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BESI flip chip bonder iyenera kusankhidwa potengera njira yogwirira ntchito, osati dzina la makina okha.Pulatifomu yoyenera kugwiritsa ntchito chip yothamanga kwambiri yosinthira mphamvu yamagetsi siingakonzedwe kuti igwiritsidwe ntchito ngati multi-chip assembly sequence, njira yotulutsira fan-out, mtundu wapadera wa substrate kapena pulogalamu yomwe imafuna zida zosiyanasiyana, masomphenya, kayendetsedwe ndi kuyang'anira.
Ogula akufunafunaChitsulo cholumikizira chip cha IRON, Cholumikizira cha DATACON flip chip, Makina osinthira a BESI, choyikira chip chozungulirakapenaMakina a DATACONNthawi zambiri amayamba ndi dzina la nsanja. Komabe, poyambira kothandiza kwambiri ndi njira yeniyeni ya phukusi: ndi die iti yomwe iyenera kusinthidwa, momwe idzaperekedwere, ndi substrate iti kapena chonyamulira chiti chomwe chikugwiritsidwa ntchito, momwe kulumikizana kumatsimikizidwira, njira iti yazinthu zomwe zikufunika, ndi cholinga chotani chopangira chomwe chiyenera kukwaniritsidwa.
Bukuli likufotokoza momwe mungafananizire malangizo a BESI flip chip bonder a mass reflow, multi-chip ndi fan-out packaging workflows, ndi mafunso okonza makina omwe ayenera kuyankhidwa musanavomereze zida zogulira, kukonzanso kapena kuyenerera njira.
Mwachidule: Kodi BESI Flip Chip Bonder Iyenera Kusankhidwa Bwanji?
Sankhani BESI flip chip bonder poyamba pofotokoza njira ya phukusi, mtundu wa die, kapangidwe ka bump kapena interconnect, mtundu wa substrate, njira ya zinthu, ndondomeko yogwirira ntchito, zofunikira pakuwona, cholinga choyika ndi njira yopitira patsogolo. Kenako onetsetsani kuti DATACON kapena Esec yomwe ikuperekedwa ikuphatikizapo mitu yolumikizira yofunikira, zida zosinthira, kugwiritsira ntchito wafer, ma module a substrate, zida zogwiritsira ntchito, makamera, ntchito zowunikira, mapulogalamu ndi malo othandizira.
Mapulojekiti a flip chip obwezeretsanso nthawi zambiri amaika patsogolo liwiro la kupanga, kuyenda kwa zinthu zomwe zingabwerezedwe, komanso kuwongolera kwathunthu njira.
Mapulojekiti a multi-chip flip chip nthawi zambiri amafunika kusinthasintha, njira zingapo zogwirira ntchito komanso zida zinazake zomwe zimagwiritsidwa ntchito.
Njira zotulutsira ma feni ndi ma wafer zimafuna kuwunikanso mosamala momwe zinthu zimagwiritsidwira ntchito, njira yolumikizirana, ndondomeko ya ndondomeko, ndi momwe zimayendera.
Machitidwe awiri omwe ali ndi banja lomwelo la nsanja amatha kusiyana kwambiri pakugwiritsa ntchito zida zomwe zayikidwa komanso momwe angagwiritsire ntchito njira.
Chifukwa Chake Kusankha Flip Chip Bonder Kumayambira Ndi Njira Yogwirira Ntchito
Kupanga ma chip si ntchito yokhazikika yopanga. Kapangidwe ka zida zomwe zimafunikira kamasintha kutengera ngati njirayo imapangidwira pozungulira kufalikira kwa mass, kuyika ma chip kupita ku substrate, kuphatikiza ma chip ambiri, kulongedza ma fan-out, kugwiritsa ntchito ma panel kapena wafer, kulumikizana kwapamwamba kwambiri kapena kuyenda kwapadera kwa kupanga.
Pulatifomu ikhoza kukhala ndi liwiro lalikulu loyika, koma sizikutsimikizira kuti ili ndi njira yofunikira yosinthira die, gawo lokonzekera flux kapena zinthu, kusamalira chonyamulira, malo owonera, njira yowunikira pambuyo pa bond, zida zogwirira ntchito kapena njira yobwezeretsa.
