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BESI DATACON 8800 si kyuma kimu ekinyweza die bonding.Erinnya lya DATACON 8800 likwata ku ndagiriro za pulatifomu ez’enjawulo eziyinza okuweereza amakubo ag’enjawulo ennyo ag’okupakinga semikondokita. Ensengeka ya DATACON 8800 FC QUANTUM eyinza okwekenneenyezebwa okukola mass reflow flip chip, ate ensengeka ya DATACON 8800 CHAMEO eyinza okwekenneenyezebwa ku nkola y’emirimu gy’okupakinga egy’omulembe egya chip eziwera, fan-out, wafer-level oba okusingawo.
Enjawulo eyo nsonga nga tugeraageranya aEkyuma kya BESI DATACON, omuDATACON omukwasi wa bonder, omuEkyuma ekikwata ebifa ekya DATACON, oba a ekozesebwaEKYUMA 8800ebigambo ebijidwa munjogera yomuntu. Okusalawo okutuufu tekesigamiziddwa ku lupapula lw’erinnya lwa DATACON 8800 lwokka. Kisinziira ku kkubo ly’ekipapula eryetaagisa, ensibuko y’okufa, ensengeka ya substrate, okutambula kw’ebintu, ebikozesebwa, enkola y’okulaba, modulo z’okukwata, enkola y’okukebera n’ensengeka y’ekyuma entuufu.
Ekitabo kino kinnyonnyola engeri endagiriro za DATACON 8800 FC QUANTUM ne CHAMEO platform gye zaawukana, ebibuuzo by’enkola ebirina okuddibwamu nga tebannalonda byuma, ne baguzi bye balina okukakasa nga tebannakkiriza quotation ya DATACON 8800.
Mu bufunze: FC QUANTUM ne CHAMEO
FC QUANTUM ne CHAMEO tezirina kutwalibwa nga automatic like-for-like alternatives. Zitegeerekeka bulungi nga endagiriro ez’enjawulo ez’omukutu gwa DATACON 8800 ku bintu eby’enjawulo ebikulembeza okufulumya.
FC QUANTUM, ekibiina kya FCokutwalira awamu ye ntandikwa esinga okukwatagana ku makubo g’okufulumya okuva mu chip-to-substrate nga sipiidi, okutambula kw’okufulumya okuddiŋŋana n’okufuga enkola bikulu.
CHAMEOokutwalira awamu y’entandikwa esinga okukwatagana ku makubo g’okupakinga aga chip eziwera, fan-out, wafer-level, face-up, face-down oba advanced packaging nga ensengeka y’enkola n’okukyukakyuka mu kukwata bye bisinga obukulu.
Tewali linnya lya pulatifomu lyokka likakasa nti ekyuma ekiweereddwayo kirimu emitwe gya bond egyetaagisa, ebikozesebwa, ebisitula, kkamera, modulo za fluxing, eby’okulonda eby’okukebera oba pulogulaamu.
DATACON 8800 ekozesebwa erina okwekenneenyezebwa ng'enkola enzijuvu etegekeddwa okusinga nga famire ya pulatifomu eya bulijjo.
Lwaki Okulonda Platform ya DATACON 8800 Kulina Okutandika N'ekkubo lya Package
Abaguzi babiri bombi bayinza okunoonya BESI DATACON die bonder ate nga beetaaga ebyuma eby’enjawulo ddala. Omuntu ayinza okwetaaga okuteekebwa kwa chip ya flip reflow ey’obuzito obw’amaanyi ku substrates ezitali zimu. Ekirala kiyinza okwetaaga ekkubo erya chip eziwera nga lirina ebika bya die eby’enjawulo, carriers ezikoleddwa ku mutindo, embeera enzibu ey’okukwatagana n’ebintu eby’enjawulo. Ow’okusatu ayinza okwetaaga enkola y’okupakinga okuva mu fan-out oba wafer-level nga erina ebyetaago ebitongole eby’okukwata face-up oba face-down.
Pulojekiti zonsatule ziyinza okuzingiramu ebyuma bya DATACON 8800, naye tezirina kutandika na lukalala lw’eby’ekikugu lwe lumu.
