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BESI flip chip bonder erina okulondebwa okusinziira ku kkubo ly’enkola, so si linnya ly’ekyuma lyokka.Platform esaanira high-speed mass reflow flip chip eyinza obutategekebwa ku multi-chip assembly sequence, enkola ya fan-out, enkola ya substrate ey’enjawulo oba enkola eyeetaaga embeera ez’enjawulo ez’ebikozesebwa, okulaba, okukwata n’okukebera.
Abaguzi nga banoonya aEkyuma ekikuba chip bonder, DATACON flip chip bonder, Ekyuma kya BESI ekiyitibwa flip chip, flip chip mounter nga egenda mu maasoobaEkyuma kya DATACONemirundi mingi okutandika n’erinnya ly’omukutu. Naye, entandikwa ey’omugaso ennyo ye kkubo lyennyini ery’okupakinga: die ki eteekwa okukyusibwa, engeri gy’egenda okwanjulwamu, substrate oba carrier ki ekozesebwa, engeri alignment gy’ekakasibwa, enkola ki ey’ebintu eyeetaagisa, n’ekiruubirirwa ki eky’okufulumya ekirina okutuukibwako.
Ekitabo kino kinnyonnyola engeri y’okugeraageranya endagiriro za BESI flip chip bonder ku mass reflow, multi-chip ne fan-out packaging workflows, era bibuuzo ki eby’okusengeka ebyuma ebirina okuddibwamu nga tonnakkiriza byuma kugula, okuddaabiriza oba okutuukiriza ebisaanyizo by’enkola.
Mu bufunze: BESI Flip Chip Bonder Esaana Kulondebwa Etya?
Londa BESI flip chip bonder nga osooka okunnyonnyola ekkubo lya package, die format, bump oba interconnect structure, ekika kya substrate, enkola y’ebintu, ensengeka y’okukwata, obwetaavu bw’okulaba, ekigendererwa ky’okuteeka n’okuyita okusuubirwa. Oluvannyuma kakasa nti ensengeka ya DATACON oba Esec ewereddwa erimu emitwe gya bond egyetaagisa, ebikozesebwa mu flip, okukwata wafer, modules za substrate, tooling, cameras, emirimu gy’okukebera, software ne support scope.
Mass reflow flip chip projects zitera okukulembeza sipiidi y’okufulumya, okutambula kw’ebintu okuddiŋŋana n’okufuga enkola mu bujjuvu.
Pulojekiti za multi-chip flip chip zitera okwetaaga enkwata ekyukakyuka, emitendera gy’enkola mingi n’ebikozesebwa ebikwata ku nkola.
Amakubo g’okupakinga aga Fan-out ne wafer-level geetaaga okwekenneenya n’obwegendereza enkwata ya substrate, enkola y’okukwatagana, ensengeka y’enkola n’embeera y’okukebera.
Enkola bbiri ezirina famire y’omusingi y’emu zikyayinza okwawukana ennyo mu bikozesebwa ebiteekeddwawo n’obusobozi bw’enkola ezikozesebwa.
Lwaki Okulonda Flip Chip Bonder Kutandikira Ku Process Route
Flip chip assembly si mulimu gumu ogw’okufulumya ogutakyukakyuka. Ensengeka y’ebyuma eyeetaagisa ekyuka okusinziira ku oba enkola ezimbiddwa okwetoloola mass reflow, chip-to-substrate placement, multi-chip integration, okupakinga fan-out, okukwata panel oba wafer, high-density interconnects oba specialized production flow.
Platform eyinza okuba nga esobola sipiidi ya waggulu ey’okuteeka, naye ekyo tekikakasa nti erina enkola eyeetaagisa ey’okufuumuula die, modulo y’okuteekateeka flux oba material, okukwata carrier, vision field of view, post-bond inspection route, process tooling oba recovery sequence.
