Are all BESI DATACON 2200 evo machines the same?

No. Machines within the DATACON 2200 evo family can differ in version, bond head configuration, force capability, vision package, material handling, tooling, controller generation, software options and process modules.

What is the difference between DATACON 2200 evo and evo plus?

Both belong to the DATACON 2200 evo Multi Module Attach family, but evo plus is associated with further development in areas such as camera technology, thermal compensation, accuracy stability and image-processing capability. The exact offered machine configuration still needs to be confirmed.

What is DATACON 2200 evo hF used for?

DATACON 2200 evo hF is positioned for multi-chip die bonding applications that require a higher-force configuration. Buyers should confirm the installed high-force hardware, tooling, material process route and application-specific modules before purchase.

What is DATACON 2200 evo advanced?

DATACON 2200 evo advanced is a higher-accuracy direction within the Multi Module Attach platform family. It is associated with updated gantry, controller and vision architecture, but the actual capability of a used machine depends on its installed configuration and condition.

Can a DATACON 2200 evo machine be used for flip chip applications?

Some DATACON 2200 evo configurations can be evaluated for selected flip chip workflows. The offered machine should be checked for the required flip tools, handling modules, vision alignment, material route, inspection functions and package-specific tooling.

How do I compare two DATACON 2200 evo quotations?

Compare the full machine configuration rather than the platform name or purchase price. Review version, bond heads, material modules, handling hardware, tooling, vision, controller, software, refurbishment scope, FAT plan and installation support.

Should original tooling be included with a used DATACON 2200 evo?

Original tooling can be valuable, but it may not match a new product or package route. Request a complete tooling inventory and verify compatibility with the intended die, substrate, material and process sequence.

What should a DATACON 2200 evo Factory Acceptance Test include?

A useful FAT can include machine initialization, safety checks, axis movement, bond head operation, vision verification, handling-module checks, tooling review, controller and software confirmation, plus a representative placement or handling test when suitable materials are available.

Isikhokelo soCwangciso lwe-BESI DATACON 2200 evo | Kutheni iiMatshini zahlukile

Oomatshini ababini be-BESI DATACON 2200 evo banokuba negama elifanayo leqonga ngelixa benamandla ahlukeneyo kakhulu.Omnye umatshini unokwenziwa ukuze uxhome ii-chip ezininzi kunye nokuhambisa okuhlanganisiweyo kunye nokuphatha ii-wafer. Omnye ungabandakanya intloko yebhondi eyahlukileyo, ukuseta inkqubo enamandla aphezulu, izixhobo ezikhethekileyo, iimodyuli zezinto ezizezinye, umbono ophuculweyo okanye indlela yokuphatha eyahlukileyo ngokupheleleyo.

Yingakho isicatshulwa somatshini esithi “BESI DATACON 2200 evo” singanelanga kwisigqibo sobunjineli okanye sokuthenga. Nokuba abathengi bayayifuna naI-DATACON EVO 2200 IRON, I-DATACON 2200 evo, I-DATACON 2200 IRON, okanye jikeleleUmatshini weDATACON, umbuzo wokwenyani uyafana: yintoni efakwe kumatshini onikiweyo, kwaye ngaba olo qwalaselo lungayixhasa indlela yephakheji ekujoliswe kuyo?

Esi sikhokelo sichaza ukuba kutheni iinkqubo ezimbini ze-DATACON 2200 evo zinokuhluka kakhulu, yintoni ekufuneka ithelekiswe ngaphambi kokuba ucele ikowuteshini, kunye nendlela yokuphepha ukuvuma umatshini ngokusekelwe kwigama leqonga kuphela.

Engineering review of a BESI DATACON 2200 evo multi-module die bonding machine

Ngamafutshane: Kutheni iiMishini ezimbini ze-DATACON 2200 evo zingahluka kangaka?

I-BESI DATACON 2200 evo yiplatifomu ye-Multi Module Attach enokulungiselelwa endaweni yeenkcukacha zomatshini omnye ozinzileyo. Amandla okwenyani anokutshintsha ngokuxhomekeke kwinguqulelo yomatshini, iintloko zebhondi ezifakiweyo, uluhlu lwamandla, imisebenzi yobushushu, iphakheji yombono, ukuphathwa kwe-wafer okanye itreyi, iimodyuli zenkqubo, izixhobo, ukuvelisa umlawuli, ukhetho lwesoftware kunye nemeko yokuhlaziya.