Omusingi gw’okulonda:Sooka olonde enkola y’okupakinga. Oluvannyuma kakasa oba ekyuma kya DATACON 8800 ekiweereddwa kirina enkwata eyeetaagisa, okukozesa, okulaba, ebintu n’ensengeka y’enkola.
Erinnya lya pulatifomu liyamba okuzuula amaka g’ebyuma. Tekidda mu kifo kya kwekenneenya mu bujjuvu engeri die gy’eyingira mu kyuma, engeri gy’alondebwamu, gy’efuumuulwa, gy’esengekebwamu, gy’eteekebwamu, gye yeekebejjebwa, gye yazuulibwamu n’etwalibwa mu mutendera gw’enkola oguddako.
DATACON 8800 FC QUANTUM vs CHAMEO: Enkola y’okugeraageranya mu nkola
| Ekitundu eky’okusunsulamu | DATACON 8800 FC OMUKULU | DATACON 8800 CHAMEO |
|---|---|---|
| Entandikwa eya bulijjo | Mass reflow flip chip ne amakubo g’okufulumya chip-to-substrate. | Amakubo ag’okupakinga ag’omulembe agalimu chip eziwera, fan-out, wafer-level n’okusingawo. |
| Essira erissiddwa ku kukola ebintu | Entambula y’okufulumya, okuddiŋŋana, sipiidi, okufuga enkola n’okutuukiriza okwekuusa ku makungula. | Enkola ekyukakyuka, enkwata ey’omulembe, embeera z’okufa eziwera n’okutambula kw’okupakinga okukwata ku nkola. |
| Okuddamu okwetegereza Die ne Substrate | Enyanjula y’okufa, embeera ya bump oba interconnect, ekkubo lya substrate, flux oba material process n’okufulumya throughput. | Oluguudo olutunudde waggulu oba olutunudde wansi, ensengeka ya chip eziwera, enkola ya wafer oba carrier, okuzimba package n’ebyetaago by’okukwata eby’omulembe. |
| Okuddamu okwetegereza ebikozesebwa | Ebikozesebwa mu flip, pickup nozzles, fluxing oba material hardware, ebikozesebwa mu substrate n’ebintu ebikolebwa mu voliyumu ennene. | Ebikozesebwa mu kukola bond ebitongole, ebikozesebwa mu ngeri ey’enjawulo, carrier plates, wafer tools, multi-chip accessories n’ebikozesebwa mu nkola ey’enjawulo. |
| Okwekkaanya Okwolesebwa | Okukwataganya okufulumya, okutegeera die, okuzuula substrate reference, okukakasa okuteeka n’enkola y’emirimu gy’okufuga amakungula. | Ebiwandiiko ebizibu ebikwata ku kulaganya, embeera z’omutwala oba panel, omutendera gw’okulaganya kwa chip eziwera n’ebyetaago by’okukebera ebikwata ku nkola. |
| Obulabe Obukulu mu Kugula | Okulowooza nti throughput enkulu kitegeeza nti ebintu ebyetaagisa ne modulo z’enkola ziteekebwamu. | Okulowooza nti omukutu gw’okupakinga ogw’omulembe gulimu ebikozesebwa ebituufu, enkwata y’abasitula n’ensengeka y’okukebera eyeetaagisa. |
Nga FC QUANTUM Etera okuba Entandikwa Esinga Okukwatagana
FC QUANTUM etera okuba obulagirizi bwa DATACON 8800 obusinga okukwatagana nga pulojekiti essira erisinga kulissa ku mass reflow flip chip production, repeated chip-to-substrate assembly, stable high-volume process flow and production-oriented placement control.
Ku pulojekiti ey’ekika kino, omuguzi alina okukakasa ebisinga ku famire ya platform ne output claim. Ekibuuzo ekituufu kiri nti oba ekyuma ekiweereddwa kirimu ebikozesebwa ebyetaagisa eby’ensibuko y’okufa, enkola ya flip, ekkubo ly’okuteekateeka ebintu, okukwata substrate, enkola y’okulaba, ebikozesebwa mu kukola n’ensonga y’okuzzaawo.
Ebibuuzo by'olina Okubuuza ku FC QUANTUM Quotation
Module ki eza wafer, carrier, strip, boat oba substrate eziteekebwawo?
