ASMPT MS100 Plus II Map Sorter | Used Die Sorting Machine

The ASM MS100 Plus II, also searched as the ASMPT MS100 Plus II, is a separately listed model within the MS100 equipment family. Public used-equipment records identify individual Plus II units as map sorters, supporting a wafer-map-based die pickup and sorting role without proving that every machine has the same installed hardware, software or output route.

ASM MS100 Plus II Equipment Overview

The MS100 Plus II is used to transfer selected die according to production map, bin or recipe information. Its practical capability depends on the actual machine: how the incoming wafer or film frame is presented, how the die is picked and aligned, what data the installed software can interpret and where the selected die must be placed after sorting.

The complete model name should be used when requesting photographs, machine labels and configuration records. MS100, MS100 Plus and MS100 Plus II appear as separate model names in the secondary market and should not be merged into one generic machine description.

Die Sorting Role of the MS100 Plus II

The Plus II sits between upstream die grading and the required sorted output. Wafer probing, inspection or another upstream operation prepares the die positions and grades. The machine then uses the available production data to locate the selected die, complete the pickup and alignment sequence and place the die into the configured destination for storage, inspection, assembly, packaging or another downstream step.

This page treats the MS100 Plus II as a map-sorting and die-handling platform. It does not assume that the machine itself performs electrical testing, thermal conditioning or the contact functions of a packaged-device final test handler.

Key Features to Review on the Plus II

• Distinct model identification: The complete MS100 Plus II name, manufacturer marking, serial number and production year should be matched with the actual machine photographs and records.

• Map-driven die selection: The sorting route depends on the wafer map, bin or recipe information supported by the installed software and production programs.

• Machine-specific handling route: Frame loading, ejector support, pickup hardware, alignment, output media and change parts should be reviewed as one connected system.

• Configuration-dependent vision and software: Camera layout, lighting, controller, program backups and data interface can vary between available used machines.

• Evidence-based used-equipment review: Operating demonstrations, configuration records and the delivery list are more reliable than generic model descriptions or automatically generated specifications.

Technical Reference

Public marketplace pages for the Plus II contain conflicting descriptions, including claims that classify the same model as a die attacher and assign unsupported speed, accuracy or automation features. These claims should not be used as standard specifications without an original machine document or evidence from the specific unit.

Matching the Plus II to the Production Route

Project matching begins with the physical and data relationship between the incoming die and the required output. The frame dimensions and die layout determine how the material reaches the pickup position. Die thickness, orientation and surface condition affect how the installed pickup and ejector system can handle the product. The wafer map, bin or recipe data must be readable by the installed software, while the output carrier, grade structure and placement pattern must fit the next production step.

A useful first review can begin with a frame photograph or drawing, a description of the die, the available production-data format and an explanation of where each sorted grade must go. This allows the available Plus II configuration to be compared with the complete route rather than with a disconnected specification list.

What to Verify on the Actual Used MS100 Plus II

The Plus II name identifies the model target, but the actual purchase decision should be based on the complete machine. The machine label and serial information should match the offer, while photographs should show the loading area, pickup and vision assemblies, controller, output modules and major accessories.

Software version, recipes, program backups, map-data compatibility, holders, carriers, pickup tools and manuals can directly affect the effort required to return the machine to production. Operating evidence should show as much of the motion, vision, pickup and output route as the available condition permits, and the quotation should identify known faults, missing items and any work not included.

Available Configuration and Delivery Scope

Used MS100 Plus II equipment may differ by year, previous process, module arrangement, software, tooling and current condition. A machine can be offered as-is, as a powered unit, after a functional review or with separately quoted repair and refurbishment work. These conditions should not be combined into one general product promise.

The final quotation should define the exact machine, included modules and accessories, available documentation, inspection or demonstration conditions, packing method, logistics responsibility, optional technical work and any warranty or service scope. Final acceptance criteria should be agreed around the actual machine and intended project.

MS100 Plus II Within the MS100 Family

The MS100 Plus II should be evaluated independently rather than treated as an automatically upgraded MS100 Plus. The Plus II designation does not by itself prove a fixed head count, die range, speed, accuracy, wafer size or output arrangement. Only differences supported by the machine label, original records, configuration list and operating evidence should be used in the purchase decision.

Visit the ASMPT MS100 Plus II model page for the broader sourcing overview. The related ASMPT MS100 and ASMPT MS100 Plus pages should be used as separate model references rather than interchangeable specifications.

ASM MS100 Plus II FAQ