Mfundo yosankha:Cholumikizira cha flip chip choyenera ndi makina omwe amatha kumaliza unyolo wofunikira ndi zida zoyenera, kayendedwe ka zinthu, njira yowonera komanso njira yotsimikizira.
Njira Zitatu Zopangira Flip Chip Zomwe Zimafuna Kusankha Zipangizo Zosiyana
1. Kupanga Ma Chip Otchedwa Mass Reflow Flip
Njira zosinthira ma flip chip nthawi zambiri zimayesedwa komwe kusonkhana kwa chip-to-substrate kwakukulu, kuyenda kwa zinthu zomwe zingabwerezedwe komanso kugwira ntchito bwino kwa kupanga ndizofunikira kwambiri. Munthawi imeneyi, makina ayenera kuthandizira mawonekedwe a die omwe akufunidwa, kusamalira substrate, kugwira ntchito kwa flip, kukonzekera zinthu, kuyika malo ndi njira yowongolera njira.
Poyesa BESI DATACON flip chip bonder ya njira iyi, ogula ayenera kuyang'ana kwambiri pa zipangizo zenizeni zopangira zomwe zayikidwa m'malo mongoyang'ana kuchuluka kwa zinthu zomwe zagwiritsidwa ntchito kuchokera mu bulosha la pulatifomu.
Kapangidwe ka kagwiritsidwe ntchito ka wafer ndi substrate
Njira yowonetsera chida chosinthira ndi chosinthira
Kusakaniza, kuviika kapena njira yopangira zinthu ngati kuli kofunikira
Kulinganiza masomphenya ndi kuzindikira zolozera za substrate
Ntchito zowunikira pambuyo pa bond kapena zowongolera njira
Zofunikira pakusintha zida ndi zida
2. Msonkhano wa Chip wa Multi-Chip Flip
Kusonkhanitsa ma chip ambiri kungayambitse kutsata njira zovuta kwambiri. Chinthu chimodzi chingafunike kukula kosiyana kwa ma die, zida zingapo, malo osiyanasiyana osankhidwira, njira zosiyanasiyana zoyika, njira yapadera yonyamulira katundu kapena njira zingapo zopangira mkati mwa njira imodzi yopangira.
Pa ntchito yamtunduwu, kusinthasintha kungakhale kofunika monga momwe zimakhalira ndi liwiro. Wogula ayenera kutsimikizira kuchuluka kwa mitu yogwirira ntchito yomwe yayikidwa, zida zomwe zingagwiritsidwe ntchito, momwe makina amagwirira ntchito kusintha kwa die, ngati ndondomeko ya ndondomeko ingakonzedwe komanso ma module azinthu zomwe zaphatikizidwa.
Dongosolo lomwe limagwira ntchito imodzi yobwerezabwereza mofulumira kwambiri silingakhale njira yoyenera yogwiritsira ntchito ma chip ambiri okhala ndi mitundu yosiyanasiyana ya ma die komanso njira yovuta kwambiri.
3. Kupaka Fan-Out ndi Wafer-Level
Mayendedwe a ntchito zotulutsira ma feni ndi ma wafer ayenera kuwunikidwanso poyerekeza ndi kapangidwe ka phukusi lenileni, njira yonyamulira kapena njira yonyamulira ma pulasitiki, njira yofotokozera malo, njira yogwiritsira ntchito ma die, zipangizo zogwirira ntchito, ndi zofunikira zowunikira. Mapulojekitiwa angayang'ane kwambiri kuwongolera kulumikizana, kukhazikika kwa ma pulasitiki, kutsata njira ndi kutsimikizira zokolola.
Musanasankhe nsanja, fotokozani ngati njirayo ikufunika kuyikidwa pansi, kuyikidwa mmwamba, kusonkhana ndi ma chip ambiri, kugwirira ntchito pa panel kapena wafer, zonyamulira zapadera, kuyang'anira kwapamwamba kapena zida zinazake zomwe zimagwiritsidwa ntchito.