Bikozesebwa ki ebikwata die pickup ne flip ebizingirwamu?
Ensengeka ewereddwa erimu modulo eyeetaagisa ey’okufuuwa, okunnyika oba okuteekateeka ebintu?
Ekyuma kino kyali kitegekeddwa ku sayizi ki, obuwanvu, ensengeka y’okuyunga n’ensengeka ya substrate?
Kkamera ki, optics ne illumination configuration eteekeddwamu?
Biki ebiyitibwa nozzles, fixtures, cavity plates oba ebikozesebwa mu kusitula ebirimu?
Omugabi asobola okulaga ensengeka y’okukwatagana n’okuteeka emirimu mu kiseera kya FAT?
Nga CHAMEO Etera Okubeera Entandikwa Esinga Okukwatagana
CHAMEO etera okuba obulagirizi bwa DATACON 8800 obusinga okukwatagana ng’ekkubo ly’okupakinga lirimu okukuŋŋaanya chip eziwera, okufuluma mu ffaani, okupakinga ku ddaala lya wafer, okuteekebwa mu maaso waggulu oba ffeesi wansi, okukwata abasitula okuzibu oba omutendera gw’enkola ogwetaagisa okukyukakyuka okusingawo okukwata ku nkola.
Mu pulojekiti zino, okusalawo okukulu tekutera kuba kwa sipiidi yokka ey’okuteeka. Abaguzi balina okussa essira ku kutebenkera kw’abasitula, okulungamya die, ensengeka ya substrate oba panel, ensengeka ya chip eziwera, enkola y’okunyweza, vision references, process inspection n’ekkubo ettuufu ery’okukwata ebintu.
Ebibuuzo by'olina Okubuuza ku CHAMEO Quotation
Ekyuma ekiweereddwa kitegekeddwa okutunula waggulu, okutunula wansi oba ekkubo ly’enkola etabuddwa?
Carrier ki, wafer, panel, tray oba substrate formats ki eziyinza okuwagira hardware eziteekeddwamu?
Work heads ne process stations mmeka eziteekebwawo?
Bikozesebwa ki, nozzles, fixtures, carrier plates ne calibration references ezirimu?
Enkola y’okwolesebwa n’okulaganya ku geometry y’ekipapula egenderere y’eruwa?
Waliwo modulo yonna ey’enjawulo ey’okuteekateeka ebintu, okubugumya, okwekebejja oba okuwonya ebiteekeddwamu?
Omugabi asobola okulaga ensengeka ya chip eziwera oba enkwata ekwatagana n’ebintu ebikiikirira?
Mass Reflow, Fan-Out ne Hybrid Bonding Si kye kimu ku kusalawo ku byuma
Okupakinga okw’omulembe kutera okuteesebwako ng’omutendera gumu, naye okusalawo kwennyini kw’ebyuma kukyuka nnyo n’enkola ey’omubiri.
Mass Reflow Okukyusakyusa Chip
Ekkubo ly’okuddamu okukulukuta mu bungi litera okussa essira ddene ku kutambula kw’ebintu okuddiŋŋana, sipiidi y’okufulumya, okukwata okuva ku kufa okutuuka ku substrate, okukwatagana, okuteekateeka flux oba ebintu n’okufuga enkola okusinziira ku makungula. Enkola eno erina okwekenneenya okusinziira ku kutabula kw’ebyuma okusuubirwa, ekkubo lya substrate, okukyusa ebintu n’obwetaavu bw’okufulumya mu kkolero.
Okupakinga mu Fan-Out ne Wafer-Level
Pulojekiti z’okupakinga ku ddaala lya fan-out ne wafer ziyinza okussa essira ddene ku nneeyisa y’abasitula, enkwata ya wafer oba panel, ensengeka y’okuteeka die, okutunula mu maaso oba okutunula wansi, okulowooza ku nsonga ezikwata ku warpage, enkola y’okukwataganya n’embeera z’okukebera ezikwata ku package.
