Amawulire ga Semiconductor - Omuko2

Geraageranya emikutu gya BESI DATACON 8800 FC QUANTUM ne CHAMEO okusobola okuddamu okukulukuta mu bungi, okugifulumya empewo n’okupakinga eby’omulembe. Weekenneenye enkola y’okutambula, ebikozesebwa n’okukebera RFQ.

Geraageranya BESI DATACON 2200 evo plus vs evo ku pulojekiti za die attach ne multi-chip. Weekenneenye kkamera, okuliyirira ebbugumu, ebikozesebwa, okukwata n’okukebera ebyuma ebikozesebwa.

Yiga engeri y’okulondamu BESI flip chip bonder for mass reflow, multi-chip ne fan-out packaging ng’ogeraageranya enkola y’okutambula, ebikozesebwa, okulaba n’okukwata ebyetaago.

Lwaki ebyuma bibiri ebya BESI DATACON 2200 evo bisobola okwawukana? Geraageranya enkyusa, emitwe gya bond, vision, tooling, handling ne software nga tonnagula.

Oteekateeka kugula BESI die bonder ekozesebwa? Weekenneenye 12 DATACON ne Esec checks ezikwata ku configuration, tooling, FAT, software n'obuyambi.

Ekyuma ekiyitibwa wire bonder kye kimu ku byuma ebikulu ebikozesebwa mu kupakinga kwa semiconductor n’okukola microelectronics. Kivunaanyizibwa ku kutondawo ebiyungo by’amasannyalaze wakati wa chips za semiconductor ne package leads nga ekozesa waya ezikwatagana ennungi ennyo.

Wire bonders byuma bikulu ebikozesebwa mu kupakinga semiconductor, okukuŋŋaanya IC, okukola LED, n’okukola microelectronics. Ziwa enkolagana entuufu ey’amasannyalaze wakati wa chips za semiconductor ne package leads nga zikozesa waya ennungi ezikwatagana. Wansi