final test handler. Its main role is to use production data prepared upstream, identify the die required by the sorting recipe and complete the physical pick-and-place route into the configured destination.

The model name confirms the equipment family, but it does not confirm the exact frame-handling modules, pickup hardware, vision system, software version, output arrangement or included tooling on a particular used machine. These points should be reviewed against the actual unit offered.

Map-Based Pick, Sort and Place Process

The MS100 normally works after wafer probing, inspection or grading has created wafer map, bin or recipe information. The machine uses this data to locate selected die, lift them from the supported wafer or film-frame presentation and place them into the required frame, carrier, binning area or other configured output for the next production stage.

This process relationship is more important than the model name alone. A suitable machine must connect the incoming material presentation, the available map data, the pickup method and the required sorted output as one complete die-handling route.

Key Features of the ASM MS100 Platform

• Wafer map guided sorting: The machine uses upstream map, bin or recipe data to determine which die should be selected and where each die should be routed.

• Automated die pickup and placement: Installed pickup, ejector, alignment and motion hardware carry out the physical transfer from the incoming frame to the configured output.

• Vision and alignment support: The actual camera, lighting and alignment arrangement should be checked on the individual machine because it affects die recognition, orientation and placement.

• Configurable input and output route: Frame presentation, output media, number of grades and carrier arrangement can vary between used machines and production projects.

• Used-equipment flexibility: The MS100 remains available in the secondary market for replacement, capacity recovery, legacy process support and model-specific sourcing requirements.

Technical Reference

Numeric performance, die range, frame size, cycle time, utility requirements and placement capability should not be taken from a generic market listing and applied to every MS100. The quotation and machine record should identify the values that belong to the specific unit.

Project Fit for Die Sorting

An initial application review should follow the die through the complete route. The incoming wafer or film frame must present the die correctly to the pickup position; the die size, thickness, orientation and surface condition must be compatible with the installed pickup method; the available wafer map or bin data must work with the machine software; and the sorted output must match the carrier, grade structure and next production step.

A frame image or drawing, a short description of the die, available map-data information and the required output are normally enough to begin the review. More detailed engineering data can be confirmed after the basic route has been understood.

Used ASM MS100 Configuration Review

Two machines carrying the same MS100 model name may not have the same production capability. Before quotation, the available unit should be reviewed through its nameplate, machine photographs, installed modules, software records, tooling, operating evidence and delivery list.

The review should show how the machine is configured to load the incoming material, how the die is picked and aligned, what production data can be read, where the sorted die is placed and which accessories are included. It should also identify known missing items, faults, optional work and any preparation required before the machine can be introduced into the intended process.

Available Configuration and Delivery Scope

Used MS100 machines can differ by production year, previous application, frame route, pickup assembly, camera arrangement, controller, software, output module and supplied accessories. The equipment may be offered as-is, in working condition, after functional review or with additional refurbishment work, depending on the actual machine and quotation.

The final offer should clearly state the machine identity, current condition, included tooling and documentation, known limitations, packing method, logistics responsibility and any optional inspection, repair, installation or process-support work. No service should be treated as included unless it is written into the quotation or contract.

ASM MS100 and Related Model Names

ASM MS100, ASM MS100 Plus and ASM MS100 Plus II are separate model names within the wider MS100 equipment family. They should not be treated as interchangeable, and a Plus or Plus II designation should not be used to assume a fixed speed, head arrangement, wafer range or vision configuration without machine-specific evidence.

For a model-level overview, visit the ASMPT MS100 page. Related model pages are also available for the ASMPT MS100 Plus and ASMPT MS100 Plus II.

ASM MS100 FAQ