Omusingi gw’okulonda:Flip chip bonder entuufu kye kyuma ekisobola okumaliriza olujegere lw’enkola olwetaagisa n’ebikozesebwa ebituufu, okutambula kw’ebintu, enkola y’okulaba n’enkola y’okukakasa.
Amakubo asatu ag’okukola Flip Chip Ezeetaaga Okusalawo ku Byuma eby’enjawulo
1. Okukola Flip Chip mu kuddamu okutambula mu bungi
Amakubo ga Mass reflow flip chip gatera okwekenneenyezebwa nga okukuŋŋaanyizibwa kwa chip-to-substrate okw’obunene obw’amaanyi, okutambula kw’ebintu okuddiŋŋana n’obulungi bw’okufulumya bye byetaagisa ebikulu. Mu mbeera eno, ensengeka y’ekyuma erina okuwagira okulaga die egenderere, okukwata substrate, okukola flip, okuteekateeka ebintu, ensengeka y’okuteeka n’enkola y’okufuga enkola.
Nga beetegereza BESI DATACON flip chip bonder for this route, abaguzi balina okussa essira ku hardware yennyini essiddwawo okufulumya okusinga omuwendo gw’ebifulumizibwa gwokka okuva mu brocuwa ya platform.
Ensengeka y’okukwata wafer ne substrate
Enkola ya Flip tool ne die presentation
Fluxing, dipping oba process-material route we kiba kituufu
Okukwatagana kw’okulaba n’okutegeera ebijuliziddwa ku substrate
Emirimu gy’okukebera oluvannyuma lwa bond oba enkola-okufuga
Ebyetaago by’okutereka ebikozesebwa n’okukyusa ebyuma
2. Olukungaana lwa Chip Flip Chip eziwera
Okukuŋŋaanya kwa chip eziwera kuyinza okuleeta ensengeka y’enkola enzibu ennyo. Ekintu ekimu kiyinza okwetaaga sayizi za die ez’enjawulo, ebikozesebwa ebingi, ebifo eby’enjawulo eby’okulondamu, ensengeka ez’enjawulo ez’okuteeka, okukwata mu ngeri ey’enjawulo ey’okusitula oba emitendera gy’ebintu mingi mu kkubo erimu ery’okufulumya.
Ku pulojekiti ey’ekika kino, okukyukakyuka kuyinza okuba okw’omugaso ennyo ng’obwangu. Omuguzi alina okukakasa emitwe gy’emirimu emeka egyateekebwawo, bikozesebwa ki ebiyinza okukozesebwa, engeri ekyuma gye kikwatamu enkyukakyuka za die, oba ensengeka y’enkola esobola okutegekebwa ne modulo z’ebintu ki ezirimu.
Enkola ekola bulungi omulimu gumu ogw’okuteeka ogw’okuddiŋŋana ogw’amaanyi eyinza obutaba nsengeka ntuufu ku kkubo erya chip eziwera nga lirina ebika bya die eby’enjawulo n’omutendera ogusingako obuzibu.
3. Okupakinga mu Fan-Out ne Wafer-Level
Enkola y’emirimu gy’okupakinga ku ddaala lya ‘fan-out ne wafer-level’ erina okwekenneenya okusinziira ku nteekateeka y’okupakinga entuufu, ekkubo ly’okusitula oba erya substrate, enkola y’okujuliza okuteeka, enkola y’okukwata die, ebikozesebwa mu nkola n’ebyetaago by’okukebera. Pulojekiti zino ziyinza okussa essira erisinga ku kufuga okukwatagana, okutebenkera kwa substrate, okulonda enkola n’okukakasa amakungula.
Nga tonnalonda musingi, tangaaza oba enkola yeetaaga okuteeka wansi, okutunula waggulu, okukuŋŋaanya chip eziwera, okukwata panel oba wafer, okutwala eby’enjawulo, okwekebejja okw’omulembe oba ebikozesebwa ebikwata ku nkola.
