The ASMPT FT2026 is a fully automatic turret-based test system developed for testing, visual inspection, sorting and packing of medium to large semiconductor devices.
Equipped with a 26-nozzle turret and support for up to 16 parallel test stations, the FT2026 provides the handling flexibility required for semiconductor production involving different package formats and test configurations.
The system supports several input and output methods, including vibratory bowl, tube, metal tray, JEDEC tray and tape-and-reel handling. It is suitable for BGA, SOIC, TSSOP, MSOP, QFN, DFN, WLCSP, magnetic sensors, optical sensors and distance sensors larger than 2 × 2 mm².
We supply used and refurbished ASMPT FT2026 machines according to current inventory. The installed test sites, tester interface, loading modules, output configuration, software version and optional functions must be verified before purchase.

ASMPT FT2026 Specifications
| Parameter | Specification |
|---|---|
| Manufacturer | ASMPT |
| Model | FT2026 |
| Equipment Type | Fully Automatic Turret Test Handler |
| Recommended Device Size | Above 2 × 2 mm² |
| Turret Configuration | 26 Nozzles |
| Parallel Test Sites | Up to 16 |
| Vision Inspection | Six-Sided Vision Inspection |
| Input Options | Vibratory Bowl, Tube, Metal Tray and JEDEC Tray |
| Output Options | Tube, Tray and Tape-and-Reel Configuration |
| Typical Applications | Medium and Large IC Packages, Discrete Devices and Sensors |
| Supported Packages | BGA, SOIC, TSSOP, MSOP, QFN, DFN and WLCSP |
| Machine Dimensions | 1,850 × 1,750 × 2,170 mm |
| Equipment Condition | Used or Refurbished |
| Availability | Subject to Current Inventory |
The final configuration depends on the installed machine modules. Device compatibility, test capacity and handling methods must be confirmed according to the actual equipment.
Key Features
26-Nozzle Turret System
The ASMPT FT2026 uses a 26-nozzle turret to move devices through loading, alignment, testing, vision inspection, sorting and packing processes.
This configuration supports continuous device transfer while allowing multiple process stations to operate within the same production cycle.
The condition and quantity of the installed nozzles should be checked when evaluating used equipment because nozzle type and setup may vary according to the processed device.
Up to 16 Parallel Test Stations
The FT2026 can support as many as 16 parallel test stations, depending on the installed machine configuration and tester interface.
A higher number of parallel test sites can improve overall production capacity when the electrical test time is relatively long. Actual performance is influenced by the number of active sites, device handling time, test duration and communication with the connected tester.
Not every used FT2026 machine includes all 16 test sites. The installed configuration must therefore be confirmed before quotation.
Multiple Input and Output Methods
One of the main advantages of the FT2026 is its support for several device loading and unloading formats.
Available configurations may include:
Vibratory bowl feeding
Tube loading
Metal tray handling
JEDEC tray handling
Tape-and-reel output
Tray output
Tube output
The correct configuration should be selected according to the incoming device format, package dimensions, production process and required final packing method.
Six-Sided Vision Inspection
The integrated vision system supports inspection of multiple device surfaces during the handling process.
Depending on the installed cameras, lighting and software functions, the machine can be configured to check device orientation, appearance, package condition and other visual characteristics before sorting or packing.
Vision functions should be verified using actual product samples when the application requires specific defect inspection standards.
Thin-Device Contact Control
Optional contact-control functions can help manage the test pressing force applied to thin or sensitive semiconductor packages.
This is particularly important when excessive contact force could damage the package, affect test consistency or reduce product yield.
The installed contact mechanism and optional functions should be checked according to device thickness and test requirements.
Automated Tape-and-Reel Functions
When equipped with the corresponding modules, the FT2026 can support automated tape replenishment, post-seal inspection and automatic reel changing.
These functions help reduce manual intervention during long production runs and support more consistent final packing.
Tape width, carrier pocket dimensions, cover tape, sealing temperature and reel specifications should be confirmed before the machine is configured for production.