Musaganize kuti makina olengezedwa kuti apangidwe bwino amakhala okonzeka okha kuti agwiritsidwe ntchito pa ntchito inayake yotulutsa mpweya. Seti ya module yoyikidwa, zida, ndi kayendedwe kake ziyenera kutsimikiziridwa molingana ndi zomwe zimafunika popanga.
Kubwerera kwa Mass vs Multi-Chip vs Fan-Out: Dongosolo Loyerekeza Zipangizo
| Malo Osankhira | Chip Chosinthiranso Kubwereza kwa Mass | Chip Chosinthira Ma Chip Ambiri | Kupaka Fan-Out / Wafer-Level |
|---|---|---|---|
| Kuyang'ana Kwambiri | Liwiro la kupanga, kuyenda kwa zinthu mobwerezabwereza komanso kuwongolera njira. | Ndondomeko yosinthasintha ya njira, mitundu yosiyanasiyana ya ma die ndi zida zinazake zomwe zimagwiritsidwa ntchito. | Ndondomeko yogwirizanitsa zinthu, kukhazikika kwa katundu wonyamula katundu, kuyenda kwa zinthu zomwe zasungidwa komanso kuwongolera kuchuluka kwa zinthu zomwe zasungidwa. |
| Kuwunikanso kwa Kayendetsedwe ka Ntchito | Wafer, substrate, strip kapena carrier flow kuti igwire ntchito mobwerezabwereza. | Magwero angapo a die, kusintha kwa zida, kusintha kwa chonyamulira ndi kugwiritsa ntchito zinthu zosiyanasiyana. | Chonyamulira, gulu, wafer, substrate yokonzedwanso kapena njira yogwiritsira ntchito phukusi. |
| Kuwunikanso kwa Zida | Zipangizo zosinthira, ma nozzles, zida zokonzera zinthu ndi zida zopangira. | Zida zambiri zonyamula, ma nozzles apadera, zida zapadera komanso zowonjezera zokhudzana ndi mndandanda. | Zida zokhudzana ndi ntchito, zida zonyamulira, zizindikiro zolumikizirana ndi zida zokhudzana ndi kuwunika. |
| Kuwunikanso Masomphenya | Kuzindikira kufa ndi gawo lapansi, kutsimikizira malo ake komanso kubwerezabwereza kupanga. | Mikhalidwe yosiyanasiyana yolumikizira ma die, zida zosinthira ndi malingaliro azithunzi otsatizana. | Kuzindikira zolozera, kulinganiza chonyamulira kapena gulu, kuyang'anira njira ndi kutsimikizira kubwerezabwereza. |
| Chiwopsezo Chachikulu | Kungoganiza kuti UPH yapamwamba imatanthauza kuti zida zofunikira zogwirira ntchito zikuphatikizidwa. | Poganiza kuti zida zokhala ndi mitu yambiri zimathandizira zokha mndandanda wa ma die womwe ukufunidwa. | Kungoganiza kuti nsanja yapamwamba ikuphatikizapo njira yeniyeni yonyamulira, zida, ndi njira yowunikira yomwe ikufunika. |
Flip Chip Bonder vs Flip Chip Mounter: Kodi Pali Kusiyana?
Mu zokambirana zambiri za zida za semiconductor, mawuwa amagwiritsidwa ntchitocholumikizira chipndichoyikira chip chozunguliraamagwiritsidwa ntchito mosinthana. Zonsezi nthawi zambiri zimatanthauza zida zomwe zimagwira ntchito yonyamula, kutembenuza, kulumikiza ndi kuyika zida zolumikizira ma flip chip.
Komabe, ntchito yogwiritsira ntchito makina imatha kusiyana kwambiri. Makonzedwe ena amayang'ana kwambiri malo ogwirira ntchito mwachangu kwambiri, pomwe ena amaphatikizapo kukonzekera zinthu zambiri, kugawa, kusintha, kuyang'anira, kusamalira ndi kuthekera kochita zinthu m'njira zambiri.
