What is a BESI flip chip bonder?

A BESI flip chip bonder is semiconductor assembly equipment used to pick, flip, align and place die in flip chip packaging workflows. The exact process capability depends on the platform family and installed configuration, including handling modules, tooling, vision and process hardware.

What is the difference between a flip chip bonder and a flip chip mounter?

The terms are often used interchangeably. In practical equipment evaluation, the important issue is the actual production function of the machine, including die pickup, flip operation, material preparation, alignment, placement, inspection and handling sequence.

Which BESI flip chip bonder is suitable for mass reflow production?

Mass reflow flip chip projects should be evaluated against platforms and configurations designed for the required production speed, material flow, die handling, substrate route, vision system and process-control requirement. The exact machine configuration must be confirmed before selection.

Can a DATACON 2200 evo be used for flip chip applications?

Some DATACON 2200 evo configurations can be evaluated for selected flip chip workflows. Buyers should confirm flip tools, handling modules, vision alignment, material preparation, fixtures and application-specific process capability.

What should be checked before buying a used flip chip bonder?

Verify the exact machine version, bond heads, flip tools, nozzles, wafer and substrate handling modules, vision system, process modules, controller, software backups, tooling inventory, refurbishment scope and FAT proposal.

Why is tooling important for flip chip bonding?

Tooling can determine whether the machine can handle the target die, substrate and package route. Missing nozzles, flip tools, eject tools, carrier plates, fixtures or calibration references can delay qualification and increase project cost.

What should a flip chip bonder FAT include?

A useful FAT can include machine identity verification, safety checks, motion and bond head operation, vision alignment, handling-module tests, tooling confirmation, software backup review and a representative process sequence when suitable materials are available.

How do I compare two BESI flip chip bonder quotations?

Compare the full installed configuration rather than the platform name or purchase price. Review process route, bond heads, flip tools, material modules, handling hardware, vision package, tooling inventory, controller, software, refurbishment scope and FAT evidence.

BESI Flip Chip Bonder Selection Guide | Mass Reflow, Multi-Chip & Fan-Out

I-BESI flip chip bonder kufuneka ikhethwe ngokwendlela yenkqubo, kungekhona ngegama lomatshini kuphela.Iqonga elifanelekileyo le-high-speed mass reflow flip chip alinakulungiselelwa ulandelelwano lwe-multi-chip assembly sequence, inkqubo ye-fan-out, ifomathi ekhethekileyo ye-substrate okanye usetyenziso olufuna izixhobo ezahlukeneyo, umbono, ukuphathwa kunye neemeko zokuhlola.

Abathengi abafuna iIbhondi ye-IRON flip chip, I-DATACON flip chip bonder, Umatshini we-BESI flip chip, isixhobo sokufaka iitshiphusi ezijijekileyookanyeUmatshini weDATACONidla ngokuqala ngegama leqonga. Nangona kunjalo, indawo yokuqala eluncedo ngakumbi yindlela yokwenyani yepakeji: yeyiphi idayi ekufuneka ijikwe, indlela eza kuboniswa ngayo, yeyiphi i-substrate okanye i-carrier esetyenziswayo, indlela yokulungelelanisa eqinisekiswa ngayo, yeyiphi inkqubo yezinto ezifunekayo, kunye noluphi usukelo lwemveliso ekufuneka lufezekiswe.

Esi sikhokelo sichaza indlela yokuthelekisa imiyalelo ye-BESI flip chip bonder ye-mass reflow, i-multi-chip kunye ne-fan-out packaging workflows, kunye nemibuzo yokumisela umatshini ekufuneka iphendulwe ngaphambi kokuba kuvunyelwe izixhobo zokuthengwa, ukuhlaziywa okanye iziqinisekiso zenkqubo.

Semiconductor engineer reviewing a BESI flip chip bonder configuration in an advanced packaging cleanroom

Ngamafutshane: Ifanele ikhethwe njani iBESI Flip Chip Bonder?

