Device Movement, Orientation & Sorting

Semiconductor Chip Handler Equipment

A semiconductor chip handler moves devices from their incoming media to inspection, electrical test or finishing stations, keeps each chip correctly oriented and traceable, then places it into the required output bin, tray, tube or tape. The right machine depends on where the device starts, how fragile it is, what operations must happen in the middle and how the accepted and rejected chips should leave the system.

Browse Chip Handler Equipment Discuss Your Chip Handling Requirement

Tray / Tube / Film Frame Vision & Orientation Test / Inspect / Sort Bare Die / Packaged Devices

Follow the Chip, Not Only the Machine Name The handling route should be clear from input media to the final accepted, rejected or graded output.

01LoadTray, tube, strip, carrier or film frame

02IdentifyOrientation, code, map or device position

03PresentInspection, contact, marking or test station

04GradePass, fail, class, visual result or bin code

05OutputTray, tube, tape, reconstructed wafer or bins

Start and Finish

Where Does the Chip Enter, and Where Must It Go?

Two machines may both be called semiconductor chip handlers while using completely different loading, motion and output systems. Begin with the device media and destination before comparing speed or brand.

Route 01

Tray to Tray

Singulated packaged devices or delicate components loaded in JEDEC or custom trays.

Tray compatibility

Tray geometry, pocket depth, pickup surface and device orientation determine whether the existing loader, nest and vision setup can be reused.

Route 02

Tube or Bowl to Tape

Devices supplied in tubes, feeders or bulk-oriented input for high-speed finishing.

Orientation and packing

The route must keep devices oriented from bulk or tube input through indexing, inspection or test, then place each result into the correct tape pocket or reject output.

Route 03

Film Frame to Output Media

Diced devices remain on film frame after singulation and must be picked without damaging the die or package.

Pickup and map control

Wafer-map data, ejector support, pickup force and die orientation must remain linked when devices move from film frame to tray, tape or reconstructed-wafer output.

Route 04

Strip or Carrier Handling

Devices are tested or inspected before complete singulation or while mounted on a carrier.

Carrier and contact plan

Strip size, carrier support, contact layout and post-test separation determine whether the platform can process the product before or after singulation.

Route 05

Turret Test and Finishing

Individual devices rotate through multiple stations for test, inspection, marking and sorting.

Station sequence

The useful configuration depends on station order, pickup method, inspection and tester connections, marking requirements and the final bin, tray or tape route.

Current Equipment

Available Semiconductor Chip Handler Equipment

Browse the current collection, then confirm the input media, device size, required stations, output format and installed conversion hardware for the actual machine.

Model name is only the starting point. The usable chip route depends on the installed kits, vision, thermal modules, interface, software and input/output configuration supplied with the equipment.

ASM Pacific Technology Turret Wafer Level Test System SUNBIRD

SUNBIRD provides an efficient, reliable and flexible wafer testing solution for the semiconductor industry through innov...

ASM MS100 Plus test handler

As an upgraded version of the MS100, the ASM MS100 Plus is also a device for chip sorting and arrangement based on wafer...

ISMECA test handler NY20

The ISMECA NY20 (now owned by Cohu) is a 20-station rotary ultra-high-speed semiconductor testing and sorting machine

ASMPT sorting machine MS90

ASM sorting machine MS90 is a device designed for lamp bead sorting, with efficient and accurate sorting functions. This...

Handling Integrity

Keep Every Chip Oriented, Traceable and Undamaged

High throughput is useful only when the handler protects the device, preserves lot identity and presents each chip correctly to the next operation. These risks often determine the real machine configuration.

Fragility

Pickup and Placement Force

Bare die, WLCSP, thin packages, MEMS, sensors and optoelectronic devices may require controlled vacuum, compliant contact, edge support or a dedicated pickup surface.

Orientation

Rotation, Polarity and Vision

The system must recognize the device, verify orientation and place it consistently before inspection, electrical contact, marking or output packing.

Traceability

Wafer Map, Lot and Code Data

Map position, barcode, OCR, recipe, bin result and output location may need to remain linked throughout the handling route.

Contact

Stable Presentation to the Test or Inspection Station

Socket alignment, contact force, coplanarity and dwell time affect repeatability even when the electrical measurement is performed by separate ATE.

Sorting

Correct Output for Every Result

Accepted, rejected and graded devices may leave through different trays, tubes, bins, reels or reconstructed wafer positions.

Operations That May Be IntegratedActual station availability depends on the handler platform and installed configuration.

VISION

Orientation and Surface Inspection

Top, bottom, sidewall, bump, lead or code inspection may be added before or after testing.

