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ASMPT MS100 Map Sorter | Used Wafer Die Sorting Equipment
Used ASMPT MS100 map sorter for wafer map-based die picking, sorting and output placement. Check the actual machine conf...
Wafer map based die sorting
ASMPT MS100 Map Sorter
The ASM MS100 is a wafer mapping die sorter that uses prepared map or bin data to pick selected die from a wafer or film frame and place them into a configured sorted output. Review current equipment or send your die-sorting route to check a specific used machine.
Also listed as ASMPT MS100. This is a map-based die handling platform rather than a packaged-device thermal or ATE test handler.
Equipment and sourcing
Check Current Availability
ASMPT MS100 Equipment and Sourcing
Review the machines currently listed below, or send the MS100 model and your intended die-sorting route so that an unlisted unit can be checked through the available sourcing channels.
Need an MS100 that is not currently listed?
Tell us how the die arrives, how it is identified from the map or bin data and where it needs to go after sorting; this gives the sourcing review enough context to look for a machine with a suitable handling route.
Process position and internal routes
MS100 in the Wafer Test, Sorting and Die Handling Flow
The MS100 uses wafer map or bin information prepared upstream to select and physically route die into the required sorted output. The three stages below also connect this model page with the related equipment categories already available on the GEEKVALUE website.
Upstream data
Wafer probing, inspection and grading
Before sorting begins, the upstream process identifies die positions and grades and prepares the map or bin data that tells the MS100 which die should be selected.
ASM MS100
Map-guided die pickup and sorting
The MS100 reads the prepared production data, locates the selected die and transfers it through the installed pickup, vision and output route. The actual machine configuration determines which input and destination media can be used.
Downstream use
Sorted output and the next production step
The selected die may leave the sorter in a frame, carrier or another supported output before moving to storage, inspection, packaging or a die-attach operation.
This process relationship helps a buyer move from the MS100 model page to the relevant upstream, handler and downstream equipment sections without treating the sorter as a stand-alone machine.
Return to Test Handler Equipment →
Machine overview
MS100 Technical Reference
Public used-equipment records consistently identify the MS100 as a wafer mapping die sorter. A few operating values are also repeated across secondary listings, but they should be treated as reference figures until the actual machine documents and configuration are checked.
Manufacturer and modelASM / ASM Pacific Technology MS100
Equipment typeWafer mapping die sorter / LED map sorter
Handling conceptMap-guided pick, sort and placement using the installed die-handling route
Reported cycle timeAbout 120–125 ms in secondary market descriptions; confirm by product, recipe and machine condition
Reported throughputUp to approximately 30,000 UPH in secondary descriptions; not a guaranteed value for every used unit
Reported input capabilitySome used listings describe film or wafer-frame handling up to 6 inches; the installed frame route must be checked
Final technical values, installed modules, utilities and output capability should follow the actual machine record and quotation.
Project fit
Match the MS100 to the Complete Die Route
A useful project review connects three practical questions: how the die reaches the sorter, what production data tells the machine to select, and where the sorted die must go next. Together, these points show whether an available MS100 configuration is worth reviewing further.
Incoming wafer, frame and die condition
The incoming presentation must work with the machine's loading and pickup route. A frame image or drawing, together with a simple description of the die size, orientation and surface condition, helps show whether the installed handling and tooling can present and lift the die without unnecessary conversion work.
Wafer map, bin data and sorting logic
The MS100 needs usable map, bin or recipe information to identify the selected die and route each grade correctly. The available data format and grade definitions therefore need to work with the installed software; otherwise the physical machine may be suitable while the intended sorting sequence still cannot be reproduced.
Destination, grade count and next operation
The output arrangement must match the process that follows the sorter. The required carrier or frame, number of grades, placement pattern, target volume and changeover needs can alter the output modules and operating setup, so the destination is as important as the incoming material.
A first review does not require a finished specification sheet. Send a frame image or drawing and explain how the die is graded and where it needs to be placed; the remaining details can be confirmed after the complete route is understood.
Discuss Your Die-Sorting Route
Used machine review
What to Verify on the Actual Used ASM MS100
Project fit explains what the production route requires. This review looks at the individual used machine and the evidence needed to understand what is installed, what may be missing and what the quotation will actually include.
01
Machine identity and available history
The quotation should identify the complete model, manufacturer marking, serial number and production year when available. Equipment photographs, maintenance information and ownership records help distinguish the actual unit from a generic MS100 description and may reveal previous modifications or missing sections.
Purchasing impact: confirms which machine is being quoted and reduces confusion between similar model names or rebuilt units.02
Installed handling and vision configuration
Used MS100 machines may have different frame-loading modules, pickup heads, ejector arrangements, cameras, lighting and output hardware. These installed components determine what the machine can physically handle, so photographs and configuration records should be compared with the intended die route before price becomes the main decision.
Purchasing impact: shows whether the machine already supports the material route or needs conversion hardware.03
Software, programs and included tooling
Software version, map-data support, recipes, program backups and included tooling can affect how quickly the machine can be introduced into production. Missing holders, carriers, pickup tools or software records may create additional engineering work even when the base machine powers on normally.
Purchasing impact: identifies hidden preparation work that may not appear in the equipment price.04
Operating evidence and delivery scope
A useful review should show more than a powered control screen. Motion, vision, pickup and output functions should be demonstrated as far as the machine condition allows, while the quotation should state the included accessories, known faults, packing method and any work that is outside the delivery scope.
Purchasing impact: connects the observed condition with the accessories, services and responsibilities included in the final quotation.Once the project route and the actual machine configuration have both been reviewed, the quotation can separate what is already usable from what still requires tooling, software work or replacement parts.
Request the Actual Machine Details
Model family
Explore the ASM MS100 Series
The three model names are reviewed on separate pages so users can move directly to the machine they are searching for without treating MS100, MS100 Plus and MS100 Plus II as interchangeable.
Buyer questions
ASMPT MS100 FAQ
These questions address the points that commonly affect whether a used machine is worth reviewing further.
Is the ASM MS100 a test handler or a map sorter?
The MS100 is more accurately described as a wafer mapping die sorter. It may sit beside semiconductor grading and test operations, but its main role is to use prepared map or bin information to carry out the physical die-sorting route.
What should a buyer send before asking whether an MS100 will fit?
A short description of how the die enters the process, how it is identified and where it must be placed after sorting is usually more useful than a long equipment checklist. A frame image, die drawing or sample data file can be added when available.
Can every used ASM MS100 handle the same product?
No. The installed media route, pickup hardware, vision, software and tooling can change what a particular machine can handle, so suitability should be checked against the actual unit rather than the model name alone.
Are MS100, MS100 Plus and MS100 Plus II the same machine?
They are separate model names within the wider MS100 family. Each page and each available machine should be reviewed independently because the suffix alone does not prove a specific hardware or performance difference.
Can GEEKVALUE source an MS100 that is not currently listed?
You can submit the model and intended die-sorting route for a sourcing review. Availability, machine condition, configuration and delivery scope will then follow the equipment actually found.
Request a useful quotation
Describe the Die Route, Then Match the MS100
Tell us how the die arrives, how the grading information is provided and what the sorted output must look like. We can then review the available machine, explain the configuration points that matter and prepare a quotation around the actual equipment rather than a generic model description.