Khetha i-BESI flip chip bonder ngokuqala uchaze indlela yephakheji, ifomathi ye-die, isakhiwo se-bump okanye sokudibanisa, uhlobo lwe-substrate, inkqubo yezinto, ulandelelwano lokuphatha, imfuneko yombono, ithagethi yokubeka kunye ne-throughput elindelekileyo. Emva koko qinisekisa ukuba uqwalaselo lwe-DATACON okanye lwe-Esec olunikezelwayo luquka iintloko zebhondi ezifunekayo, izixhobo ze-flip, ukuphathwa kwe-wafer, iimodyuli ze-substrate, izixhobo, iikhamera, imisebenzi yokuhlola, isoftware kunye nobubanzi benkxaso.

Iiprojekthi ze-flip chips eziphinda zibuyele kwi-mass reflow zihlala zibeka phambili isantya semveliso, ukuhamba kwezinto eziphinda-phindayo kunye nolawulo olupheleleyo lwenkqubo.
Iiprojekthi ze-multi-chip flip chips zihlala zifuna ukuphathwa okuguquguqukayo ngakumbi, amanyathelo enkqubo amaninzi kunye nezixhobo ezithile zesicelo.
Iindlela zokupakisha eziphuma kwifeni nakwi-wafer zifuna ukuphononongwa ngononophelo kwendlela yokuphatha i-substrate, icebo lokulungelelanisa, ulandelelwano lwenkqubo kunye neemeko zokuhlola.
Iinkqubo ezimbini ezinosapho olufanayo lweqonga zisenokwahluka kakhulu kwizixhobo ezifakiweyo kunye nokukwazi ukusebenza kwenkqubo.

Kutheni Ukukhethwa kweFlip Chip Bonder Kuqala Ngendlela Yenkqubo

Ukuhlanganiswa kwe-Flip chip akuyonto ithile esisigxina. Ulwakhiwo lwezixhobo olufunekayo luyatshintsha ngokuxhomekeke ekubeni inkqubo yakhelwe ngokujikeleziswa kobuninzi, ukubekwa kwe-chip-to-substrate, ukuhlanganiswa kwe-multi-chip, ukupakishwa kwe-fan-out, ukuphathwa kwephaneli okanye i-wafer, uqhagamshelo oluxineneyo okanye ukuhamba kwemveliso okukhethekileyo.

Iqonga linokuba nakho ukufikelela kwisantya esiphezulu, kodwa oko akuqinisekisi ukuba linendlela yokujika efunekayo, imodyuli yokulungiselela i-flux okanye izinto, ukuphathwa kwenkampani, indawo yokujonga, indlela yokuhlola emva kwebhondi, izixhobo zenkqubo okanye ulandelelwano lokubuyisela.

Umgaqo wokukhetha:I-flip chip bonder echanekileyo ngumatshini onokugqibezela uthotho lwenkqubo olufunekayo ngezixhobo ezichanekileyo, ukuhamba kwezinto, icebo lombono kunye nendlela yokuqinisekisa.

Iindlela Ezintathu Zokuvelisa Iitshiphu Ezifuna Izigqibo Ezahlukeneyo Zezixhobo

1. Ukuveliswa kweMass Reflow Flip Chip

Iindlela zokujika iitshiphusi ezijikelezayo ngobuninzi zihlala zivavanywa apho ukuhlanganiswa kwe-chip-to-substrate enomthamo ophezulu, ukuhamba kwezinto eziphindaphindwayo kunye nokusebenza kakuhle kwemveliso zezona mfuno ziphambili. Kule meko, uqwalaselo lomatshini kufuneka luxhase ukubonakaliswa kwedayi okucetywayo, ukuphathwa kwe-substrate, ukusebenza kwe-flip, ukulungiswa kwezinto, ulandelelwano lokubekwa kunye necebo lokulawula inkqubo.

Xa kuvavanywa i-BESI DATACON flip chip bonder yale ndlela, abathengi kufuneka bagxile kwizixhobo zokuvelisa ezifakiweyo endaweni yokujonga kuphela ubungakanani bomphumo ovela kwincwadana yeqonga.