Hybrid Bonding n’okuyungibwa kwa Density eya waggulu
Amakubo agakwatagana ag’omugatte (hybrid bonding) n’amakubo agakwatagana (hybrid-density interconnect routes) galina okutwalibwa nga pulojekiti ez’enjawulo ez’okupakinga ez’omulembe. Obusaanira bw’ekyuma kyonna kisinziira ku nsengeka y’enkola entuufu, ekyetaagisa okukwatagana, embeera y’obuyonjo, okupima, ekkubo ly’abasitula, enkola y’okukozesa n’okukakasa.
Tolowooza nti ekyuma ekyogerwako ng’ebyuma eby’omulembe eby’okupakinga kibeera kyetegefu mu ngeri ey’otoma okukola pulojekiti ey’enjawulo ey’okusiba eby’omugatte oba ey’okuyunga ebintu mu density enkulu. Ensengeka etekeddwako erina okukakasibwa ku ddaala ly'ekyuma.
Ebitundu mukaaga eby'okusengeka DATACON 8800 Ebiyinza Okukyusa Obusobozi Obw'amazima
1. Ensibuko ya Die n’Okwanjula Ebintu
Kakasa oba die eweebwa okuva mu wafer, tray, Gel-Pak®, waffle pack, carrier, strip, panel oba ensonda endala. Ensibuko ya die esalawo ebikozesebwa ebyetaagisa mu kukwata, ebikozesebwa mu kukwata, enkola y’okufulumya n’ensengeka y’enkola.
2. Ebikozesebwa mu Flip n’Okuteeka
Weekenneenye ebikozesebwa mu flip ebiteekeddwamu, nozzles, eject tools, bond tools, tool holders ne calibration references. DATACON die bonder esobola okuba nga emaliridde mu byuma ate nga ebulwa ebikozesebwa ebikulu mu nkola ebyetaagisa ku kipapula ekigendererwa.
3. Enkwata ya Carrier, Substrate ne Panel
Kakasa ekkubo ly’ebintu mu bujjuvu okuva ku kutikka okutuuka ku kuteeka n’okutikkula. Okukwatagana kw’ekitwala, substrate, wafer, eryato, strip, panel ne fixture kulina okwekenneenya okusinziira ku dizayini y’ebintu yennyini.
4. Module z’okuteekateeka ebintu
Okusinziira ku kkubo, enkola eyinza okwetaagisa okufuuwa, okunnyika, okugaba, okubugumya, okuwonya, okukyusa ebintu oba omutendera omulala ogw’okuteekateeka. Kakasa modulo ki eziteekeddwawo era oba zikwatagana n’enkola y’ebintu egenderere.
5. Okwolesebwa, Okukwatagana n’okukebera
Obusobozi bw’okulaba businziira ku bikozesebwa bya kkamera, eby’amaaso, ekitangaala, ekifo ky’okulaba, pulogulaamu, embeera y’okupima n’ebintu ebijuliziddwa ku mubiri ku die, substrate oba carrier. Kkamera erabika yokka tekakasa kukwatagana na nkola.
6. Controller, Software ne Okuzzaawo Data
Weekenneenye omulembe gwa controller, embeera ya PC y’amakolero, motion hardware, I/O, software version, enabled options, backups, recovery media, process files n’ebiwandiiko. Ebintu bino bisobola okukosa ennyo okuteekebwako n’okuwagira okumala ebbanga eddene.
Engeri y'okugerageranya ebiwandiiko bibiri ebya BESI DATACON 8800
Ebijuliziddwa bibiri byombi biyinza okuwandiika “BESI DATACON 8800” nga binnyonnyola ebyuma eby’enjawulo ddala. Okugeraageranya kulina okutandika n’olupapula lw’okusengeka oluwandiikiddwa, so si bbeeyi y’okugula.
