Nkhani za Semiconductor - Tsamba 2

Yerekezerani nsanja za BESI DATACON 8800 FC QUANTUM ndi CHAMEO kuti mupeze njira zowonjezerera mphamvu, kutulutsa mphamvu ndi kuyika zinthu zatsopano. Unikani momwe zinthu zikuyendera, kugwiritsa ntchito zida, ndi macheke a RFQ.

Yerekezerani BESI DATACON 2200 evo plus vs evo ya mapulojekiti a die attach ndi multi-chip. Unikani kamera, kubwezeretsanso kutentha, kugwiritsa ntchito zida, kusamalira ndi kuyang'ana makina ogwiritsidwa ntchito.

Phunzirani momwe mungasankhire BESI flip chip bonder kuti igwiritsidwe ntchito pokonzanso zinthu, ma chip ambiri komanso ma fan-out poyerekezera momwe zinthu zikuyendera, zida zogwiritsira ntchito, masomphenya, ndi zosowa zogwirira ntchito.

N’chifukwa chiyani makina awiri a BESI DATACON 2200 evo angasiyane? Yerekezerani mitundu, mitu ya ma bond, masomphenya, zida zogwiritsira ntchito, kusamalira ndi mapulogalamu musanagule.

Mukukonzekera kugula BESI die bonder yogwiritsidwa ntchito kale? Onaninso macheke 12 a DATACON ndi Esec okhudza kasinthidwe, zida, FAT, mapulogalamu ndi chithandizo.

Cholumikizira waya ndi chimodzi mwa makina ofunikira kwambiri omwe amagwiritsidwa ntchito popanga ma semiconductor packaging ndi microelectronics. Chimayang'anira kupanga kulumikizana kwamagetsi pakati pa ma semiconductor chips ndi ma package leads pogwiritsa ntchito mawaya olumikizana bwino kwambiri.

Ma waya omangirira ndi makina ofunikira omwe amagwiritsidwa ntchito popanga ma semiconductor packaging, IC assembly, LED production, ndi microelectronics. Amapereka kulumikizana kwamagetsi kolondola pakati pa ma semiconductor chips ndi ma package leads pogwiritsa ntchito ma fine bonding wards.