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ASMPT FT2026 Test Handler | Used Semiconductor Equipment

ASMPT FT2026 Test Handler | Used Semiconductor Equipment

The ASMPT FT2026 is a fully automatic turret-based test system developed for testing, visual inspection, sorting and packing of medium to large semiconductor devices.Equipped with a 26-nozzle turret and support for up to 16 parallel test stations, the FT2

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The ASMPT FT2026 is a fully automatic turret-based test system developed for testing, visual inspection, sorting and packing of medium to large semiconductor devices.

Equipped with a 26-nozzle turret and support for up to 16 parallel test stations, the FT2026 provides the handling flexibility required for semiconductor production involving different package formats and test configurations.

The system supports several input and output methods, including vibratory bowl, tube, metal tray, JEDEC tray and tape-and-reel handling. It is suitable for BGA, SOIC, TSSOP, MSOP, QFN, DFN, WLCSP, magnetic sensors, optical sensors and distance sensors larger than 2 × 2 mm².

We supply used and refurbished ASMPT FT2026 machines according to current inventory. The installed test sites, tester interface, loading modules, output configuration, software version and optional functions must be verified before purchase.

ASMPT FT2026 Test Handler

ASMPT FT2026 Specifications

ParameterSpecification
ManufacturerASMPT
ModelFT2026
Equipment TypeFully Automatic Turret Test Handler
Recommended Device SizeAbove 2 × 2 mm²
Turret Configuration26 Nozzles
Parallel Test SitesUp to 16
Vision InspectionSix-Sided Vision Inspection
Input OptionsVibratory Bowl, Tube, Metal Tray and JEDEC Tray
Output OptionsTube, Tray and Tape-and-Reel Configuration
Typical ApplicationsMedium and Large IC Packages, Discrete Devices and Sensors
Supported PackagesBGA, SOIC, TSSOP, MSOP, QFN, DFN and WLCSP
Machine Dimensions1,850 × 1,750 × 2,170 mm
Equipment ConditionUsed or Refurbished
AvailabilitySubject to Current Inventory

The final configuration depends on the installed machine modules. Device compatibility, test capacity and handling methods must be confirmed according to the actual equipment.

Key Features

26-Nozzle Turret System

The ASMPT FT2026 uses a 26-nozzle turret to move devices through loading, alignment, testing, vision inspection, sorting and packing processes.

This configuration supports continuous device transfer while allowing multiple process stations to operate within the same production cycle.

The condition and quantity of the installed nozzles should be checked when evaluating used equipment because nozzle type and setup may vary according to the processed device.

Up to 16 Parallel Test Stations

The FT2026 can support as many as 16 parallel test stations, depending on the installed machine configuration and tester interface.

A higher number of parallel test sites can improve overall production capacity when the electrical test time is relatively long. Actual performance is influenced by the number of active sites, device handling time, test duration and communication with the connected tester.

Not every used FT2026 machine includes all 16 test sites. The installed configuration must therefore be confirmed before quotation.

Multiple Input and Output Methods

One of the main advantages of the FT2026 is its support for several device loading and unloading formats.

Available configurations may include:

  • Vibratory bowl feeding

  • Tube loading

  • Metal tray handling

  • JEDEC tray handling

  • Tape-and-reel output

  • Tray output

  • Tube output

The correct configuration should be selected according to the incoming device format, package dimensions, production process and required final packing method.

Six-Sided Vision Inspection

The integrated vision system supports inspection of multiple device surfaces during the handling process.

Depending on the installed cameras, lighting and software functions, the machine can be configured to check device orientation, appearance, package condition and other visual characteristics before sorting or packing.

Vision functions should be verified using actual product samples when the application requires specific defect inspection standards.

Thin-Device Contact Control

Optional contact-control functions can help manage the test pressing force applied to thin or sensitive semiconductor packages.

This is particularly important when excessive contact force could damage the package, affect test consistency or reduce product yield.

The installed contact mechanism and optional functions should be checked according to device thickness and test requirements.

Automated Tape-and-Reel Functions

When equipped with the corresponding modules, the FT2026 can support automated tape replenishment, post-seal inspection and automatic reel changing.

These functions help reduce manual intervention during long production runs and support more consistent final packing.

Tape width, carrier pocket dimensions, cover tape, sealing temperature and reel specifications should be confirmed before the machine is configured for production.

Input and Output Configuration Options

The loading and unloading configuration is one of the most important factors when selecting an ASMPT FT2026.