| Ekitundu eky’okugeraageranya | Okuwaayo A | Okuwaayo B | Ekibuuzo ky’Okusalawo |
|---|---|---|---|
| Obulagirizi bwa Pulatifoomu Entuufu | FC QUANTUM, CHAMEO oba ensengeka endala etegeerekese | FC QUANTUM, CHAMEO oba ensengeka endala etegeerekese | Ebyuma byombi bikwatagana n’ekkubo lye limu erya package? |
| Endagamuntu y’Ekyuma | Model, serial number n'omulembe gw'okufulumya | Model, serial number n'omulembe gw'okufulumya | Ensengeka eragiddwa esobola okukakasibwa okusinziira ku kyuma ekirabika? |
| Emitwe gya Bond n’Ebikozesebwa | Emitwe egyateekebwamu, ebikozesebwa, entuuyo n’ebinyweza | Emitwe egyateekebwamu, ebikozesebwa, entuuyo n’ebinyweza | Offer ki erimu process chain eyeetaagisa nga eyongeddeko ebitono? |
| Enkwata Modules | Wafer, tray, carrier, substrate, eryato, panel oba modulo za strip | Wafer, tray, carrier, substrate, eryato, panel oba modulo za strip | Ekyuma ki ekiwagira ekkubo ly’ebintu erigendereddwa? |
| Okwolesebwa n’Okukebera | Emirimu gya kamera, optics, okutaasa n’okulaganya | Emirimu gya kamera, optics, okutaasa n’okulaganya | Enkola ki esinga okukwatagana n’enkola y’okujuliza package? |
| Sofutiweya n’Okuzzaawo | Enkyusa ya pulogulaamu, eby’okulonda, okutereka n’ebiwandiiko | Enkyusa ya pulogulaamu, eby’okulonda, okutereka n’ebiwandiiko | Offer ki erimu akabi akatono ak’okussaako n’okuwagira? |
| FAT Scope | Ekyuma ekitegeerekese n’okugezesa enkola | Ekyuma ekitegeerekese n’okugezesa enkola | Omugabi ki asobola okuwa obujulizi obusinga amaanyi obukola? |
Ensobi Musanvu eza bulijjo mu kugula DATACON 8800
Ensobi 1: Okutwala DATACON 8800 nga Ekyuma Ekimu ekya Standard
DATACON 8800 ye famire ya pulatifomu. FC QUANTUM, CHAMEO n’ensengeka endala ezikwatagana zisobola okuweereza endagiriro z’enkola ez’enjawulo. Tandika n’ekkubo ly’okupakinga nga tonnageraageranya byuma.
Ensobi 2: Okugeraageranya Sipiidi Yokka ey’Okuteeka
High throughput ya mugaso nga ekyuma kirina die handling ezeetaagisa, okuteekateeka ebintu, tooling, substrate modules, okulaba n’okukebera emirimu gy’enkola etegekeddwa.
Ensobi 3: Okubuusa amaaso okukwatagana kwa Carrier ne Substrate
Ebibulamu oba ebitali bikwatagana carrier, panel, boat, substrate oba fixture hardware bisobola okulwawo pulojekiti ne bwe kiba nti pulatifomu y’ekyuma enkulu esaanira.
Ensobi 4: Okutwala Kkamera ng’obukakafu bw’omulimu gw’okukwatagana
Okukwatagana kisinziira ku nkola y’okulaba enzijuvu, omuli eby’amaaso, okumasamasa, pulogulaamu, okupima, ebikozesebwa ebijuliziddwa n’embeera z’ekipapula entuufu.
Ensobi 5: Okulowooza nti Ebikozesebwa eby’Olubereberye Bikwatagana n’Ekintu Ekipya
Ebikozesebwa ebiriwo biyinza okukolebwa ku sayizi endala eya die, ensengeka y’ekipapula, ekkubo ly’ebintu, enkola y’okutwala oba ensengeka y’okufulumya. Okukwatagana kw'ebikozesebwa kulina okukakasibwa okusinziira ku nkola egenderere.
Ensobi 6: Okukkiriza Empty Motion Video nga FAT Evidence
Vidiyo y’entambula etatikkiddwa tekakasa kukwata kufa, kukola ku flip, okukwatagana, okukwata substrate, okuteeka, okukebera, okuzzaawo ensobi oba okukwatagana kw’ebintu-enkola.
Ensobi 7: Okuleka Software n'Obuwagizi Okutuusa Nga Omaze Okutuusa
Okuyingira kwa controller, backups, option files, machine parameters, recovery media n’obuvunaanyizibwa bw’okuwagira birina okunnyonnyolwa nga tonnasindikibwa.