Iqonga elifanayo le-DATACON 2200 evo linokubonelelwa ngezixhobo zenkqubo ezahlukeneyo.
Igama lemodeli ecatshulweyo lisenokungachazi intloko yebhondi efakiweyo, izixhobo okanye ukuseta kokuphatha izinto.
Umbono, ikhamera, umlawuli kunye nesoftware zinokuchaphazela oko umatshini unokukuxhasa ngokwenene.
Inkqubo esetyenzisiweyo ingafuna izixhobo ezongezelelweyo, izixhobo, ukubuyiswa kwesoftware okanye ubunjineli benkqubo ngaphambi kokuba iqinisekiswe.

Kutheni i-DATACON 2200 evo Nameplate ingeyona iNkcazelo epheleleyo

Ekuthengweni kwezixhobo ze-semiconductor, igama leqonga lulwandlalelo lokuqala lolwazi. Lichaza usapho lwemveliso, kodwa alichazi amandla apheleleyo enkqubo yomatshini othile.

Umzekelo, isicatshulwa se-DATACON 2200 evo sinokubandakanya uqwalaselo oluqhelekileyo lwe-multi-chip die attach, ngelixa esinye isicatshulwa sinokubandakanya iimodyuli zenkqubo ezongezelelweyo, iintloko zebhondi ezahlukeneyo, ii-optics eziphuculweyo, ukuphathwa kwe-wafer enye, izixhobo ezikhethekileyo okanye ukuseta okunamandla aphezulu. Zombini ezi zibonelelo zinokuchazwa njenge-DATACON 2200 evo, kodwa akufuneki zithelekiswe njengoomatshini abafanayo.

Umthetho wobunjineli:Thelekisa uqwalaselo olufakiweyo, kungekuphela nje igama leqonga.

Uphononongo lwesicatshulwa oluluncedo kakhulu luqala ngendlela yenkqubo ecetywayo. Nje ukuba idayi, isiseko, izinto, ukuhamba kokuphatha kunye nemveliso ekujoliswe kuyo ichaziwe, umthengi unokuqinisekisa ukuba umatshini we-DATACON 2200 evo onikezelwayo unolungelelwaniso olufanelekileyo lomzimba kunye nesoftware.

Imibuzo emihlanu ye-DATACON 2200 evo omele uyibuze ngaphambi kokuba uthelekise iikowuteshini

1. Ngowuphi uguqulelo lwe-DATACON 2200 evo oluchanekileyo olunikezelwayo?

Usapho lwe-DATACON 2200 evo luquka imiyalelo emininzi yenguqulelo. Isicatshulwa kufuneka sichaze ngokucacileyo ukuba umatshini onikezelwayo yi-DATACON 2200 evo, evo plus, hF, hS, advanced, okanye olunye ulungiselelo oluchaziweyo.

Ileyibhile yenguqulelo ibalulekile kuba ingabonisa ugxininiso olwahlukileyo kuyilo. Ezinye iinguqulelo zinxulunyaniswa ne-Multi Module Attach eguquguqukayo, ezinye zinamandla aphezulu enkqubo, umbono ophuculweyo kunye nokuziphatha kobushushu, ukusebenza okuphuculweyo kwegumbi lokucoca, okanye ukuchaneka okuphezulu kokubekwa.

Cela umqondiso opheleleyo wemodeli, inombolo yeserial, ifoto yepleyiti yegama lomatshini kunye noluhlu olubhaliweyo loqwalaselo ngaphambi kokuba wenze uthelekiso.

2. Zeziphi iiBond Head kunye neProcess Hardware ezifakiweyo?

Ulungiselelo lwentloko yebhondi lunokutshintsha lonke imeko yokusetyenziswa komatshini we-DATACON. Inkqubo inokufuna uluhlu oluthile lwamandla, amandla okufudumeza, umsebenzi wokujikeleza, ujongano lwesixhobo, indlela yokuthathwa, indlela yokukhupha okanye ulandelelwano lokubekwa.