Uqwalaselo lokuphathwa kwe-wafer kunye ne-substrate
Indlela yokubonisa isixhobo kunye nendlela yokutshintsha idayi
Indlela yokufunxa, ukuntywila okanye yokucubungula izinto apho kufanelekileyo
Ukulungelelaniswa kombono kunye nokuqatshelwa kwesalathiso se-substrate
Ukuhlolwa kwe-post-bond okanye imisebenzi yokulawula inkqubo
Iimfuno zokufaka izixhobo kunye nokutshintsha izixhobo

2. Indibano yeChip ye-Multi-Chip Flip

Ukuhlanganiswa kweetshiphu ezininzi kunokwazisa ukulandelelana kweenkqubo ezinzima ngakumbi. Imveliso enye inokufuna ubungakanani obahlukeneyo beedayi, izixhobo ezininzi, iindawo ezahlukeneyo zokukhetha, ukulandelelana okwahlukeneyo kokubeka, ukuphathwa okukhethekileyo kokuthwala okanye amanyathelo amaninzi ezinto ngaphakathi kwendlela enye yokuvelisa.

Kolu hlobo lweprojekthi, ukuguquguquka kunokubaluleka njengesantya. Umthengi kufuneka aqinisekise ukuba zingaphi iintloko zokusebenza ezifakiweyo, zeziphi izixhobo ezinokusetyenziswa, indlela umatshini ophatha ngayo utshintsho lokufa, nokuba ulandelelwano lwenkqubo lunokulungiswa na kunye nokuba zeziphi iimodyuli zezinto ezifakiweyo.

Inkqubo eyenza umsebenzi omnye wokubeka ngokuphindaphindiweyo ngesantya esiphezulu isenokungabi yindlela efanelekileyo yokucwangcisa indlela ye-multi-chip eneentlobo ezahlukeneyo ze-die kunye nolandelelwano oluntsonkothileyo.

3. Ukupakisha okuphuma kwiFan kunye neWafer

Imisebenzi yokupakisha ephuma kwifeni nakwinqanaba le-wafer kufuneka ihlolwe ngokubhekiselele kuyilo lwephakheji, indlela yokuthwala okanye ye-substrate, icebo lesalathiso sokubekwa, indlela yokuphatha idayisi, izixhobo zenkqubo kunye neemfuno zokuhlola. Ezi projekthi zinokugxininisa ngakumbi kulawulo lokulungelelaniswa, uzinzo lwe-substrate, ulandelelwano lwenkqubo kunye nokuqinisekiswa kwesivuno.

Ngaphambi kokuba ukhethe iqonga, cacisa ukuba ngaba le nkqubo ifuna ukubekwa ubuso bujonge phantsi, ukubekwa ubuso bujonge phezulu, ukuhlanganiswa kweetships ezininzi, ukuphathwa kwephaneli okanye kwe-wafer, iithwali ezikhethekileyo, ukuhlolwa okuphambili okanye izixhobo ezithile ezisetyenziswayo.

Musa ukucinga ukuba umatshini obhengezwe njengopakisho oluphambili ulungele ngokuzenzekelayo inkqubo ethile yokukhupha ifeni. Iseti yemodyuli efakiweyo, izixhobo kunye nokuhamba kwenkqubo kufuneka kuqinisekiswe ngokweemfuno zemveliso.

Ukuphinda Ubuyele KwiMass vs Multi-Chip vs Fan-Out: Isakhelo Sokuthelekisa Izixhobo