Handling MethodTypical ApplicationInformation to Confirm
Vibratory BowlLoose semiconductor devicesDevice shape, surface condition and feeding orientation
TubeTube-packed IC devicesTube size, package direction and unloading method
Metal TrayCustomized production processesTray dimensions, pocket layout and device orientation
JEDEC TrayMedium and large semiconductor packagesTray standard, package size and stacking requirements
Tape and ReelFinished device packingTape width, pocket dimensions, cover tape and reel size

The installed feeding and packing modules can differ significantly between used machines. Configuration photos and module information should be reviewed before confirming an order.

Suitable Applications

The ASMPT FT2026 is designed for medium to large semiconductor devices and applications that require flexible material handling or a higher number of parallel test stations.

Typical applications include:

  • BGA semiconductor packages

  • SOIC packages

  • TSSOP packages

  • MSOP packages

  • QFN packages

  • DFN packages

  • WLCSP devices

  • Magnetic sensors

  • Optical sensors

  • Distance sensors

  • General integrated circuits

  • Discrete semiconductor devices

  • Logic and analog semiconductor products

For devices smaller than the recommended size range, the ASMPT FT2018 or FT-mini may be more suitable depending on the package dimensions and production requirements.

Why Source the FT2026 From Us?

We supply used and refurbished semiconductor equipment for production expansion, equipment replacement and backup-machine requirements.

Our available support may include:

  • ASMPT FT2026 equipment sourcing

  • Machine model and serial-number verification

  • Configuration confirmation

  • Test-site quantity verification

  • Input and output module checks

  • Equipment condition inspection

  • Machine photos and operating videos

  • Refurbishment coordination

  • Spare-parts support

  • Export packing

  • International transportation

  • Remote technical communication

All machine specifications, accessories and optional functions are subject to verification based on the actual equipment.

Frequently Asked Questions

What device sizes can the ASMPT FT2026 process?

The FT2026 is designed primarily for semiconductor devices larger than 2 × 2 mm².

Final compatibility depends on package dimensions, thickness, device shape, nozzle configuration, feeding method, test interface and required output format.

How many test sites does the FT2026 support?

The ASMPT FT2026 can support up to 16 parallel test stations.

The number of installed and operational test sites may be different on each used machine. This information must be checked before the equipment is quoted.

What input methods are available for the FT2026?

Depending on its configuration, the FT2026 can support vibratory bowl, tube, metal tray and JEDEC tray loading.

The required input method should be confirmed based on how the semiconductor devices are supplied to the production line.

Can the FT2026 support tape-and-reel packing?

Yes. The FT2026 can be configured for tape-and-reel output.

Optional functions may include automatic tape replenishment, post-seal inspection and automatic reel changing. The installed modules should be verified on the actual machine.

Is every used FT2026 configured in the same way?

No. Individual machines may have different tester interfaces, test-site quantities, feeding systems, tray modules, vision configurations, software versions and packing functions.

A complete configuration check is required before purchase.

What information is required to confirm compatibility?

Please provide the device package, dimensions, thickness, tester model, required test-site quantity, input format, output format and inspection requirements.

Photos or technical information from an existing production line can also help verify the required configuration.

Is the equipment supplied as used or refurbished?

The FT2026 may be supplied in used or refurbished condition depending on inventory and customer requirements.

The machine condition, inspection scope and refurbishment work should be defined before the order is confirmed.

What should be inspected before purchasing a used FT2026?

Important inspection areas include the turret system, nozzles, test stations, contact mechanism, vision system, input modules, tray handling, tape-and-reel system, safety sensors, software operation and electrical and pneumatic systems.

Request ASMPT FT2026 Availability

Looking for an ASMPT FT2026 automatic turret test handler?

Send us your device package, tester model, required test-site quantity, loading method, output format, destination country and preferred machine condition.

We will check the available equipment and provide the corresponding configuration information, machine photos, operating condition and quotation.

Why do so many people choose to work with GeekValue?

Our brand is spreading from city to city, and countless people have asked me, "What is GeekValue?" It stems from a simple vision: to empower Chinese innovation with cutting-edge technology. This is a brand spirit of continuous improvement, hidden in our relentless pursuit of detail and the delight of exceeding expectations with every delivery. This almost obsessive craftsmanship and dedication is not only the persistence of our founders, but also the essence and warmth of our brand. We hope you will start here and give us an opportunity to create perfection. Let us work together to create the next "zero defect" miracle.

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