Pakuwunika zida, ndikofunikira kwambiri kufunsa zomwe makinawo amachita panthawi yopanga zinthu m'malo mongoyang'ana ngati wogulitsa amatcha bonder kapena mounter.
Magawo Asanu ndi Atatu Omwe Angasinthe Mphamvu ya Flip Chip Bonder
1. Njira Yowonetsera ndi Kufotokozera Magwero
Tsimikizirani ngati makinawo alandira die kuchokera ku wafer, thireyi, waffle pack, Gel-Pak®, carrier, feeder kapena gwero lina. Njira yowonetsera die imatha kudziwa zida zonyamula, makina otulutsira ndi ma module azinthu zomwe zimafunikira.
2. Njira Yosinthira ndi Kugwiritsa Ntchito Zida
Makina omwe aperekedwa ayenera kufufuzidwa kuti aone ngati pali njira yofunikira yosinthira, zida zonyamulira, ma nozzles, zida zotulutsira, zogwirira zida ndi ma calibration references. Dzina la banja la nsanja silitsimikizira kuti zida zonse zofunika zosinthira zayikidwa.
3. Njira Yokonzekera Zinthu
Njira zina zosinthira ma flip chip zimafuna kusinthasintha, kuviika, zomatira, kusamutsa zinthu, kutentha kapena njira ina yokonzekera njira. Tsimikizani kuti ndi ma module ati omwe akuphatikizidwa komanso ngati akugwirizana ndi zinthu zomwe mukufuna komanso njira yopangira phukusi.
4. Kusamalira Wafer, Chonyamulira ndi Substrate
Unikani njira yonse yogwiritsira ntchito kuyambira pa malo oyambira mpaka pa malo oyambira kapena malo onyamulira. Chimango chofunikira cha wafer, mzere, bwato, chonyamulira, gawo, gulu kapena mawonekedwe a chogwirira chiyenera kufanana ndi zida zenizeni za makina.
5. Masomphenya ndi Njira Yogwirizanitsa
Yang'anani momwe kamera imakhalira, kuwala, ntchito zowunikira, momwe kamera imagwirira ntchito, momwe imagwirira ntchito, momwe imawonera malo ndi njira yodziwira malo. Diye ndi substrate yeniyeni ziyenera kuganiziridwa panthawi yowunikirayi.
6. Kuyang'anira Njira ndi Kulamulira Zokolola
Tsimikizirani ngati kasinthidwe komwe kaperekedwa kakuphatikizapo ntchito zoyenera zowongolera njira, kuyang'anira kapena kutsimikizira pambuyo poyika. Musaganize kuti kamera yowoneka kapena chowunikira chikuwonetsa kuti njira yowunikira yofunikira ikugwira ntchito komanso ingagwiritsidwe ntchito.
7. Kusintha kwa Zida ndi Kusintha kwa Zinthu
Pazinthu zambiri zomwe zingagwiritsidwe ntchito, onaninso kusintha kwa zida, kusintha kwa nozzle, kusintha zida, kusintha maphikidwe, nthawi yokhazikitsa chipangizocho ndi njira zobwezeretsera. Zinthu izi zitha kukhudza magwiridwe antchito opangira zinthu monga liwiro la makina.
8. Mapulogalamu, Wowongolera ndi Kubwezeretsa Deta
Zipangizo zomwe zagwiritsidwa ntchito ziyenera kuunikidwanso kuti ziwone ngati pali makina owongolera, momwe makompyuta amagwirira ntchito, mtundu wa mapulogalamu, zosankha zoyatsidwa, mafayilo osungira, zolumikizira zobwezeretsa, deta ya njira ndi zolemba zaukadaulo.
Zomwe Muyenera Kufunsa Musanayerekezere Ma Quotes a BESI Flip Chip Bonder
Musanayerekezere mtengo, funsani wogulitsa aliyense kuti apereke tsatanetsatane wofanana wa kasinthidwe. Izi zimapangitsa kuti zikhale zosavuta kuzindikira ngati mawu awiri akufotokoza machitidwe ofanana kapena mayina ofanana a nsanja.