Tolowooza nti ekyuma ekirangibwa okupakinga eby’omulembe kibeera kyetegefu butereevu okukola enkola ey’enjawulo ey’okuggyamu abawagizi. Ensengeka ya modulo essiddwawo, ebikozesebwa n’okutambula kw’enkola birina okukakasibwa okusinziira ku kyetaagisa ky’okufulumya.
Mass Reflow vs Multi-Chip vs Fan-Out: Enkola y’okugeraageranya ebyuma
| Ekitundu eky’okusunsulamu | Mass Reflow Okukyusakyusa Chip | Chip ya Flip erimu Chip eziwera | Fan-Out / Okupakinga ku ddaala lya Wafer |
|---|---|---|---|
| Essira Ekisookerwako | Sipiidi y’okufulumya, okutambula kw’ebintu okuddiŋŋana n’okufuga enkola. | Enkola ekyukakyuka, ebika by’okufa ebingi n’ebikozesebwa ebikwata ku nkola. | Enkola y’okukwatagana, okutebenkera kw’abasitula, okutambula kw’okupakinga n’okufuga amakungula. |
| Okuddamu okwetegereza enkwata | Wafer, substrate, strip oba carrier flow okusobola okukola emirimu egy’amaanyi egy’enfunda eziwera. | Ensonda za die eziwera, enkyukakyuka mu bikozesebwa, enkyukakyuka mu carrier n’okukwata ebintu ebitabuddwa. | Carrier, panel, wafer, reconstituted substrate oba ekkubo ly’okukwata erya package-specific. |
| Okuddamu okwetegereza ebikozesebwa | Ebikozesebwa mu kukyusakyusa, entuuyo, ebikozesebwa mu kutegeka ebintu n’ebikozesebwa mu kukola. | Ebikozesebwa mu kusitula ebingi, entuuyo ezikwata ku die, ebikozesebwa mu ngeri ey’enjawulo n’ebikozesebwa ebikwata ku nsengeka. | Ebikozesebwa ebikwata ku nkola, ebikozesebwa mu kusitula, ebijuliziddwa ku kukwatagana n’ebikozesebwa ebikwata ku kukebera. |
| Okwekkaanya Okwolesebwa | Okutegeera die ne substrate, okukakasa okuteeka n’okuddiŋŋana okufulumya. | Embeera z’okulaganya die eziwera, offsets z’ebikozesebwa n’enzikiriziganya y’ebifaananyi ebikwata ku mutendera. | Okutegeera ebijuliziddwa, okukwatagana kw’omutwala oba ekipande, okwekenneenya enkola n’okukakasa okuddiŋŋana. |
| Akabi Akakulu | Okulowooza nti UPH eri waggulu kitegeeza nti ebikozesebwa ebyetaagisa eby’enkola bibaamu. | Okulowooza nti ebikozesebwa eby’emitwe mingi biwagira mu ngeri ey’otoma omutendera gw’okufa ogugendereddwa. | Okulowooza nti ekifo eky’omulembe kizingiramu ekkubo lyennyini ery’okusitula, ebikozesebwa n’okukebera eryetaagisa. |
Flip Chip Bonder vs Flip Chip Mounter: Waliwo Enjawulo?
Mu kukubaganya ebirowoozo kungi ku byuma bya semikondokita, ebigamboflip chip bonder (ekikuta kya chip).neflip chip mounter nga egenda mu maasozikozesebwa nga zikyusibwakyusibwa. Okutwalira awamu byombi bitegeeza ebyuma ebikwata die pickup, flipping, alignment ne placement for flip chip assembly.
Kyokka, obuwanvu bw’ekyuma mu nkola buyinza okwawukana ennyo. Ensengeka ezimu zisinga kutunuulira kuteeka ku sipiidi ya waggulu, ate endala zirimu okuteekateeka ebintu mu ngeri esingako, okugaba, okufuumuula, okwekenneenya, okukwata n’obusobozi bw’enkola ey’emitendera mingi.
