BESI Multi Module Attach Platforms

BESI DATACON 2200 evo Die Bonder Platform Guide

Q: Is BESI DATACON 2200evo the same as DATACON 2200 evo?

Yes. BESI DATACON 2200evo is commonly used as a search variation of the official DATACON 2200 evo platform name. The exact machine version should still be confirmed because the family includes evo, evo plus, hF, hS and advanced configurations.

BESI DATACON 2200 evo is a configurable multi-module attach platform used for die attach, multi-chip assembly and selected flip-chip workflows. The practical capability of an offered DATACON 2200 evo machine depends on its exact version, bond head arrangement, vision package, wafer handling, tooling and installed process modules.

For used and refurbished DATACON equipment, the platform name alone is not enough. A suitable machine should be assessed against the intended package route, die format, process material, target output, software condition and available production tooling.

Multi-Chip Die Attach Configurable Process Modules Used Equipment Evaluation

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Share your package drawing, die size, handling format, process material, required placement accuracy and target output for a more relevant equipment review.

BESI DATACON 2200 evo die bonder platform in a semiconductor manufacturing environment

Platform Assessment Evaluate the exact DATACON 2200 evo configuration before planning a replacement or production upgrade.

DATACON Platform Overview Automated semiconductor die bonding equipment for BESI DATACON 2200 evo platform evaluation

What Is BESI DATACON 2200 evo?

A Multi-Module Attach Platform, Not One Fixed Machine Specification

BESI DATACON 2200 evo is a high-accuracy multi-chip die bonder platform designed for die attach and flip-chip applications. The base evo platform may be configured with functions such as integrated dispensing, 12-inch wafer handling, automatic tool changing and application-specific tooling.

The DATACON 2200 evo family includes multiple versions, including evo plus, hF, hS and advanced. These versions can differ in placement capability, bond-force range, vision architecture, handling options, process materials and application direction.

Practical selection principle

Confirm the exact model, installed options, tooling package, machine condition and sample-test capability before treating a DATACON 2200 evo system as a like-for-like replacement.

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Platform Variants

DATACON 2200 evo, evo plus, hF, hS and advanced: What Should Be Compared?

The DATACON 2200 evo name includes more than one process direction. The matrix below helps separate the major platform versions before comparing a used or refurbished machine against your application requirements.

Compare the exact machine version.

Configuration, production generation, installed process modules and available tooling can materially change the capability of an offered DATACON 2200 evo unit.

Platform Version	Typical Evaluation Direction	Key Technology Focus	Used Equipment Review Focus
DATACON 2200 evoBase high-accuracy multi-chip die bonder platform.	Die Attach, Multi-Chip and Selected Flip-ChipEvaluate against die source, substrate flow, process material, working heads and package architecture.	Flexible Multi-Module AttachIntegrated dispensing, 12-inch wafer handling, tool changing and application-specific tooling may be relevant depending on the offered unit.	Configuration CompletenessConfirm handling modules, bond heads, dispensing options, process fixtures, software status and included accessories.
DATACON 2200 evo plusEnhanced multi-module attach platform.	Higher Accuracy and Production Stability ReviewEvaluate whether the process benefits from the camera system, thermal compensation approach and high-speed image processing package.	Multi-Chip Production AutomationReview automatic wafer and tool changing, pick-and-place tools, eject tools, alignment functions and process-material options.	Vision and Tooling ValidationConfirm camera condition, image-processing hardware, calibration tools, tool changer operation and available process setup.
DATACON 2200 evo hFHigh-force multi-chip die bonding configuration.	Power Modules, IGBT, MCM and SiP EvaluationReview high-force bonding, heating requirements, material route and mechanical package requirements.	High Bonding Force ApplicationsConfirm high-force bond head, closed-loop force and temperature control, sintering capability, heated tooling and substrate heating options.	Thermal and Force-System ConditionReview the bond head, heating hardware, force calibration, safety systems, process tooling and actual condition of the mechanical assembly.
DATACON 2200 evo hSHigh-speed multi-module attach configuration.	High-Output Die Attach ReviewEvaluate target UPH, die size range, vision alignment, substrate handling and required process repeatability.	Accuracy, Image Processing and OutputReview high-speed image processing, automatic handling, placement requirement and the actual material flow of the intended line.	Production-Cycle ValidationConfirm motion condition, camera performance, feeder or wafer setup, test output and availability of compatible tooling.
DATACON 2200 evo advancedHigher-accuracy multi-module attach platform.	Precision Multi-Chip and Flip-Chip ReviewEvaluate whether the package route needs higher placement accuracy, configurable camera options, contactless height measurement or multi-tool handling.	Advanced Vision and Process FlexibilityReview gantry and controller generation, optics, vision setup, bond-force range, dispensing modules and process-tool configuration.	Exact Option VerificationConfirm installed camera system, gantry condition, controller generation, height-measurement capability, dispensing hardware and process recipes.