Kusankhidwa kwa chitsanzo chenicheni ndi nambala yotsatizana
Kupanga makina ndi kupanga owongolera
Mitu yomangira ndi zida zolumikizirana
Ma module ogwiritsira ntchito ma wafer, thireyi, chonyamulira, chodulira ndi chogwirira ntchito pansi pa nthaka
Magawo okonzekera zinthu monga kusuntha, kuviika kapena kugawa komwe kuli kofunikira
Masomphenya, kamera ndi mawonekedwe a kuwala
Ma nozzles, zida zotulutsira, zida zolumikizira, mbale ndi ma calibration references
Mtundu wa mapulogalamu, momwe mungasankhire, zosunga zobwezeretsera ndi chidziwitso chobwezeretsa
Chigawo chokonzanso, momwe makina alili komanso umboni woyeserera ntchito
Lingaliro la FAT, kupezeka kwa mayeso a zinthu ndi njira zotumizira ndi kumasula
Zolakwa Zisanu ndi Chimodzi Zodziwika Posankha Flip Chip Bonder Yogwiritsidwa Ntchito
Cholakwika 1: Kusankha Dzina la Pulatifomu Lokha
Makina a DATACON kapena Esec akhoza kukhala njira yothandiza yolumikizirana ndi nsanja, koma kasinthidwe kake kamatsimikizira ngati kakugwirizana ndi njira yomwe mukufuna. Yerekezerani nthawi zonse zida zoyikika ndi zowonjezera zomwe zaphatikizidwa.
Cholakwika 2: Kuganiza Kuti Kuthamanga Kwambiri Kumathetsa Kuyenerera kwa Njira
Mphamvu yotulutsa mphamvu zambiri imakhala yothandiza pokhapokha ngati makinawo ali ndi njira yogwiritsira ntchito die, kukonzekera zinthu, zida, masomphenya ndi ma module a substrate ofunikira kuti agwiritsidwe ntchito.
Cholakwika 3: Kunyalanyaza Zida ndi Zokonzera
Ma nozzles osowa, zida zosinthira, zida zonyamulira, ma substrate plates kapena ma calibration references amatha kuchedwetsa kuyenerera ngakhale nsanja yayikulu ikugwira ntchito bwino.
Cholakwika 4: Kuona Makamera Ngati Umboni wa Kutha Kugwirizana
Kugwira ntchito kwa maso kumadalira kuwala, kuunikira, mapulogalamu olinganiza, kulinganiza ndi mawonekedwe enieni a die kapena substrate. Kuyika kamera kokha sikokwanira.
Cholakwika 5: Kuvomereza Kanema Wopanda Kanthu Ngati Mayeso Ovomerezeka ndi Factory
Kanema wosuntha makina osatulutsidwa satsimikizira kuti zinthuzo zikugwiritsidwa ntchito bwanji, kutengedwa, kusinthidwa, kukonzedwa, kuyikidwa, kuyang'aniridwa kapena kubwezeretsedwa kwa zolakwika.
Cholakwika 6: Kusiya Mapulogalamu ndi Chithandizo Mpaka Pambuyo Potumiza
Kufikira kwa owongolera, zosunga zobwezeretsera, mafayilo osankha, deta yoyendetsera, zolumikizira zobwezeretsa, ndi udindo wothandizira ziyenera kutsimikiziridwa musanatumize, osati mutakhazikitsa.
Kodi FAT Yothandiza Kwambiri Yokhala ndi Flip Chip Bonder FAT Iyenera Kutsimikizira Chiyani?