Ku kwekenneenya ebyuma, kya mugaso nnyo okubuuza ekyuma kye kikola mu mubiri mu kkubo ly’okufulumya okusinga okussa essira ku kyokka oba omugabi akiyita bonder oba mounter.
Ebitundu munaana eby'okusengeka Ebiyinza Okukyusa Obusobozi bwa Flip Chip Bonder
1. Ensibuko ya Die n’Enkola y’Okwanjula
Kakasa oba ekyuma kifuna die okuva mu wafer, tray, waffle pack, Gel-Pak®, carrier, feeder oba ensibuko endala. Enkola y’okulaga die esobola okuzuula ebikozesebwa mu kulonda, enkola z’okufulumya ne modulo z’ebintu ebyetaagisa.
2. Enkola ya Flip n’Ebikozesebwa
Ekyuma ekiweereddwa kisaana okukeberebwa enkola eyetaagisa ey’okukyusakyusa, ebikozesebwa mu kusitula, entuuyo, ebikozesebwa okufulumya, ebikwaso by’ebikozesebwa n’ebijuliziddwa ku kalifuuwa. Erinnya ly'amaka g'omukutu terikakasa nti ebikozesebwa byonna ebyetaagisa ebya flip biteekeddwamu.
3. Enkola y’okuteekateeka ebintu
Amakubo agamu aga flip chip geetaaga fluxing, dipping, adhesive, material transfer, okubugumya oba omutendera omulala ogw’okuteekateeka enkola. Kakasa modulo ki ezirimu era oba zikwatagana n’ebintu ebigendereddwa n’ekkubo ly’okupakinga.
4. Enkwata ya Wafer, Carrier ne Substrate
Weekenneenye omutendera gw’okukwata mu bujjuvu okuva ku nsibuko ya die okutuuka ku kuteekebwa kwa substrate oba carrier. Fuleemu ya wafer, strip, eryato, carrier, substrate, panel oba fixture format eyeetaagisa erina okukwatagana n’ebikozesebwa by’ekyuma kyennyini.
5. Enkola y’okwolesebwa n’okukwatagana
Kebera ensengeka ya kkamera, optics, ekitangaala, emirimu gy’okulaganya, embeera y’okupima, ekifo ky’okulaba n’enkola y’okutegeera okujuliza. Die yennyini ne substrate birina okulowoozebwako mu kiseera ky’okuddamu okwetegereza kuno.
6. Okukebera enkola n’okufuga amakungula
Kakasa oba ensengeka eweereddwa erimu emirimu egyekuusa ku kufuga enkola, okwekenneenya oba okukakasa oluvannyuma lw’okuteekebwa. Tolowooza nti kkamera oba monitor erabika ekakasa nti ekkubo eryetaagisa ery’okukebera likola era likozesebwa.
7. Okukyusa Ebikozesebwa n’Okukyusa Ebintu
Ku mbeera z’ebintu ebingi, okwekenneenya okukyusa ebikozesebwa, okukyusa entuuyo, okukyusa ebikozesebwa, okukyusa enkola y’emmere, obudde bw’okuteekawo ekyuma n’enkola z’okuzzaawo. Ensonga zino zisobola okukwata ku bulungibwansi bw’okufulumya mu nkola nga bwe kiri ku sipiidi y’ekyuma ey’erinnya.
8. Okuzzaawo Sofutiweya, Controller ne Data
Ebyuma ebikozesebwa birina okwekenneenyezebwa okulaba nga bikola controller, embeera ya PC y’amakolero, software version, enabled options, backup files, recovery media, process data n’ebiwandiiko eby’ekikugu.
By'olina Okubuuza Nga Tonnagerageranya BESI Flip Chip Bonder Quotations
Nga tonnageraageranya bbeeyi, saba buli mugabi awe omutendera gwe gumu ogw’ebikwata ku nsengeka. Kino kyangu okuzuula oba ebijuliziddwa bibiri binnyonnyola enkola ezigeraageranyizibwa oba amannya ga pulatifomu gokka agafaanagana.