DATACON Die Bonder Process Fit

Where a DATACON 2200 evo Die Bonding Machine May Be Evaluated

The right machine fit begins with the attachment process and package structure. Production output and nominal placement specifications should only be compared after the die, material, substrate, tooling and handling route are confirmed.

Process fit comes before brand fit.

Useful comparison starts with how the die is picked, placed, bonded, inspected and transferred through the intended production workflow.

Multi-Chip Assembly

Review die sequence, multiple pick-and-place tools, wafer or tray presentation, carrier format, package geometry, adhesive process and inspection requirements.

Die Attach and Material Placement

Confirm whether the planned process uses epoxy, soldering, thermo-compression, eutectic or another material route, then validate the required dispensing and heating configuration.

Selected Flip-Chip Workflows

Check alignment method, die orientation, flux or dipping route, wafer handling, substrate format, placement tolerance and the process verification method.

Power and High-Force Applications

For hF-style configurations, review bond force, temperature control, sinter process, substrate heating, thermal tooling and package-specific mechanical requirements.

Precision die bonder configuration review with vision alignment and semiconductor handling modules

BESI DATACON Machine Review

Six Configuration Areas That Determine Practical Capability

A DATACON 2200 evo machine must be evaluated as a complete production configuration. The platform series does not reveal whether the offered unit has the correct process hardware, software options, handling modules and tooling for a target package route.

Bond head design, force range, rotation and heated-tool options
Vision cameras, optics, illumination and alignment functions
Wafer, tray, Gel-Pak®, feeder, carrier and substrate handling
Dispensing, fluxing, stamping, sinter or material-preparation modules
Controller, motion system, software version and enabled options
Nozzles, fixtures, calibration tools and line-integration interfaces

Used & Refurbished Evaluation

What Should Be Checked Before Buying a Used DATACON 2200 evo?

A used DATACON machine can be commercially practical when the exact configuration, unit condition, process tooling, test method and support scope are reviewed before shipment.

Request evidence before committing.

Current photos, installed-option lists, available tooling, machine-test results, electrical data and a documented refurbishment scope are more useful than a generic model description.

Exact Model and Version

Confirm whether the unit is base evo, evo plus, hF, hS or advanced, then verify its production generation, serial-number configuration and installed modules.

Bond Head and Motion Condition

Review bond head condition, force range, stage travel, gantry or motion system, bearing condition, cable routing and preventive maintenance history.

Vision and Calibration

Verify cameras, optics, illumination, alignment functions, calibration status, image-processing hardware and the availability of replacement components.

Handling and Tooling Package

Confirm wafer frames, trays, carriers, feeders, nozzles, eject tools, substrate fixtures, calibration tools and package-specific accessories.

Controller and Software Status

Check controller hardware, PC condition, software environment, recovery media, enabled options, process data, technical documentation and barcode or mapping functions where needed.

Qualification and Support Plan

Define sample-test requirements, acceptance criteria, packing method, installation scope, utilities, training need, spare-part plan and post-installation support.

Configuration-Specific Reference

DATACON 2200 evo Family: Published Reference Comparison

The values below are published reference points for named DATACON 2200 evo versions. They are not a confirmation of the actual capabilities, included options or condition of an individual used machine.

Verify the offered unit.

Machine generation, installed hardware, tooling, software and maintenance condition can materially affect practical performance.