Musa ukucinga ukuba igama elifanelekileyo leqonga lithetha ukuba intloko yebhondi ifakiwe. Cela umthengisi ukuba achonge iintloko zebhondi ezibonakalayo, izibambi zezixhobo, ii-nozzles, izixhobo zokukhupha, izixhobo zobushushu kunye nazo naziphi na iimodyuli zenkqubo ezinxulumene noko ezifakwe kumatshini.

Inani leentloko zokusebenza ezifakiweyo
Uhlobo lwentloko yebhondi kunye nendima yenkqubo
Isibambi sesixhobo kunye nojongano lwe-nozzle
Uqwalaselo olunxulumene namandla apho kufanelekileyo
Imisebenzi yokufudumeza, yokujikeleza okanye yenkqubo ekhethekileyo
Izixhobo zokuthatha, ukubeka kunye nokukhupha ezibandakanyiweyo

3. Luluphi ulungiselelo lokuphathwa kwezinto oluqukiweyo?

I-die bonder iluncedo kuphela xa inokuhambisa izinto ezifunekayo kulandelelwano olupheleleyo lwenkqubo. Umatshini unokufuna ukuphatha ii-wafers, iifreyimu ze-wafer, iitreyi, i-Gel-Pak®, ii-carriers, ii-substrates, ii-strips, ii-leadframes, ii-boats okanye izixhobo ezenziwe ngokwezifiso.

Oomatshini ababini be-DATACON 2200 evo banokwahluka kakhulu kule ndawo. Omnye unokuxhotyiswa kwifomathi ethile ye-wafer kunye nolandelelwano lwetreyi, ngelixa omnye angasebenzisa inkqubo eyahlukileyo yokuthwala okanye angasebenzisi imodyuli yokuphatha izinto efunekayo kwaphela.

Ngaphambi kokuba uthenge, dwelisa ukuhamba kwezinto ukusuka ekulayisheni ukuya ekuthathweni, ekubekweni, ekuhlolweni, ekubuyiselweni nasekukhutshweni kwezinto. Emva koko thelekisa indlela efunekayo ngokuthelekisa neemodyuli ezifakwe ngokwasemzimbeni kumatshini obonelelwayo.

4. Yeyiphi iphakheji yeVision and Alignment efakiweyo?

Iinkqubo zekhamera zezinye iindlela ezinkulu zokwahluka phakathi koomatshini ababini abanegama elifanayo leqonga. Amandla okubona axhomekeke kwi-optics efakiweyo, ukukhanya, ukuveliswa kwekhamera, indawo yokujonga, ingqwalasela, isoftware yokulungelelanisa, imeko yokulinganisa kunye neempawu zomzimba ze-die kunye ne-substrate.

Ikhamera ebonakala kwifoto yomatshini ayibonisi ukuba umatshini unako ukuxhasa umsebenzi wokulungelelanisa ofunekayo. Ubungakanani bokwenyani bedayi, iimpawu zesalathiso se-substrate, ukunyamezelana kwenkqubo, ulandelelwano lokubekwa kunye nendlela yokuhlola kufuneka kuqwalaselwe.

Cela ulwazi malunga:

Ikhamera efakiweyo kunye nenkqubo ye-optical
Uqwalaselo lokukhanyisa
Indlela yesalathiso sokulungelelanisa
Izixhobo zokulinganisa ezikhoyo okanye iirekhodi zokulinganisa
Ubungqina bomgangatho womfanekiso kunye nobungqina bokuphindaphindeka
Ukusebenza kombono ngezixhobo ezimele apho kunokwenzeka khona

5. Zeziphi iiSoftware, iiController kunye neeProcess Data ezikhoyo?

Isimo somlawuli kunye nesoftware sinokumisela ukuba umatshini we-DATACON osetyenzisiweyo ukulungele ukufakwa okanye uba yiprojekthi ende yokubuyisela. Inkqubo isenokusebenza ngokuqhelekileyo kodwa isaswele ii-backups zesoftware ezisebenzisekayo, ukhetho olusebenzayo, iiparameter zomatshini, imidiya yokubuyisela, amaxwebhu okanye inkxaso yomlawuli.