Enkola entuufu ey’okulaga mmotoka n’ennamba y’omuddiring’anwa
Okukola ebyuma n’okukola controller
Yassibwamu emitwe gya bond ne flip tooling
Module ezikwata wafer, tray, carrier, strip ne substrate
Module z’okuteekateeka ebintu nga okufuuwa, okunnyika oba okugaba we kituufu
Ensengeka y’okulaba, kkamera n’ekitangaala
Mulimu entuuyo, ebikozesebwa okufulumya, ebinyweza, ebipande n’ebijuliziddwa ku kalifuuwa
Enkyusa ya pulogulaamu, embeera y’okulonda, okutereka n’amawulire agakwata ku kuzzaawo
Obunene bw’okuddaabiriza, embeera y’ekyuma n’obujulizi bw’okugezesa emirimu
Ekiteeso kya FAT, okugezesebwa kw’ebintu okubeerawo n’emisingi gy’okusindika-okufulumya
Ensobi mukaaga ezitera okukolebwa ng’olonda Flip Chip Bonder Ekozesebwa
Ensobi 1: Okulonda ng’okozesa Erinnya lya Platform lyokka
Ekyuma kya DATACON oba Esec kiyinza okuba obulagirizi bwa platform obw'omugaso, naye ensengeka entuufu y'esalawo oba ewagira enkola egenderere. Bulijjo geraageranya ebikozesebwa ebiteekeddwamu n’ebikozesebwa ebirimu.
Ensobi 2: Okulowooza nti High Throughput Egonjoola Enkola Fit
Obusobozi bw’okufulumya obw’amaanyi bwa mugaso bwokka ng’ekyuma kirina enkwata ezeetaagisa, okuteekateeka ebintu, okukozesa ebikozesebwa, okulaba ne substrate modules for the target application.
Ensobi 3: Okubuusa amaaso Ebikozesebwa n’Ebinyweza
Nozzles ezibula, ebikozesebwa mu flip, carrier fixtures, substrate plates oba calibration references zisobola okulwawo okutuukiriza ebisaanyizo ne bwe kiba nti main platform ekola mu byuma.
Ensobi 4: Okutwala Kkamera ng’Obukakafu bw’Obusobozi bw’Okukwatagana
Enkola y’okulaba esinziira ku optics, okumasamasa, alignment software, calibration n’ebintu ebituufu ebifa oba substrate. Okuteeka kkamera kwokka tekimala.
Ensobi 5: Okukkiriza Vidiyo Empty Motion nga Factory Acceptance Test
Akatambi k’entambula y’ekyuma etatikkiddwa tekakakasa kukwata bintu, okulonda die, okukyusakyusa, okukwatagana, okuteekebwa, okukebera oba okuzzaawo ensobi.
Ensobi 6: Okuleka Software n'Obuwagizi Okutuusa Nga Omaze Okutuusa
Okuyingira kwa controller, backups, option files, process data, recovery media n’obuvunaanyizibwa bw’obuyambi birina okukakasibwa nga tonnasindikibwa, so si oluvannyuma lw’okussaako.
Kiki Eky'omugaso Flip Chip Bonder FAT Gye Galina Okukakasa
Okugezesebwa okw’okukkiriza mu kkolero kulina okunnyonnyolwa okwetoloola ensengeka y’ekyuma entuufu n’okutambula kw’enkola okusuubirwa. Tekyetaagisa kukyusa bisaanyizo bya kukola bijjuvu, naye kisaana okulaga nti enkola z’ebyuma ebikulu zimanyiddwa, zikola era nga zeetegefu okugenda ku mutendera oguddako ogukkaanyiziddwaako.
