Iindaba zeSemiconductor - Iphepha2

Thelekisa iiplatifomu ze-BESI DATACON 8800 FC QUANTUM kunye ne-CHAMEO ukuze ufumane ukugeleza kwakhona kobuninzi, ukuphuma kwefeni kunye nokupakisha okuphucukileyo. Hlola ukuhamba kwenkqubo, izixhobo kunye nokuhlolwa kwe-RFQ.

Thelekisa i-BESI DATACON 2200 evo plus vs evo kwiiprojekthi ze-die attach kunye ne-multi-chip. Hlola ikhamera, imbuyekezo yobushushu, izixhobo, ukuphathwa kunye nokuhlolwa koomatshini abasetyenzisiweyo.

Funda indlela yokukhetha i-BESI flip chip bonder yokupakisha i-mass reflow, i-multi-chip kunye ne-fan-out ngokuthelekisa ukuhamba kweenkqubo, izixhobo, umbono kunye neemfuno zokuphatha.

Kutheni oomatshini ababini be-BESI DATACON 2200 evo bangafani? Thelekisa iinguqulelo, iintloko zebhondi, umbono, izixhobo, ukuphatha kunye nesoftware ngaphambi kokuba uthenge.

Uceba ukuthenga i-BESI die bonder esetyenzisiweyo? Hlola iitshekhi ezili-12 ze-DATACON kunye ne-Esec ezigubungela uqwalaselo, izixhobo, i-FAT, isoftware kunye nenkxaso.

I-wire bonder yenye yezona matshini zibalulekileyo ezisetyenziswa ekupakisheni ii-semiconductor kunye nokwenza ii-microelectronics. Inoxanduva lokudala unxibelelwano lombane phakathi kwee-semiconductor chips kunye neepakethe leads kusetyenziswa ii-bonding wires ezincinci kakhulu.

Ii-wire bonders zizixhobo ezibalulekileyo ezisetyenziswa ekupakisheni ii-semiconductor, ekuhlanganiseni ii-IC, ekuveliseni ii-LED, nasekwenzeni ii-microelectronics. Zibonelela ngonxibelelwano oluchanekileyo lombane phakathi kwee-semiconductor chips kunye neepakethe leads zisebenzisa ii-fine bonding wires.