Ngaphambi kokuba uvume ikowuteshini, qinisekisa imeko yePC yoshishino, ukwenziwa komlawuli, amakhadi entshukumo, uqwalaselo lwe-I/O, inguqulelo yesoftware, imeko yokhetho, ii-backups zomatshini, iirekhodi ze-alamu kunye namaxwebhu obuchwephesha akhoyo.

Kwiprojekthi yokutshintsha, ukuhambelana kwesoftware kunokuba yinto ebaluleke kakhulu. Iindlela zokupheka ezikhoyo, amava omqhubi, idatha yenkqubo kunye nezixhobo zangoku azinakudlulela ngqo kwindawo eyahlukileyo yokuvelisa umatshini okanye yokulawula.

Usapho lwe-DATACON 2200 evo: Kutheni iilebheli zenguqulelo zibalulekile

Usapho lwe-DATACON 2200 evo alukho lungiselelo lulodwa oluzinzileyo. Itheyibhile engezantsi inika indlela esebenzayo yokuqonda iilebheli zenguqulelo ngaphambi kokuthelekisa iikowuteshini zezixhobo ezisetyenzisiweyo.

Isikhokelo seQonga	Ingqwalasela yoVavanyo oluBanzi	Yintoni Omele Uyiqinisekise Kwikowuteshini
I-DATACON 2200 evo	I-Flexible Multi Module Attach, i-multi-chip die attach kunye nokukwazi ukusebenza kwe-flip chip ekhethiweyo.	Iintloko zokusebenza ezifakiweyo, iimodyuli zokuhambisa okanye zezinto eziphathekayo, ukuphathwa kwe-wafer, amandla okutshintsha izixhobo ngokuzenzekelayo, iphakheji yokubona kunye nezixhobo ezibandakanyiweyo.
I-DATACON 2200 evo plus	Isikhokelo seqonga esinxulumene nokuchaneka okuphuculweyo, uzinzo lwexesha elide, uphuhliso lwekhamera kunye neempawu zokuhlawula ubushushu.	Ukwenziwa kwekhamera, iphakheji yombono, uqwalaselo lokucubungula imifanekiso, imeko yokuhlawula ubushushu, iimodyuli zokuphatha kunye nokufumaneka kwesoftware.
I-DATACON 2200 evo hF	Ii-applications ze-die bonding ezine-high-force multi-chip kunye neendlela zenkqubo ezifuna uqwalaselo olujolise ngakumbi kumandla.	Kufakwe intloko yebhondi enamandla aphezulu, izixhobo zenkqubo ezinxulumene namandla, iimfuno zokufudumeza okanye zobushushu, indlela yezinto eziphathekayo, izixhobo kunye nezixhobo ezithile ezisetyenziswayo.
I-DATACON 2200 evo hS	Iimodyuli ezininzi Ncamathisela icala ugxininise ekuchanekeni, uzinzo, uphuculo olunxulumene nekhamera kunye negumbi lokucoca.	Inkqubo yokubona, imisebenzi yokubuyisela ubushushu, ukuvelisa umlawuli, imeko yokulinganisa, ulungiselelo lwegumbi lokucoca kunye nezixhobo zemveliso.
I-DATACON 2200 evo ephuculweyo	Imodyuli eNkulu echanekileyo kakhulu Ncamathisela indlela nge-gantry ehlaziyiweyo, umlawuli kunye noyilo lweqonga olunxulumene nombono.	Uqwalaselo lwe-gantry kunye nolawulo lokwenyani, ukwenziwa kwekhamera, imfuneko yokubekwa, izixhobo, izixhobo zenkqubo kunye nobungqina obufumanekayo bokufaneleka.

Itheyibhile akufuneki isetyenziswe endaweni yokuqinisekiswa kwinqanaba lomatshini. Inkqubo esetyenzisiweyo isenokuba iphuculwe, yatshintshwa, yakhiwa ngokutsha kancinci, yalungiswa ngokutsha okanye yanikwa iphakheji yezixhobo eyahlukileyo kwisicelo sokuqala.