Kuyesa kovomerezeka kwa fakitale kuyenera kufotokozedwa mozungulira kasinthidwe ka makina enieni ndi kayendedwe kake komwe kakuyembekezeka. Sikuyenera kusintha ziyeneretso zonse zopangira, koma kuyenera kuwonetsa kuti makina ofunikira ndi odziwika, ogwira ntchito bwino komanso okonzeka gawo lotsatira lomwe lavomerezedwa.
| Malo Onenepa | Zomwe Ziyenera Kuwonetsedwa |
|---|---|
| Kudziwika kwa Makina | Chitsanzo, zambiri zotsatizana, ma modules omwe adayikidwa ndi zowonjezera zomwe zili mkati mwake zikugwirizana ndi mtengo wake. |
| Chitetezo ndi Kuyambitsa | Kuyimitsa magetsi, kuyimitsa mwadzidzidzi, zitseko zachitetezo, ma alamu, maloko olumikizirana ndi kuyambitsa makina zimagwira ntchito bwino. |
| Mutu wa Kuyenda ndi Bond | Kubwerera m'mbuyo, kuyenda mozungulira, kuyenda kwa mutu, kuyika zida ndi machitidwe oyambira obwezeretsa zinthu akuwonetsedwa. |
| Masomphenya ndi Kugwirizana | Ubwino wa chithunzi cha kamera, kuunikira, kuzindikira zizindikiro ndi ntchito zogwirizanitsa zawonetsedwa. |
| Ma Module Othandizira | Ma module ophatikizidwa a wafer, thireyi, chonyamulira, substrate, strip kapena fixture amayesedwa motsatira ndondomeko yodziwika bwino. |
| Kukonza Zida ndi Kutsata Njira | Zipangizo zosinthira, ma nozzles, zida zolumikizira ndi ma module ogwirira ntchito omwe alipo amawunikidwa molingana ndi zomwe zavomerezedwa. |
| Mapulogalamu ndi Kupereka | Kufikira kwa olamulira, momwe mapulogalamu alili, zosunga zobwezeretsera, mafayilo osankha, zolemba ndi mndandanda womaliza wa zosintha zatsimikiziridwa. |
Nthawi Yoyendera Njira Yosiyana ya BESI Flip Chip Platform
BESI flip chip bonder yeniyeni iyenera kusankhidwa pokhapokha ngati kasinthidwe kake kakugwirizana ndi njira yofunikira yogwirira ntchito. Njira yosiyana ya nsanja ingakhale yoyenera kwambiri pamene polojekitiyi ikufuna kupanga mass reflow okwera kwambiri, njira yosiyana ya multi-chip processing, handling yapadera kwambiri ya fan-out, zofunikira pa kulumikizana kwapamwamba kapena mulingo wosiyana wa kusinthasintha kwa njira.
Cholinga si kukakamiza pulogalamu iliyonse kukhala m'gulu limodzi la DATACON kapena Esec platform. Cholinga ndikupeza makonzedwe omwe ali ndi njira yomveka bwino yopezera zida, kutsimikizira njira, kukhazikitsa ndi kupanga mobwerezabwereza.
Malangizo Omaliza: Yerekezerani Unyolo wa Njira Musanayerekezere Mtengo wa Makina
BESI flip chip bonder ikhoza kukhala njira yolimba kwambiri ngati makina omwe aperekedwa ali ndi makonzedwe oyenera a die source, zida zosinthira, ma module okonzekera zinthu, njira yogwirira ntchito, phukusi la masomphenya, zida, malo osungira mapulogalamu ndi malo othandizira.
Musanavomereze mtengo, yerekezerani unyolo wonse wa njira yogwiritsira ntchito kuchokera ku die pickup mpaka kuyika ndi kuyang'anira. Njira iyi imathandiza kupewa cholakwika chofala pogula zida zogwiritsidwa ntchito za semiconductor: kugula banja loyenera la nsanja yokhala ndi mawonekedwe osakhazikika.
Zogwirizana ndi BESI Flip Chip Resources
Mafunso Omwe Amafunsidwa Kawirikawiri Okhudza BESI Flip Chip Bonders
Kodi BESI flip chip bonder ndi chiyani?
BESI flip chip bonder ndi zida zosonkhanitsira za semiconductor zomwe zimagwiritsidwa ntchito kusankha, kutembenuza, kulumikiza, ndikuyika die mu ntchito zosungira ma flip chip. Mphamvu yeniyeni yogwirira ntchito imadalira banja la nsanja ndi kasinthidwe komwe kayikidwa, kuphatikiza ma module ogwiritsira ntchito, zida, masomphenya ndi zida zogwirira ntchito.