DATACON 2200 evo	Published X/Y placement accuracy: ±10 µm @ 3σ; programmable bond force: 0.5N to 75N; die attach throughput reference: up to 7,000 UPH per module.
DATACON 2200 evo plus	Published X/Y placement accuracy: ±7 µm @ 3σ; programmable bond force: 0.5N to 75N; die attach throughput reference: up to 7,000 UPH per module.
DATACON 2200 evo hF	Published X/Y placement accuracy: ±10 µm @ 3σ; bond-force range: 0.5N to 500N; designed for high-force process requirements.
DATACON 2200 evo hS	Published X/Y placement accuracy: ±7 µm @ 3σ; programmable bond force: 0.5N to 75N; die attach throughput reference: up to 12,000 UPH per module.
DATACON 2200 evo advanced	Published X/Y placement accuracy: ±3 µm @ 3σ; theta accuracy: ±0.07° @ 3σ; programmable bond force: 0.5N to 25N.
Common Handling Reference	Several DATACON 2200 evo variants list 4-inch to 12-inch wafer support and a 13-inch × 8-inch substrate working range, subject to the exact version and installed configuration.

When a DATACON 2200 evo Is Worth Evaluating

The platform is worth shortlisting when the offered configuration closely matches the target die attach, multi-chip, selected flip-chip or high-force process route.

The exact version and installed modules are documented.
Required wafer, tray, feeder, carrier or substrate handling is available.
Bond head, force range, vision package and process tooling fit the intended package.
Machine condition and software environment can be verified before shipment.
Sample testing, installation planning and support scope are commercially practical.

When to Pause and Verify Before Purchase

A DATACON 2200 evo nameplate does not prove that the machine is technically suitable for every die bonding machine application.

The offered machine has no reliable configuration list or condition report.
Required tooling, process modules, feeders or wafer handling are missing.
The intended package route has not been tested on the offered configuration.
Camera, controller, motion or bond-head functionality cannot be demonstrated.
Utilities, installation needs, spare-part access or support scope remain unclear.

Technical & Procurement Questions

BESI DATACON 2200 evo Die Bonder FAQ

These questions cover the practical checks that normally matter before comparing, purchasing or refurbishing a DATACON 2200 evo die bonding machine.

What is a BESI DATACON 2200 evo machine?

BESI DATACON 2200 evo is a multi-module attach platform used for die attach, multi-chip assembly and selected flip-chip workflows. Its practical capability depends on the exact evo version, installed process modules, handling options, tooling and condition of the offered unit.

Is BESI DATACON 2200evo the same as DATACON 2200 evo?

Yes. “BESI DATACON 2200evo” is commonly used as a search variation of the official DATACON 2200 evo platform name. The exact machine version should still be confirmed because the family includes evo, evo plus, hF, hS and advanced configurations.

What is the difference between DATACON 2200 evo and evo plus?

The evo plus configuration is positioned with enhanced vision, high-speed image processing, thermal compensation and automatic multi-chip production functions. The exact capability of a used machine depends on which options are physically installed and operational.

What is DATACON 2200 evo hF used for?

DATACON 2200 evo hF is designed for high-bond-force applications and is commonly evaluated for power modules, IGBT, MCM and SiP workflows. Process suitability depends on the available force range, heating setup, material route and package tooling.

Can a DATACON 2200 evo handle die attach and flip-chip processes?

Several configurations are designed for die attach, multi-chip and selected flip-chip workflows. The exact process route should be verified against bond head, dispensing or fluxing setup, vision system, material handling and tooling package.

What should be checked before buying a used DATACON 2200 evo?

Confirm the exact model, installed options, bond head, force range, vision system, wafer or tray handling, controller condition, software status, calibration records, available tooling, functional test information and refurbishment scope.

Are published DATACON 2200 evo specifications valid for every machine?

No. Published values belong to specific DATACON 2200 evo versions and configurations. The capability of an individual used machine must be confirmed through its model identity, installed options, tooling, maintenance condition and functional validation.

What information is needed for a DATACON 2200 evo recommendation?

Provide the package drawing, die dimensions, die thickness, material route, wafer or tray format, substrate type, target UPH, placement tolerance, process temperature, available tooling and any existing line constraints.

Need a DATACON 2200 evo Configuration Review?

Share your package drawing, die and substrate format, required material process, target output and any available machine details. This makes it possible to assess whether an offered BESI DATACON 2200 evo configuration is worth qualifying for your production line.

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