Ekigezo ky'okukkiriza mu kkolero eky'omugaso ekya DATACON 8800 kye kisaanidde okukakasa
Ekigezo ky’okukkiriza mu kkolero ekya DATACON 8800 kirina okukakasa endagamuntu n’embeera y’emirimu gy’enkola eweereddwa. Tekyetaagisa kukyusa bisaanyizo bya kukola mu bujjuvu, naye kisaana okulaga nti ekyuma kisobola okukola omutendera ogwekuusa ku nkola ogwakkaanyibwako ne modulo n’ebikozesebwa ebirimu.
| Ekitundu kya FAT | Biki Ebirina Okukakasibwa |
|---|---|
| Endagamuntu y’Ekyuma | Model, serial number, modules eziteekeddwawo, ebikozesebwa n’ebikozesebwa bikwatagana ne quotation. |
| Obukuumi n’okutandikawo | Power-up, emergency stops, safety interlocks, alamu, enzigi n’omutendera gw’okutandika bikola bulungi. |
| Emitwe gya Motion ne Bond | Axis homing, motion behavior, bond head movement, okuteeka ebikozesebwa n’emirimu gy’okuzzaawo biragiddwa. |
| Okwolesebwa n’Okukwatagana | Omutindo gw’ebifaananyi bya kkamera, okumasamasa, okutegeera ebijuliziddwa, okuddamu kw’okukwatagana n’embeera y’okupima byekenneenyezebwa. |
| Enkwata y’Ebikozesebwa | Module za wafer, tray, carrier, substrate, boat, strip, panel oba fixture ezirimu zigezesebwa wansi w’omutendera ogukkaanyiziddwaako. |
| Ekkubo ly’okukozesa ebikozesebwa n’enkola | Ebikozesebwa mu flip, nozzles, fixtures, plates ne material modules ebirimu byekenneenyezebwa okusinziira ku bunene obukkaanyiziddwaako. |
| Sofutiweya n’Okukwasa | Okuyingira kwa controller, embeera ya software, backups, option files, ebiwandiiko eby’ekikugu n’olukalala lw’okusengeka olusembayo bikakasibwa. |
Ekiteeso ekisembayo: Geraageranya olujegere lw’enkola nga tonnageraageranya bbeeyi ya kyuma
Ekyuma kya BESI DATACON 8800 kiyinza okuba eky’okukola eky’amaanyi ng’ensengeka yaakyo essiddwamu ekwatagana n’ekkubo eryetaagisa ery’okupakinga. Okulonda okutuufu kwesigamye ku bingi okusinga oba quotation egamba nti FC QUANTUM, CHAMEO, DATACON die bonder oba DATACON machine.
Nga tonnaba kukkiriza kuwaayo, kakasa obulagirizi obutuufu obwa pulatifomu, endagamuntu y’ekyuma, emitwe gya bond, ebikozesebwa, modulo z’okuteekateeka ebintu, enkwata y’abasitula n’ebintu ebikozesebwa, vision package, embeera ya software, obujulizi bw’okupima n’obunene bwa FAT. Enkola eno eyamba okuziyiza ensobi eya bulijjo ey’okugula: okugula amaka ga pulatifomu agasaanira nga galina ensengeka etasaana etekeddwa.
Ebikozesebwa mu BESI DATACON ebikwatagana
Engeri y'okulondamu BESI Flip Chip Bonder ku Mass Reflow, Multi-Chip ne Fan-Out Packaging
Engeri y'okulondamu ekyuma kya BESI Die Bonding Machine: DATACON vs Esec Guide
Ebibuuzo Ebitera Okubuuzibwa Ku BESI DATACON 8800
BESI DATACON 8800 ekyuma kimu ekinyweza die bonder?
Nedda DATACON 8800 ye famire ya platform erimu endagiriro ez’enjawulo nga FC QUANTUM ne CHAMEO. Obusobozi obw’omugaso obw’ekyuma ekigere businziira ku kkubo lyakyo ery’enkola, modulo eziteekeddwawo, emitwe gya bond, okukwata hardware, tooling, vision package, controller ne software configuration.
Njawulo ki eri wakati wa DATACON 8800 FC QUANTUM ne CHAMEO?