Indawo yoKhetho	I-Mass Reflow Flip Chip	Itshiphu yokujika iitshiphu ezininzi	Ukupakishwa kweFan-Out/Wafer-Level
Ingqwalasela ephambili	Isantya semveliso, ukuhamba kwezinto eziphindaphindwayo kunye nolawulo lwenkqubo.	Ulandelelwano lwenkqubo oluguquguqukayo, iintlobo ezininzi zeedayi kunye nezixhobo ezithile zesicelo.	Icebo lokulungelelanisa, uzinzo lomthwali, ukuhamba kokupakisha kunye nolawulo lwemveliso.
Uhlolo loLawulo	I-wafer, i-substrate, i-strip okanye i-carrier flow ukuze isebenze ngokuphindaphindiweyo ngomthamo ophezulu.	Imithombo emininzi yedayi, utshintsho lwezixhobo, utshintsho lomthwali kunye nokuphathwa kwezinto ezixutyiweyo.	Indlela yokuphatha, iphaneli, i-wafer, i-substrate elungisiweyo okanye indlela yokuphatha ethile kwiphakheji.
Uhlolo lweZixhobo	Izixhobo zokujika, ii-nozzles, izixhobo zokulungisa izinto kunye nezixhobo zokuvelisa.	Izixhobo ezininzi zokuthathwa, ii-nozzles ezilungiselelwe ngokukodwa, izixhobo ezenziwe ngokwezifiso kunye nezixhobo ezinxulumene nolandelelwano.	Izixhobo ezihambelana nesicelo, izixhobo zokuthwala, iireferensi zokulungelelanisa kunye nezixhobo ezinxulumene nokuhlolwa.
Uhlolo loMbono	Ukuqatshelwa kokufa kunye ne-substrate, ukuqinisekiswa kokubekwa kunye nokuphindaphinda kwemveliso.	Iimeko ezininzi zokulungelelanisa iidayi, izixhobo ezingasebenziyo kunye nengqiqo yomfanekiso ethile yolandelelwano.	Ukuqatshelwa kwesalathiso, ukulungelelaniswa komthwali okanye kwephaneli, ukuhlolwa kwenkqubo kunye nokuqinisekiswa kokuphindaphinda.
Umngcipheko Ophambili	Ukuba i-UPH ephezulu ithetha ukuba i-hardware yenkqubo efunekayo ifakiwe.	Ukuba i-hardware eneentloko ezininzi ixhasa ngokuzenzekelayo ulandelelwano olucwangcisiweyo lokufa.	Ukucinga ukuba iqonga eliphambili liquka indlela echanekileyo yokuthwala, izixhobo kunye nendlela yokuhlola efunekayo.

I-Flip Chip Bonder vs Flip Chip Mounter: Ngaba kukho umahluko?

Kwiingxoxo ezininzi zezixhobo ze-semiconductor, imiqathangoibhondi ye-flip chipkwayeisixhobo sokufaka iitshiphusi ezijijekileyoZombini zisetyenziswa ngokutshintshana. Zombini ngokubanzi zibhekisa kwizixhobo ezilawula i-die pickup, i-flipping, i-alignment kunye nendawo yokuhlanganisa i-flip chip.

Nangona kunjalo, ububanzi bomatshini bunokwahluka kakhulu. Ezinye iindlela zokumisela zigxila kakhulu ekubekweni kwesantya esiphezulu, ngelixa ezinye ziquka ukulungiswa kwezinto ezininzi, ukusasazwa, ukuguquguquka, ukuhlolwa, ukuphathwa kunye nokukwazi inkqubo yamanyathelo amaninzi.

Xa kujongwa izixhobo, kungcono ukubuza ukuba umatshini wenza ntoni ngokoqobo ngexesha lokwenziwa kwemveliso kunokugxila kuphela ekubeni umthengisi uwubiza ngokuba yi-bonder okanye yi-mounter.

Iindawo ezisibhozo zoQwalaselo ezinokutshintsha amandla e-Flip Chip Bonder

1. Indlela yoMthombo kunye neNdlela yoKubonisa

Qinisekisa ukuba umatshini ufumana idayi evela kwi-wafer, kwitreyi, kwi-waffle pack, kwi-Gel-Pak®, kwi-carrier, kwi-feeder okanye komnye umthombo. Indlela yokubonisa idayi ingamisela ukuba zeziphi izixhobo zokuthatha, iinkqubo zokukhupha kunye neemodyuli zezinto ezifunekayo.

2. Indlela yokujika kunye neZixhobo

Umatshini onikezelwayo kufuneka uhlolwe indlela efunekayo yokujika, izixhobo zokuthatha, ii-nozzles, izixhobo zokukhupha, izixhobo zokubamba izixhobo kunye neereferensi zokulinganisa. Igama losapho leqonga aliqinisekisi ukuba zonke izixhobo zokujika ezifunekayo zifakiwe.