Input and Output Configuration Options
The loading and unloading configuration is one of the most important factors when selecting an ASMPT FT2026.
| Handling Method | Typical Application | Information to Confirm |
| Vibratory Bowl | Loose semiconductor devices | Device shape, surface condition and feeding orientation |
| Tube | Tube-packed IC devices | Tube size, package direction and unloading method |
| Metal Tray | Customized production processes | Tray dimensions, pocket layout and device orientation |
| JEDEC Tray | Medium and large semiconductor packages | Tray standard, package size and stacking requirements |
| Tape and Reel | Finished device packing | Tape width, pocket dimensions, cover tape and reel size |
The installed feeding and packing modules can differ significantly between used machines. Configuration photos and module information should be reviewed before confirming an order.
Suitable Applications
The ASMPT FT2026 is designed for medium to large semiconductor devices and applications that require flexible material handling or a higher number of parallel test stations.
Typical applications include:
BGA semiconductor packages
SOIC packages
TSSOP packages
MSOP packages
QFN packages
DFN packages
WLCSP devices
Magnetic sensors
Optical sensors
Distance sensors
General integrated circuits
Discrete semiconductor devices
Logic and analog semiconductor products
For devices smaller than the recommended size range, the ASMPT FT2018 or FT-mini may be more suitable depending on the package dimensions and production requirements.
Why Source the FT2026 From Us?
We supply used and refurbished semiconductor equipment for production expansion, equipment replacement and backup-machine requirements.
Our available support may include:
ASMPT FT2026 equipment sourcing
Machine model and serial-number verification
Configuration confirmation
Test-site quantity verification
Input and output module checks
Equipment condition inspection
Machine photos and operating videos
Refurbishment coordination
Spare-parts support
Export packing
International transportation
Remote technical communication
All machine specifications, accessories and optional functions are subject to verification based on the actual equipment.
Frequently Asked Questions
What device sizes can the ASMPT FT2026 process?
The FT2026 is designed primarily for semiconductor devices larger than 2 × 2 mm².
Final compatibility depends on package dimensions, thickness, device shape, nozzle configuration, feeding method, test interface and required output format.
How many test sites does the FT2026 support?
The ASMPT FT2026 can support up to 16 parallel test stations.
The number of installed and operational test sites may be different on each used machine. This information must be checked before the equipment is quoted.
What input methods are available for the FT2026?
Depending on its configuration, the FT2026 can support vibratory bowl, tube, metal tray and JEDEC tray loading.
The required input method should be confirmed based on how the semiconductor devices are supplied to the production line.
Can the FT2026 support tape-and-reel packing?
Yes. The FT2026 can be configured for tape-and-reel output.
Optional functions may include automatic tape replenishment, post-seal inspection and automatic reel changing. The installed modules should be verified on the actual machine.
Is every used FT2026 configured in the same way?
No. Individual machines may have different tester interfaces, test-site quantities, feeding systems, tray modules, vision configurations, software versions and packing functions.
A complete configuration check is required before purchase.
What information is required to confirm compatibility?
Please provide the device package, dimensions, thickness, tester model, required test-site quantity, input format, output format and inspection requirements.
Photos or technical information from an existing production line can also help verify the required configuration.
Is the equipment supplied as used or refurbished?
The FT2026 may be supplied in used or refurbished condition depending on inventory and customer requirements.
The machine condition, inspection scope and refurbishment work should be defined before the order is confirmed.
What should be inspected before purchasing a used FT2026?
Important inspection areas include the turret system, nozzles, test stations, contact mechanism, vision system, input modules, tray handling, tape-and-reel system, safety sensors, software operation and electrical and pneumatic systems.
Request ASMPT FT2026 Availability
Looking for an ASMPT FT2026 automatic turret test handler?
Send us your device package, tester model, required test-site quantity, loading method, output format, destination country and preferred machine condition.
We will check the available equipment and provide the corresponding configuration information, machine photos, operating condition and quotation.