TEST

Electrical or Functional Test Presentation

The handler places the device at the contact interface while the ATE or dedicated tester performs the measurement.

THERMAL

Ambient, Hot or Cold Conditioning

Temperature capability must match the device power, test time, thermal soak method and required accuracy.

MARK

Laser Marking or Identification

Some finishing handlers integrate marking, code verification and reinspection before output.

PACK

Tray, Tube, Tape or Bin Output

The final pack format and grade logic should be defined before conversion kits and automation are selected.

Define the Middle

What Must Happen Between Input and Output?

The term chip handler can describe more than a simple transport machine. Depending on the platform, it may present devices to electrical test, rotate them through inspection stations, apply marking, classify results and prepare the final output media.

List every required station in process order.
Separate mandatory functions from future options.
Confirm whether the tester, camera, marker or thermal system is included.
Check how pass/fail and grading data control the output path.

Device Route Compatibility

Build the Required Chip Route Before Matching a Machine

A semiconductor device handler is useful only when its installed tooling can carry your device from the actual incoming media through the required stations and into the correct output. Define that route before comparing model names or advertised speed.

Device and Pickup Surface

Record package or die dimensions, thickness, weight, warpage, fragile surfaces and the face that may safely contact a nozzle, gripper, nest or ejector.

Incoming Media

State whether devices arrive in trays, tubes, strips, bowls, carriers or film frames, including pocket geometry, orientation and unloading constraints.

Identification and Orientation

Define polarity, rotation, wafer-map use, barcode or OCR requirements and the point at which the machine must confirm device identity.

Required Station Sequence

List inspection, electrical test, thermal conditioning, marking, reinspection and grading in the order the device must visit them.

Result and Sorting Logic

Explain how pass, fail, recheck, visual defect, electrical bin or customer grade should control the next destination.

Final Output and Line Connection

Confirm tray, tube, reel, reconstructed wafer or bin output together with tester, MES, traceability and factory-utility connections.

Evidence From the Actual Machine

Ask for the parts that make the route possible

Handling hardwarePick heads, nozzles, nests, guides, rails, feeders, ejectors and change parts supplied with the machine.
Vision and softwareCamera positions, optics, lighting, OCR, orientation functions, recipes and active licenses.
Test or process interfacesSocket, contactor, HIFIX, tester docking, marker, thermal module and communication hardware.
Output automationBin count, tray or reel handling, label or barcode functions and result-to-output mapping.
Demonstrated operationMotion accuracy, vacuum, pneumatics, calibration state, sample run and known limitations.

A platform specification shows what a machine family may support. The quotation should identify what is installed, included and demonstrated on the individual unit.

Common Questions

Semiconductor Chip Handler FAQ

These questions focus on device movement and output integrity rather than repeating the general Test Handler, machine-structure or IC-package pages.

Is a semiconductor chip handler the same as a test handler?

The terms often overlap. A test handler is specifically used to automate device presentation, temperature control and sorting around electrical final test. The broader term semiconductor chip handler may also be used for platforms that combine transport with vision inspection, marking, packaging or other finishing operations. The actual station list must be checked for each machine.

Can a chip handler process bare die as well as packaged devices?

Some platforms are designed for singulated packaged ICs, while others can pick diced die directly from film frame or handle delicate wafer-level packages. Suitability depends on the pickup method, device support, ejector, vision, handling force and output media.

Which input and output formats can a semiconductor chip handler support?

Possible formats include trays, tubes, strips, carriers, film frames, bowls, tape and reel, reconstructed wafers and multiple sorting bins. No machine should be assumed to support all formats without confirming the installed modules and conversion kits.

What causes chip damage or orientation errors during handling?

Common causes include unsuitable pickup force, worn nozzles or nests, incorrect vacuum, device warpage, contaminated optics, unstable motion, poor lighting, wrong recipe data and mismatched conversion tooling.

Can a used chip handler be converted for a different device?

Often it can, but the conversion may require new pick heads, nozzles, nests, feeders, trays, guides, contact hardware, cameras, software or output modules. The conversion cost should be reviewed before the machine is purchased.

What information is needed for a chip handler quotation?

Send the device drawing or package size, starting media, required operations, output media, tester or inspection requirement, temperature range, throughput target, preferred condition, quantity and destination.

Define the Complete Chip Route Before Selecting the Handler

Share the device, incoming media, required inspection or test stations, output format, throughput target and destination. We will review the available semiconductor chip handler equipment and the conversion work that may be required.

Request Equipment Matching Include drawings, tray or film-frame details and the tester or finishing equipment already used on the line when available.

Semiconductor Chip Handler Equipment