| Ekitundu kya FAT | Ebyo Ebisaanye Okwolesebwa |
|---|---|
| Endagamuntu y’Ekyuma | Model, serial information, modules eziteekeddwamu n’ebikozesebwa ebirimu bikwatagana ne quotation. |
| Obukuumi n’okutandikawo | Okussa amasannyalaze, okuyimirira mu mbeera ez’amangu, enzigi z’obukuumi, alamu, ebizibiti n’okutandika enkola bikola. |
| Omutwe gwa Motion ne Bond | Homing, axis movement, head movement, tool mounting n’enneeyisa y’okuddamu okusookerwako biragiddwa. |
| Okwolesebwa n’Okukwatagana | Omutindo gw’ebifaananyi bya kkamera, okumasamasa, okutegeera ebijuliziddwa n’emirimu gy’okukwataganya biragibwa. |
| Enkwata Modules | Module za wafer, tray, carrier, substrate, strip oba fixture ezirimu zigezesebwa wansi w’omutendera ogutegeerekese. |
| Ebikozesebwa n’ensengeka y’enkola | Ebikozesebwa mu flip ebiriwo, nozzles, fixtures ne process modules bikeberebwa okusinziira ku scope gye bakkiriziganyizzaako. |
| Sofutiweya n’Okukwasa | Okuyingira kwa controller, embeera ya software, backups, option files, ebiwandiiko n'olukalala lw'okusengeka olusembayo bikakasibwa. |
Ddi lw'olina okunoonyereza ku ndagiriro ya BESI Flip Chip Platform ey'enjawulo
Bonder ya BESI flip chip eyeetongodde erina okusunsulwa nga ensengeka yaayo etekeddwa ekwatagana n’ekkubo ly’enkola eryetaagisa. Obulagirizi bwa pulatifomu obw’enjawulo buyinza okuba obutuufu nga pulojekiti yeetaaga okufulumya okuddamu okukulukuta okw’amaanyi mu bungi obw’amaanyi, omutendera gw’enkola ogw’enjawulo ogwa chip eziwera, enkwata ey’enjawulo ennyo eya fan-out, ebyetaago by’okuyunga eby’omulembe oba omutendera ogw’enjawulo ogw’okukyukakyuka kw’enkola.
Ekigendererwa si kukaka buli nkola mu famire emu eya DATACON oba Esec platform. Ekigendererwa kwe kuzuula ensengeka erina ekkubo erisinga okutegeerekeka eri okubeerawo kw’ebikozesebwa, okukakasa enkola, okussaako n’okufulumya okuddibwamu.
Ekiteeso ekisembayo: Geraageranya olujegere lw’enkola nga tonnageraageranya bbeeyi ya kyuma
BESI flip chip bonder eyinza okuba enkola ey’amaanyi ey’omukutu ng’ekyuma ekiweereddwa kirina ensengeka entuufu ey’ensibuko y’okufa, ebikozesebwa mu kukyusa, modulo z’okuteekateeka ebintu, ekkubo ly’okukwata, ekipapula ky’okulaba, ebikozesebwa, embeera ya pulogulaamu n’obunene bw’obuyambi.
Nga tonnaba kukkiriza quotation, geraageranya enkola enzijuvu okuva ku die pickup okuyita mu kuteeka n’okukebera. Enkola eno eyamba okuziyiza ensobi eya bulijjo mu kugula ebyuma bya semikondokita ebikozesebwa: okugula famire ya pulatifomu entuufu ng’erina ensengeka essiddwamu etali ntuufu.
Ebikozesebwa mu BESI Flip Chip ebikwatagana
Ebibuuzo Ebitera Okubuuzibwa Ku BESI Flip Chip Bonders
BESI flip chip bonder kye ki?
BESI flip chip bonder kye kyuma ekikuŋŋaanya semiconductor ekikozesebwa okulonda, okukyusakyusa, okulaganya n’okuteeka die mu nkola y’emirimu gy’okupakinga flip chip. Obusobozi bw’enkola obutuufu businziira ku famire ya platform n’ensengeka etekeddwa, omuli okukwata modules, tooling, vision ne process hardware.