3. Inkqubo yoLungiselelo lwezinto

Ezinye iindlela ze-flip chip zifuna ukujijwa, ukuditywa, ukuncamathisela, ukudluliselwa kwezinto, ukufudumeza okanye elinye inyathelo lokulungiselela inkqubo. Qinisekisa ukuba zeziphi iimodyuli ezifakiweyo kunye nokuba ziyahambelana na nezinto ezicetywayo kunye nendlela yephakheji.

4. Ukuphathwa kweWafer, iCarrier kunye neSubstrate

Hlola ulandelelwano olupheleleyo lokuphatha ukusuka kumthombo wedayi ukuya kwindawo yesiseko okanye indawo yokuthwala. Isakhelo se-wafer esifunekayo, umcu, isikhephe, i-carrier, i-substrate, iphaneli okanye ifomathi yesixhobo kufuneka ihambelane nehardware yomatshini yokwenyani.

5. Icebo loMbono kunye noLungelelaniso

Jonga ubume bekhamera, i-optics, ukukhanya, imisebenzi yokulungelelanisa, imeko yokulinganisa, indawo yokujonga kunye nendlela yokuqaphela ireferensi. Idayi kunye ne-substrate yokwenyani kufuneka ziqwalaselwe ngeli xesha lophononongo.

6. Ukuhlolwa kweNkqubo kunye noLawulo lweNzuzo

Qinisekisa ukuba ulungiselelo olunikiweyo luquka na imisebenzi efanelekileyo yokulawula inkqubo, yokuhlola okanye yokuqinisekisa emva kokubekwa. Musa ukucinga ukuba ikhamera ebonakalayo okanye imonitha ingqina ukuba indlela yokuhlola efunekayo iyasebenza kwaye iyasebenza.

7. Utshintsho lweZixhobo kunye noTshintsho lweMveliso

Kwiindawo ezininzi zemveliso, jonga utshintsho lwezixhobo, ukucima i-nozzle, ukutshintshwa kwezinto ezisetyenzisiweyo, utshintsho lweresiphi, ixesha lokuseta isixhobo kunye neenkqubo zokubuyisela. Ezi zinto zinokuchaphazela ukusebenza kakuhle kwemveliso kunye nesantya somatshini esiqhelekileyo.

8. Isoftware, uMlawuli kunye nokuBuyiselwa kweDatha

Izixhobo ezisetyenzisiweyo mazihlolwe ukuze kujongwe ukwenziwa kolawulo, imeko yekhompyutha yemizi-mveliso, inguqulelo yesoftware, iinketho ezivunyiweyo, iifayile zogcino, imidiya yokubuyisela, idatha yenkqubo kunye namaxwebhu obuchwephesha.

Close-up review of flip chip bond head tooling, optics and alignment modules in semiconductor assembly equipment

Yintoni Omele Uyibuze Ngaphambi Kokuthelekisa Iingcaphuno zeBESI Flip Chip Bonder

Ngaphambi kokuba uthelekise ixabiso, cela umthengisi ngamnye ukuba anike inqanaba elifanayo leenkcukacha zoqwalaselo. Oku kwenza kube lula ukuchonga ukuba ngaba iikowuteshini ezimbini zichaza iinkqubo ezifanayo okanye amagama eqonga afanayo kuphela.

Uyilo oluchanekileyo lwemodeli kunye nenombolo ye-serial
Ukuveliswa koomatshini kunye nokuveliswa komlawuli
Iintloko zebhondi ezifakiweyo kunye nezixhobo zokujika
Iimodyuli zokuphatha i-wafer, itreyi, umthwali, umcu kunye ne-substrate
Iimodyuli zokulungiselela izinto ezifana nokufudumeza, ukudipha okanye ukusasaza apho kufanelekileyo
Umbono, ikhamera kunye noqwalaselo lokukhanya
Imilomo equkiweyo, izixhobo zokukhupha, izixhobo ezifakelweyo, iipleyiti kunye neereferensi zokulinganisa
Inguqulelo yesoftware, imeko yokhetho, ii-backups kunye nolwazi lokubuyisela kwimeko yesiqhelo
Ububanzi bokuhlaziya, imeko yomatshini kunye nobungqina bovavanyo olusebenzayo
Isindululo se-FAT, ukufumaneka kovavanyo lwezinto kunye neendlela zokukhupha ukuthunyelwa