Iindawo Ezintandathu Zoqwalaselo Ezinokutshintsha Amandla Oomatshini

1. Inani kunye nohlobo lweeNtloko eziSebenzayo

Uqwalaselo lwe-DATACON 2200 evo lungasebenzisa intloko enye okanye ezininzi zokusebenza ngokuxhomekeke kulandelelwano lwemveliso olucetywayo. Inani leentloko libalulekile, kodwa uhlobo kunye nomsebenzi ofakiweyo wentloko nganye ubaluleke ngakumbi.

Buza ukuba umatshini ulungiselelwe na umsebenzi omnye wokubeka ophindaphindwayo, iintlobo ezininzi zeedayi, izixhobo ezahlukeneyo, ukusasaza, amanyathelo akhethekileyo ezinto okanye ulandelelwano oludibeneyo lokuhlanganisa. Umatshini oneentloko ezininzi awufanelekanga ngokuzenzekelayo kuyo yonke indlela eneetshiphusi ezininzi.

2. Indlela yokuncamathisela izinto zeDie

Utshintsho lokufaneleka komatshini ngendlela yokubopha kunye nendlela yokulungiselela. Le nkqubo ingabandakanya i-epoxy, ukustampa, ukusasaza, ukuntywila nge-flux, iindlela ezinxulumene ne-solder, izinto ze-sinter, i-adhesive okanye enye indlela ethile yesicelo.

Imibuzo efanelekileyo ayipheleli nje ekubeni “Ngaba umatshini angabeka idayisi?” kodwa ikwathi “Ngaba angalungisa izinto, agcine iimeko zenkqubo ezifunekayo aze axhase ulandelelwano olucetywayo?”

3. I-Wafer, i-Carrier kunye ne-Substrate Flow

Izixhobo zokuphatha kufuneka zihlolwe ukususela kwindawo yokuqala yokulayisha ukuya ekukhupheleni kokugqibela. Umatshini onikezelwayo unokuba nesixhobo sokuphatha i-wafer, isixhobo sokuphatha itreyi, imodyuli yokuthwala, izixhobo ze-substrate okanye izixhobo ezenziwe ngokwezifiso ezingahambelaniyo nefomathi yemveliso efunekayo.

Cela imifanekiso ecacileyo kunye nokuqinisekiswa okubhaliweyo kwazo zonke iimodyuli zokuphatha ezibandakanyiweyo. Ukungabikho kwezixhobo zokuphatha kunokuba yingxaki enkulu yeendleko kunye neshedyuli emva kokuhanjiswa.

4. Iphakheji yezixhobo kunye nezixhobo

Ii-nozzles, izixhobo zokukhupha, izixhobo zokulungisa, iipleyiti zokuthwala, iireferensi zokulinganisa kunye nezixhobo zenkqubo ezikhethekileyo zinokuba zibaluleke ngakumbi kunekhabhathi yomatshini ngokwayo. Zihlala zixhomekeke kubungakanani bedayi, uyilo lwephakheji, ifomathi yesiseko okanye indlela yenkqubo.

Cela uluhlu lwezinto ezisetyenzisiweyo, kuquka imeko kunye nokuhambelana okwaziwayo. Musa ukuthembela kwingxelo eqhelekileyo yokuba "izinto zokusebenza zibandakanyiwe."

Close-up inspection of bond head, vision modules and tooling on a DATACON 2200 evo die bonder

5. Umbono, Uhlolo kunye noLungiso

Ezinye izinto ezicwangcisiweyo zingabandakanya umbono ophuculweyo, iikhamera ezahlukeneyo, iindlela zokuhlola inkqubo okanye amalungiselelo e-optical acwangcisiweyo kwisicelo. Ezi nkqubo kufuneka zijongwe ngokuchasene ne-die yokwenyani, i-substrate, iimpawu zesalathiso sephakheji kunye nenjongo yokubeka.

Kwizixhobo ezisetyenzisiweyo, ubungqina bokulinganisa bubalulekile. Umatshini unokuba nenkqubo yokubona enobuchule ngokomgaqo, kodwa isiphumo esisebenzayo sixhomekeke kwimeko yeekhamera, i-optics, i-illumination, i-mechanics, isoftware kunye nezixhobo zokulinganisa.