Njawulo ki eriwo wakati wa flip chip bonder ne flip chip mounter?
Ebigambo bino bitera okukozesebwa nga bikyusibwakyusibwa. Mu kwekenneenya ebyuma mu nkola, ensonga enkulu gwe mulimu gwennyini ogw’okufulumya ekyuma, omuli okulonda die, okukola flip, okuteekateeka ebintu, okukwatagana, okuteeka, okukebera n’ensengeka y’okukwata.
BESI flip chip bonder ki esaanira okukola mass reflow?
Pulojekiti za Mass reflow flip chip zirina okwekenneenyezebwa okusinziira ku pulatifomu n’ensengeka ezikoleddwa ku sipiidi y’okufulumya eyeetaagisa, okutambula kw’ebintu, okukwata die, ekkubo lya substrate, enkola y’okulaba n’obwetaavu bw’okufuga enkola. Ensengeka y'ekyuma entuufu erina okukakasibwa nga tonnalonda.
DATACON 2200 evo esobola okukozesebwa mu kukola flip chip?
Ezimu ku nsengeka za DATACON 2200 evo zisobola okwekenneenyezebwa ku nkola z’emirimu eza flip chip ezirondeddwa. Abaguzi balina okukakasa ebikozesebwa eby’okukyusakyusa, modulo z’okukwata, okukwatagana kw’okulaba, okuteekateeka ebintu, ebinyweza n’obusobozi bw’enkola ey’enjawulo ey’okukozesa.
Kiki ekirina okukeberebwa nga tonnagula flip chip bonder ekozesebwa?
Kakasa enkyusa y’ekyuma entuufu, emitwe gya bond, ebikozesebwa mu flip, nozzles, wafer ne substrate handling modules, vision system, process modules, controller, software backups, tooling inventory, okuddaabiriza scope n’ekiteeso kya FAT.
Lwaki tooling kikulu mu flip chip bonding?
Tooling esobola okuzuula oba ekyuma kisobola okukwata target die, substrate ne package route. Ebibulamu nozzles, flip tools, eject tools, carrier plates, fixtures oba calibration references bisobola okulwawo okutuukiriza ebisaanyizo n’okwongera ku ssente za pulojekiti.
FAT ya flip chip bonder erina okubeeramu ki?
FAT ey’omugaso esobola okuli okukakasa endagamuntu y’ekyuma, okukebera obukuumi, enkola y’entambula n’omutwe gwa bond, okukwataganya okulaba, okugezesa okukwata-module, okukakasa ebikozesebwa, okwekenneenya software backup n’ensengeka y’enkola ekiikirira ng’ebintu ebisaanira biriwo.
Ngerageranya ntya ebigambo bibiri ebya BESI flip chip bonder?
Geraageranya ensengeka enzijuvu etekeddwa okusinga erinnya ly'omukutu oba omuwendo gw'okugula. Weekenneenye ekkubo ly’enkola, emitwe gya bond, ebikozesebwa mu flip, modulo z’ebintu, okukwata hardware, vision package, tooling inventory, controller, software, refurbishment scope n’obujulizi bwa FAT.
Oyagala Obuyambi Okwetegereza Ensengeka Ya BESI Flip Chip Bonder?
Gabana ebifaananyi by’ekyuma ebiriwo, amawulire agakwata ku mutendera, okukuba ekifaananyi ky’ekipapula, sayizi ya die, ensengeka ya substrate, ekkubo ly’ebintu, ebifulumizibwa ekigendererwa, ebikwata ku bikozesebwa n’okutambula kw’enkola okusuubirwa. Okwekenenya okw’omugaso kutandika n’ekkubo lyennyini erya package n’ensengeka y’ekyuma ekiweereddwa.