Iimpazamo Ezintandathu Eziqhelekileyo Xa Ukhetha I-Flip Chip Bonder Esetyenzisiweyo

Impazamo 1: Ukukhetha Ngegama Leqonga Lodwa

Umatshini we-DATACON okanye we-Esec unokuba yindlela eluncedo yeqonga, kodwa uqwalaselo oluchanekileyo lugqiba ukuba iyayixhasa na inkqubo ekujoliswe kuyo. Soloko uthelekisa izixhobo ezifakiweyo kunye nezixhobo ezifakiweyo.

Impazamo yesi-2: Ukucinga ukuba i-High Throughput isombulula i-Process Fit

Amandla okukhupha aphezulu aluncedo kuphela xa umatshini unendlela yokuphatha idayisi efunekayo, ukulungiswa kwezinto, izixhobo, umbono kunye neemodyuli zesiseko sesixhobo esisetyenzisiweyo.

Impazamo 3: Ukungayinaki iMisebenzi yeZixhobo kunye neZixhobo

Ii-nozzles ezingekhoyo, izixhobo zokujika, izixhobo zokuthwala, iipleyiti ze-substrate okanye iireferensi zokulinganisa zinokulibazisa ukufaneleka nokuba iqonga eliphambili lisebenza ngoomatshini.

Impazamo 4: Ukuphatha iikhamera njengobungqina bobuchule bokulungelelanisa

Ukusebenza kombono kuxhomekeke kwi-optics, i-inlighting, isoftware yokulungelelanisa, i-calibration kunye neempawu ze-die okanye ze-substrate. Ukufakela ikhamera kuphela akwanelanga.

Impazamo 5: Ukwamkela ividiyo engenanto eshukumayo njengovavanyo lokwamkelwa kwefektri

Ividiyo yokuhamba komatshini ongafakwanga imithwalo ayiqinisekisi ukuphathwa kwezinto, ukulandwa, ukujika, ukulungelelaniswa, ukubekwa, ukuhlolwa okanye ukubuyiselwa kweempazamo.

Impazamo 6: Ukushiya iSoftware kunye neNkxaso Kude kube semva kokuhanjiswa

Ukufikelela kubalawuli, iikopi, iifayile zokhetho, idatha yenkqubo, imidiya yokubuyisela kunye noxanduva lwenkxaso kufuneka ziqinisekiswe ngaphambi kokuthunyelwa, kungekhona emva kokufakwa.

Yintoni enokunceda iFlip Chip Bonder FAT?

Uvavanyo lokwamkelwa kwefektri kufuneka luchazwe malunga noqwalaselo lokwenyani lomatshini kunye nokuhamba kwenkqubo okulindelekileyo. Akufuneki ukuba kuthathe indawo yesiqinisekiso esipheleleyo semveliso, kodwa kufuneka kubonise ukuba iinkqubo eziphambili zomatshini ziyachongwa, ziyasebenza kwaye zilungele inqanaba elilandelayo elivunyelwene ngalo.