6. Umlawuli, iSoftware kunye neNkxaso yeMeko

Oomatshini ababini abanoyilo olufanayo lomzimba banokwahluka kakhulu ukuba umlawuli wabo, iPC, indawo yesoftware, iifayile zokhetho, ii-backups kunye namaxwebhu obuchwephesha ahlukile. Oku kunokuchaphazela ukufakwa, ukusombulula iingxaki, ukufikelela kwinkonzo kunye nokubuyiselwa kwenkqubo.

Ngaphambi kokuba uthenge, qinisekisa ukuba yintoni eza kuziswa ngomatshini kunye nenkxaso ekhoyo emva kokuthunyelwa.

Iimpazamo zokuthelekisa iiDathacon 2200 evo eziqhelekileyo ezine

Impazamo 1: Ukuthelekisa Ixabiso Lokuthenga Kuphela

Ixabiso eliphantsi linokubonisa iintloko ezingekhoyo, izixhobo ezingekhoyo, iimodyuli zokuphatha ezilinganiselweyo, isoftware engaxhaswayo okanye uvavanyo lokwamkelwa olungasebenziyo. Thelekisa ububanzi beprojekthi iyonke, kungekuphela nje ixabiso eliboniswe kwiphepha lokuqala lesicatshulwa.

Impazamo 2: Ukuphatha "uMatshini opheleleyo" njengeNkcazelo yoBugcisa

Ibinzana elithi “umatshini opheleleyo” libanzi kakhulu. Lifanele lithatyathelwe indawo luluhlu oluneziqendu zeemodyuli zomatshini, iintloko zeebhondi, izixhobo, izixhobo zokulungisa, ii-feeders, isoftware, izixhobo, amaxwebhu kunye nezinto ezingabandakanywanga.

Impazamo 3: Ukucinga ukuba izixhobo zokuqala zihambelana nemveliso entsha

Izixhobo zokuqala zinokuyilwa ngobukhulu obahlukileyo bedayi, ijiyometri yepakeji, indlela yezinto okanye ifomathi yesiseko. Ukuhambelana kwezixhobo kufuneka kuhlolwe ngokuchasene nemveliso yokwenyani eza kuhlanganiswa.

Impazamo 4: Ukwamkela ividiyo eshukumayo engalayishwanga njengobungqina be-FAT

Ividiyo yee-axes ezihambayo ingabonisa umsebenzi osisiseko, kodwa ayibonisi ukuba inkqubo inokwenza ukuphathwa kwezinto, ukulungelelaniswa kombono, ukuthatyathwa, ukubekwa, ukutshintsha izixhobo, ukulandelelana kwenkqubo okanye ukubuyiselwa kweempazamo.

Yintoni Omele Uyicele Ngaphambi Kokuthelekisa Izibonelelo Ezibini ze-DATACON 2200 evo

Ifoto yegama lomatshini kunye nenombolo yochungechunge
Ukuchonga imodeli ngokuchanekileyo kunye nokuveliswa kwemveliso
Uluhlu loqwalaselo lweentloko zokusebenza kunye neemodyuli zenkqubo
Uluhlu lokuphatha i-wafer, itreyi, umthwali, umcu kunye noluhlu lokuphatha i-substrate
Izixhobo zeBond, iiNozzles, izixhobo zokukhupha kunye noluhlu lwezinto ezisetyenziswayo
Umbono, ikhamera kunye noqwalaselo lokukhanya
Umlawuli, iPC, inguqulelo yesoftware kunye nesimo se-backup
Ulwazi ngokugcinwa, ukuhlaziywa kunye nokulungiswa
Iifoto zangoku ezinesisombululo esiphezulu kunye neevidiyo ezisebenzayo
Isindululo sovavanyo lokwamkelwa kwefektri
Ukupakisha, ukuthunyelwa, ukufakwa kunye nobubanzi benkxaso