Kodi kusiyana pakati pa cholumikizira cha flip chip ndi cholumikizira cha flip chip ndi kotani?
Mawuwa nthawi zambiri amagwiritsidwa ntchito mosinthana. Pakuwunika zida zenizeni, nkhani yofunika kwambiri ndi ntchito yeniyeni yopangira makina, kuphatikizapo kujambula, kusintha, kukonzekera zinthu, kulinganiza, kuyika, kuyang'anira ndi kugwirira ntchito.
Ndi BESI flip chip bonder iti yoyenera kupanga mass reflow?
Mapulojekiti a flip chip obwezeretsanso mphamvu ayenera kuyesedwa poyerekeza ndi nsanja ndi makonzedwe omwe adapangidwira liwiro lofunikira la kupanga, kuyenda kwa zinthu, kusamalira die, njira ya substrate, makina owonera komanso zofunikira pakulamulira njira. Kapangidwe ka makina enieni kayenera kutsimikiziridwa musanasankhe.
Kodi DATACON 2200 evo ingagwiritsidwe ntchito pa mapulogalamu a flip chip?
Ma configurations ena a DATACON 2200 evo akhoza kuyesedwa kuti agwiritse ntchito njira zina zosinthira ma flip chip. Ogula ayenera kutsimikizira zida zosinthira, ma module ogwiritsira ntchito, kulinganiza mawonekedwe, kukonzekera zinthu, zida zosinthira, ndi kuthekera kogwiritsa ntchito njira zina.
Kodi ndi chiyani chomwe chiyenera kufufuzidwa musanagule bonder ya flip chip yomwe yagwiritsidwa ntchito kale?
Tsimikizirani mtundu weniweni wa makina, mitu ya ma bond, zida zosinthira, ma nozzles, ma wafer ndi ma substrate handling modules, vision system, process modules, controller, software backups, tooling inventory, renovation scope ndi FAT proposal.
Nchifukwa chiyani kugwiritsa ntchito zida ndikofunikira pakugwirizanitsa flip chip?
Zipangizo zimatha kudziwa ngati makinawo angathe kuthana ndi njira yolumikizirana, njira yolumikizirana ndi phukusi. Ma nozzles osowa, zida zosinthira, zida zotulutsira, mbale zonyamulira, zida zolumikizirana kapena ma calibration references angachedwetse kuyenerera ndikuwonjezera mtengo wa polojekiti.
Kodi FAT iyenera kukhala ndi chiyani?
FAT yothandiza ingaphatikizepo kutsimikizira kuti makina ndi otani, kuyang'ana chitetezo, kugwira ntchito kwa mutu wa bond ndi mayendedwe ake, kuyang'anira mawonekedwe, kuyesa kwa ma module, kutsimikizira zida, kuwunikanso mapulogalamu osungira ndi njira zoyimira ngati pali zinthu zoyenera.
Kodi ndingayerekeze bwanji ma quotation awiri a BESI flip chip bonder?
Yerekezerani makonzedwe onse oyikidwa m'malo mwa dzina la nsanja kapena mtengo wogulira. Unikani njira yogwirira ntchito, mitu ya ma bond, zida zosinthira, ma module azinthu, zida zogwirira ntchito, phukusi la masomphenya, zinthu zosungiramo zida, chowongolera, mapulogalamu, kuchuluka kwa kukonzanso ndi umboni wa FAT.
Mukufuna Thandizo Powunikiranso Kapangidwe ka BESI Flip Chip Bonder?
Gawani zithunzi za makina zomwe zilipo, zambiri zokhudzana ndi mndandanda, zojambula za phukusi, kukula kwa die, mawonekedwe a substrate, njira yogwiritsira ntchito, zotsatira za cholinga, tsatanetsatane wa zida ndi momwe njira yogwirira ntchito ikuyendera. Kuwunika kothandiza kumayamba ndi njira yeniyeni ya phukusi ndi kasinthidwe ka makina omwe aperekedwa.