Indawo ye-FAT	Oko Kufanele Kuboniswe
Ubume bomatshini	Imodeli, ulwazi olulandelelanayo, iimodyuli ezifakiweyo kunye nezixhobo ezifakiweyo zihambelana nesicatshulwa.
Ukhuseleko kunye nokuQalisa	Ukuvula umbane, ukumisa ngexesha likaxakeka, iingcango zokhuseleko, ii-alamu, ii-interlocks kunye nokuqaliswa kwenkqubo ziyasebenza.
Intloko yeNtshukumo kunye neBond	Ukuya ekhaya, intshukumo ye-axis, intshukumo yentloko, ukufakwa kwezixhobo kunye nokuziphatha okusisiseko kokubuyisela kwimeko yesiqhelo kuyaboniswa.
Umbono kunye noLungelelaniso	Umgangatho womfanekiso wekhamera, ukukhanya, ukuqondwa kwereferensi kunye nemisebenzi yokulungelelanisa iyaboniswa.
Iimodyuli zokuphatha	Iimodyuli ze-wafer, itreyi, i-carrier, i-substrate, i-strip okanye i-fixture ezifakiweyo zivavanywa phantsi kolandelelwano oluchaziweyo.
Izixhobo kunye nolandelelwano lweenkqubo	Izixhobo zokujika ezikhoyo, ii-nozzles, izixhobo kunye neemodyuli zenkqubo zijongwa ngokuhambelana nomlinganiselo ovunyiweyo.
Isoftware kunye nokudluliselwa	Ukufikelela kumlawuli, imeko yesoftware, iikopi, iifayile zokhetho, amaxwebhu kunye noluhlu lokugqibela loqwalaselo ziyaqinisekiswa.

Ixesha lokuphonononga i-BESI Flip Chip Platform eyahlukileyo

I-BESI flip chip bonder ethile kufuneka ikhethwe kuphela xa uqwalaselo lwayo olufakelweyo luhambelana nendlela yenkqubo efunekayo. Icala elahlukileyo leqonga linokufaneleka ngakumbi xa iprojekthi ifuna imveliso ephezulu yokuphinda iphumeze ubuninzi, ulandelelwano olwahlukileyo lwenkqubo ye-multi-chip, ukuphathwa kwe-fan-out okukhethekileyo, iimfuno zonxibelelwano oluphambili okanye inqanaba elahlukileyo lokuguquguquka kwenkqubo.

Injongo ayikokunyanzela zonke izicelo zibe yintsapho enye yeqonga le-DATACON okanye le-Esec. Injongo kukuchonga uqwalaselo olunendlela ecacileyo yokufumaneka kwezixhobo, ukuqinisekiswa kwenkqubo, ukufakwa kunye nemveliso ephindaphindwayo.

Ingcebiso yokugqibela: Thelekisa uthotho lwenkqubo ngaphambi kokuba uthelekise ixabiso lomatshini

I-BESI flip chip bonder inokuba lukhetho oluqinileyo lweqonga xa umatshini onikezelwayo une-die source configuration echanekileyo, izixhobo ze-flip, iimodyuli zokulungiselela izinto, indlela yokuphatha, iphakheji yombono, izixhobo, indawo yesoftware kunye nobubanzi benkxaso.

Ngaphambi kokuba uvume ikowuteshini, thelekisa uthotho lwenkqubo olupheleleyo oluvela kwi-die pickup ukuya kwindawo kunye nokuhlolwa. Le ndlela inceda ukuthintela impazamo eqhelekileyo ekuthengeni izixhobo ze-semiconductor ezisetyenzisiweyo: ukuthenga usapho olufanelekileyo lweqonga olunolungiselelo olungafanelekanga olufakelweyo.

Related BESI Flip Chip Resources

Imibuzo Ebuzwa Rhoqo Malunga neeBESI Flip Chip Bonders

Yintoni i-BESI flip chip bonder?

I-BESI flip chip bonder sisixhobo sokudibanisa se-semiconductor esisetyenziselwa ukukhetha, ukujika, ukulungelelanisa kunye nokubeka i-die kwimisebenzi yokupakisha ye-flip chip. Amandla enkqubo achanekileyo axhomekeke kusapho lweqonga kunye noqwalaselo olufakiweyo, kubandakanya iimodyuli zokuphatha, izixhobo, umbono kunye nehardware yenkqubo.

Yintoni umahluko phakathi kwe-flip chip bonder kunye ne-flip chip mounter?

La magama adla ngokusetyenziswa ngokutshintshana. Kuvavanyo lwezixhobo ezisebenzayo, umba obalulekileyo ngumsebenzi wokwenyani wokuvelisa umatshini, kubandakanya i-die pickup, ukusebenza kwe-flip, ukulungiswa kwezinto, ukulungelelaniswa, ukubekwa, ukuhlolwa kunye nolandelelwano lokuphathwa.