Uluhlu lokujonga ukuthelekisa iikowuteshini ze-DATACON 2200 evo olusebenzayo

Indawo yokuthelekisa	Isipho A	Isipho B	Umbuzo weSigqibo
Imodeli echanekileyo kunye neNguqulelo	Qinisekisa ubizo olupheleleyo	Qinisekisa ubizo olupheleleyo	Ingaba zombini ezi ngcaphuno zichaza indlela efanayo yeqonga?
Iintloko zeBond	Uluhlu lweentloko ezifakiweyo	Uluhlu lweentloko ezifakiweyo	Ngowuphi umnikelo onentloko yenkqubo kunye nesixhobo esifunekayo?
Iimodyuli zokuphatha	Iimodyuli ezibandakanyiweyo kuluhlu	Iimodyuli ezibandakanyiweyo kuluhlu	Ngowuphi umnikelo onokuxhasa ukuhamba kwezinto ezifunekayo ngokongeza izinto ezimbalwa?
Izixhobo	Uluhlu lwezinto kunye nemeko	Uluhlu lwezinto kunye nemeko	Zeziphi izixhobo ezihambelana nemveliso ekujoliswe kuyo?
Umbono kunye noLungelelaniso	Iinkcukacha zekhamera kunye ne-optics	Iinkcukacha zekhamera kunye ne-optics	Yeyiphi inkqubo enokuxhasa umsebenzi wokulungelelanisa ofunekayo?
Isoftware kunye neBackup	Qinisekisa ububanzi bokuhanjiswa	Qinisekisa ububanzi bokuhanjiswa	Sesiphi isipho esinika indlela ecacileyo yokubuyisela kunye nenkxaso?
Ububanzi bamafutha	Ulandelelwano lovavanyo oluchaziweyo	Ulandelelwano lovavanyo oluchaziweyo	Ngowuphi umthengisi onokubonisa ubungqina obusebenzayo obufanelekileyo?

Ufanele Uhlole Nini Iqonga Elihlukileyo le-BESI?

I-DATACON 2200 evo inokuba yindawo eluncedo yokuqala kwi-Multi Module Attach enokulungiselelwa, i-multi-chip die attach kunye neendlela ezikhethiweyo ze-flip chip. Nangona kunjalo, indlela eyahlukileyo yeqonga inokufaneleka ngakumbi xa inkqubo ifuna indlela yemveliso eyahlukileyo kakhulu, ukuhamba komsebenzi we-flip chip ophindaphindwayo ngobuninzi, indlela ephezulu yokubopha i-die, inkqubo ekhethekileyo yobushushu okanye indlela yokudibanisa ephucukileyo.

Injongo yokuhlolwa koqwalaselo ayikokunyanzelisa yonke iprojekthi ibe yintsapho yeqonga elinye. Kukuchonga ukuba umatshini wokwenyani, indlela yenkqubo, izixhobo kunye nobubanzi benkxaso ziyahambelana na ngaphambi kokuba iprojekthi itshintshele ekuthunyelweni nasekuqinisekisweni.

Ingcebiso yokugqibela: Thelekisa uQwalaselo, hayi iNameplate

Usapho lwe-BESI DATACON 2200 evo lunxulunyaniswa kakhulu ne-flexible Multi Module Attach kunye ne-multi-chip die bonding. Kodwa umatshini othile we-DATACON 2200 evo kufuneka uhlale uvavanywa njengenkqubo epheleleyo ecwangcisiweyo.

Ngaphambi kokuba uvume ikowuteshini, qinisekisa inguqulelo echanekileyo, iintloko zebhondi, iimodyuli zenkqubo yezinto, indlela yokuphatha, iphakheji yombono, isitokhwe sezixhobo, imeko yomlawuli, ii-backups zesoftware, ubungqina bokuhlaziya kunye nobubanzi be-FAT. Le ndlela inceda ukunciphisa umngcipheko wokuthenga iqonga elifanelekileyo elinoqwalaselo olungafanelekanga.

Related BESI DATACON Resources

Imibuzo Ebuzwa Rhoqo Malunga ne-BESI DATACON 2200 evo Configurations

Ngaba zonke iimatshini ze-BESI DATACON 2200 evo ziyafana?

Hayi. Oomatshini abakwintsapho ye-DATACON 2200 evo banokwahluka ngohlobo, uqwalaselo lwentloko yebhondi, amandla okunyanzela, iphakheji yokubona, ukuphathwa kwezinto, izixhobo, ukuvelisa abalawuli, ukhetho lwesoftware kunye neemodyuli zenkqubo.

Yintoni umahluko phakathi kwe-DATACON 2200 evo kunye ne-evo plus?