FC QUANTUM okutwalira awamu yeekenneenyezebwa ku mass reflow flip chip ne chip-to-substrate production routes, ate CHAMEO okutwalira awamu yeekenneenyezebwa ku multi-chip, fan-out, wafer-level ne specialized advanced packaging workflows. Okutuukagana kw'enkola okutuufu kisinziira ku nsengeka y'ekyuma ekissiddwa.
DATACON 8800 platform ki esinga okukwatagana ne mass reflow flip chip?
FC QUANTUM etera okuba entandikwa esinga okukwatagana mu kwekenneenya chip ya mass reflow flip. Abaguzi bakyalina okukakasa enkwata ya die, modulo za substrate, tooling, okuteekateeka ebintu, okwolesebwa, okwekebejja n’okufulumya ebyetaago ku yuniti entuufu ewereddwa.
DATACON 8800 CHAMEO esobola okukozesebwa okupakinga mu ffaani?
Ensengeka za CHAMEO zisobola okwekenneenyezebwa ku makubo g’okupakinga aga fan-out ne wafer-level okusinziira ku modulo z’okukwata, okukozesa, okulaba, okutwala n’enkola eziteekeddwawo. Ensengeka yennyini eweereddwa erina okwekenneenya okusinziira ku nteekateeka y'ekipapula.
Lwaki quotations za DATACON 8800 tezirina kugeraageranyizibwa ku bbeeyi yokka?
Ebijuliziddwa bibiri ebya DATACON 8800 biyinza okubeeramu emitwe egy’enjawulo, ebikozesebwa, abasitula, modulo z’okukwata, kkamera, pulogulaamu, ebikozesebwa mu nkola n’obunene bw’obuyambi. Okuwaayo okw’ebbeeyi entono kuyinza okuleeta omuwendo gwa pulojekiti gwonna ogw’oku waggulu singa ebintu ebikulu eby’okusengeka biba bibula.
Kiki ekirina okukeberebwa nga tonnagula kyuma kya DATACON 8800 ekikozesebwa?
Kakasa model entuufu n’ennamba ya serial, emitwe gya bond egyateekebwamu, ebikozesebwa, modulo z’okukwata, hardware y’okuteekateeka ebintu, vision package, embeera ya controller, software backups, obujulizi bw’okupima, obuwanvu bw’okuddaabiriza, ekiteeso kya FAT n’enteekateeka y’okuwagira.
DATACON 8800 FAT yandibaddemu ki?
FAT ey’omugaso esobola okuli okukakasa endagamuntu y’ekyuma, okukebera obukuumi, okutambula kw’ekisiki, okukola kw’omutwe gwa bond, okukwataganya okulaba, okukwata ebintu, okukakasa ebikozesebwa, okwekenneenya software backup n’omutendera gw’enkola ogukiikirira ng’ebintu ebisaanira biriwo.
Ekyuma kya DATACON 8800 kisobola okukozesebwa okukola hybrid bonding?
Endagiriro ezenjawulo ez’omukutu gwa CHAMEO ziyinza okukwatagana n’okuyunga okugatta n’okukozesa okuyungibwa kwa density enkulu. Naye, okukwatagana kw’ebyuma (hybrid bonding) nkola ya njawulo, era ensengeka y’ekyuma entuufu, embeera y’obuyonjo, okukwatagana kw’amaaso, okukwata abasitula, okukozesa ebikozesebwa n’enkola y’okukakasa birina okwekenneenya nga tebannalonda.
Weetaaga Obuyambi Okugeraageranya Ensengeka za DATACON 8800 FC QUANTUM ne CHAMEO?
Gabana ebifaananyi by’ekyuma, amawulire agakwata ku mutendera, olukalala lw’okusengeka oluliwo, okukuba ekifaananyi ky’ekipapula, enkola ya die ne substrate, ekkubo ly’ebintu, ebifulumizibwa ekigendererwa, ebikwata ku bikozesebwa n’okutambula kw’okufulumya okusuubirwa. Okwekenenya DATACON 8800 okw’omugaso kutandikira ku nkola yennyini ey’okupakinga n’ensengeka y’ekyuma ekiweereddwa.