Yeyiphi i-BESI flip chip bonder efanelekileyo kwimveliso yokuphinda ibuyele kwi-mass?

Iiprojekthi ze-flip chips eziphinda zisetyenziswe kufuneka zivavanywe ngokuthelekisa amaqonga kunye noqwalaselo oluyilelwe isantya semveliso esifunekayo, ukuhamba kwezinto, ukuphathwa kwedayi, indlela yesiseko, inkqubo yombono kunye neemfuno zolawulo lwenkqubo. Uqwalaselo oluchanekileyo lomatshini kufuneka luqinisekiswe ngaphambi kokukhethwa.

Ngaba i-DATACON 2200 evo ingasetyenziselwa usetyenziso lwe-flip chip?

Ezinye iindlela zokucwangcisa i-DATACON 2200 evo zinokuvavanywa kwiindlela ezikhethiweyo zokusebenza kwe-flip chip. Abathengi kufuneka baqinisekise izixhobo ze-flip, iimodyuli zokuphatha, ukulungelelaniswa kombono, ukulungiswa kwezinto, izixhobo kunye nokukwazi kwenkqubo ethile yesicelo.

Yintoni ekufuneka ihlolwe ngaphambi kokuba uthenge i-flip chip bonder esetyenzisiweyo?

Qinisekisa uhlobo oluchanekileyo lomatshini, iintloko zebhondi, izixhobo zokujika, ii-nozzles, iimodyuli zokuphatha i-wafer kunye ne-substrate, inkqubo yombono, iimodyuli zenkqubo, umlawuli, ii-backups zesoftware, uluhlu lwezinto zokusebenzisa izixhobo, umda wokuhlaziya kunye nesindululo se-FAT.

Kutheni izixhobo zibalulekile ekubopheleleni i-flip chip?

Izixhobo zokulungisa zinokumisela ukuba umatshini uyakwazi na ukusingatha i-target die, i-substrate kunye nendlela yephakheji. Ii-nozzles ezingekhoyo, izixhobo zokujika, izixhobo zokukhupha, iipleyiti zokuthwala, izixhobo zokulungisa okanye iireferensi zokulinganisa zinokulibazisa ukufaneleka kwaye zonyuse iindleko zeprojekthi.

Yintoni ekufuneka iquke i-flip chip bonder FAT?

I-FAT eluncedo ingabandakanya ukuqinisekiswa kobuwena bomatshini, ukuhlolwa kokhuseleko, ukusebenza kwentloko yentshukumo kunye ne-bond, ukulungelelaniswa kombono, uvavanyo lwe-handling-module, ukuqinisekiswa kwezixhobo, uphononongo lwe-software backup kunye nolandelelwano lwenkqubo emeleyo xa kukho izixhobo ezifanelekileyo.

Ndingazithelekisa njani iikowuteshini ezimbini ze-BESI flip chip bonder?

Thelekisa uqwalaselo olupheleleyo olufakelweyo endaweni yegama leqonga okanye ixabiso lokuthenga. Hlola indlela yenkqubo, iintloko zebhondi, izixhobo zokujika, iimodyuli zezinto, i-hardware yokuphatha, iphakheji yombono, isitokhwe sezixhobo, umlawuli, isoftware, ububanzi bokuhlaziya kunye nobungqina be-FAT.

Ngaba ufuna uncedo lokujonga uqwalaselo lwe-BESI Flip Chip Bonder?

Yabelana ngeefoto zomatshini ezikhoyo, ulwazi olulandelelanayo, umzobo wephakheji, ubungakanani bedayi, ifomathi yesiseko, indlela yezinto ezibonakalayo, imveliso ekujoliswe kuyo, iinkcukacha zezixhobo kunye nokuhamba kwenkqubo elindelekileyo. Uhlolo oluluncedo luqala ngendlela yokwenyani yephakheji kunye noqwalaselo olubonakalayo lomatshini onikezelwayo.

Isikhokelo sokukhetha iBESI Flip Chip Bonder | Ukuphinda kusebenze kweMass Reflow, iMulti-Chip kunye neFan-Out