Zombini ziphantsi kosapho lwe-DATACON 2200 evo Multi Module Attach, kodwa i-evo plus inxulunyaniswa nophuhliso olongezelelekileyo kwiindawo ezifana netekhnoloji yekhamera, imbuyekezo yobushushu, uzinzo lokuchaneka kunye nokukwazi ukucubungula imifanekiso. Uqwalaselo oluchanekileyo lomatshini olunikezelwayo kusafuneka luqinisekiswe.

Isetyenziselwa ntoni i-DATACON 2200 evo hF?

I-DATACON 2200 evo hF ibekwe kwiindawo zokufaka ii-multi-chip die bonding ezifuna uqwalaselo olunamandla aphezulu. Abathengi kufuneka baqinisekise izixhobo ezifakelweyo ezinamandla aphezulu, izixhobo, indlela yenkqubo yezinto kunye neemodyuli ezithile zesicelo ngaphambi kokuba bathenge.

Yintoni i-DATACON 2200 evo ephuculweyo?

I-DATACON 2200 evo advanced yindlela echanekileyo kakhulu kusapho lweqonga leMulti Module Attach. Inxulunyaniswa noyilo lwe-gantry oluhlaziyiweyo, isilawuli kunye noyilo lwembono, kodwa amandla okwenyani omatshini osetyenzisiweyo axhomekeke kuqwalaselo kunye nemeko yawo efakiweyo.

Ngaba umatshini we-DATACON 2200 evo ungasetyenziselwa usetyenziso lwe-flip chip?

Ezinye ii-DATACON 2200 evo configurations zingavavanywa kwiindlela ezikhethiweyo zokusebenza kwe-flip chip. Umatshini onikezelwayo kufuneka uhlolwe izixhobo ezifunekayo ze-flip, iimodyuli zokuphatha, ulungelelwaniso lombono, indlela yezinto ezibonakalayo, imisebenzi yokujonga kunye nezixhobo ezithile zephakheji.

Ndingazithelekisa njani iikowuteshini ezimbini ze-DATACON 2200 evo?

Thelekisa uqwalaselo olupheleleyo lomatshini endaweni yegama leqonga okanye ixabiso lokuthenga. Inguqulelo yohlolo, iintloko zebhondi, iimodyuli zezinto, ihadiwe yokuphatha, izixhobo, umbono, umlawuli, isoftware, umda wokuhlaziya, isicwangciso se-FAT kunye nenkxaso yokufakela.

Ngaba izixhobo zokuqala kufuneka zifakwe kwi-DATACON 2200 evo esetyenzisiweyo?

Izixhobo zokuqala zingaba luncedo, kodwa zisenokungahambelani nendlela entsha yemveliso okanye yephakheji. Cela uluhlu olupheleleyo lwezixhobo kwaye uqinisekise ukuhambelana nolandelelwano lwedayi, isiseko, izinto kunye nenkqubo ekujongwe ukuba yenziwe.

Yintoni ekufuneka iqukwe luvavanyo lwe-DATACON 2200 evo Factory Acceptance Test?

I-FAT eluncedo ingabandakanya ukuqaliswa komatshini, ukuhlolwa kokhuseleko, intshukumo ye-axis, ukusebenza kwentloko yebhondi, ukuqinisekiswa kombono, ukuhlolwa kwemodyuli yokuphatha, uphononongo lwezixhobo, ukuqinisekiswa komlawuli kunye nesoftware, kunye novavanyo lokubeka okanye lokuphatha olumeleyo xa kukho izixhobo ezifanelekileyo.

Ngaba ufuna uncedo xa uthelekisa ii-DATACON 2200 evo Configurations?

Yabelana ngeefoto zomatshini, inombolo ye-serial, uluhlu loqwalaselo olufumanekayo, umzobo wephakheji, ifomathi yedayi kunye ne-substrate, indlela yezinto ezibonakalayo, imveliso ekujoliswe kuyo kunye neenkcukacha zezixhobo zangoku. Uthelekiso oluluncedo luqala ngemfuneko yokwenyani yenkqubo kunye noqwalaselo olubonakalayo lomatshini ngamnye onikezelwayo.