I-ASM AMICRA AFC Plus: I-Die Bonding, iinketho ze-Flip-Chip kunye nendima yenkqubo

I-ASM AMICRA AFC Plus yiplatfomu yokubopha ngobuchule obumiselweyo enxulunyaniswa ne-die-attach kunye ne-flip-chip assembly. Ikwi-portfolio ye-ASMPT AMICRA ye-high-precision die-bonding kwaye ifanelekile kwizicelo ezifana ne-micro-optics, i-MEMS, i-LED assembly, i-optoelectronics kunye ne-advanced semiconductor packaging.

Ukuyibiza ngokuba yi-die bonder okanye yi-flip-chip bonder kuphela kwenza kube lula kakhulu indima yayo. I-die bonding ichaza umsebenzi obanzi wokuhlanganisa, ngelixa i-flip-chip bonding itshintsha indlela i-die orientation kwaye izise iimfuno ezahlukeneyo zokuphatha, ukulungelelanisa kunye nezixhobo.

Iqonga linokuxhasa iindlela ezahlukeneyo zenkqubo, kodwa amandla asebenzisekayo omatshini ngamnye adalwe yihardware yawo efakiweyo, isoftware, izixhobo kunye nokuseta inkqubo efanelekileyo. Eli nqaku lichaza indlela ezo misebenzi ezinxulumene ngayo ngaphambi kokuba kuqale ukuthelekisa uqwalaselo oluthile lweprojekthi.

Yintoni i-ASM AMICRA AFC Plus

I-AFC Plus yenzelwe ukuphatha, ukulungelelanisa kunye nokubopha i-semiconductor die okanye icandelo elichanekileyo kumphezulu ekujoliswe kuwo phantsi kweemeko zenkqubo ezilawulwayo. Ngokuxhomekeke kwisicelo, ithagethi inokuba yi-substrate, isakhiwo sesixhobo okanye omnye umphezulu wokuhlanganisa.

Uyilo lwayo lwemodyuli luvumela indlela yokubopha ukuba yakhiwe malunga neendlela ezahlukeneyo zokuyila, iinkqubo zezinto, iindlela zokuphatha, izixhobo zokubopha kunye nemisebenzi yenkqubo exhasayo. Izinto ze-ASM AMICRA zembali zichaza i-AFC Plus njengeqonga lokubopha elizenzekelayo ngokupheleleyo le-die kunye ne-flip-chip, ngelixa izinto ze-ASMPT zangoku ziqhubeka nokuzifaka kwipotifoliyo yokubopha echanekileyo yenkampani kwaye zibhekisa kwingcamango yomatshini wemodyuli enenketho ye-flip-chip.

Ezi nkcazo zimisela ulwalathiso lobuchwephesha lweqonga. Azichazi ngqo iintloko, izixhobo, imisebenzi yombono, iimodyuli zokusetyenziswa kwezinto okanye isoftware efakwe kumatshini othile.

I-Die Bonding kunye ne-Flip-Chip Bonding zisebenza kwiindlela ezahlukeneyo zokuhlanganisa

Ukubopha nge-die yinkqubo ebanzi yokubeka kunye nokudibanisa i-die okanye i-precision component kwithagethi. Kwindlela ejongene nayo, i-die ihlala ikwi-orientation efunekayo kwinkqubo yokudibanisa okanye yokuhlanganisa kamva.

Ukubopha kwe-flip-chip kuyayitshintsha loo budlelwane. Icala elisebenzayo okanye elidibeneyo ledayi lijongene nomphezulu wokudibana, ngoko ke inkqubo kufuneka ilawule indlela idayile ekhethwa ngayo, ejikwa ngayo, exhaswa ngayo, elungelelaniswe ngayo kwaye idibana nethagethi.

Akukho ndlela iphucuke kakhulu kunale iqhelekileyo. Zisombulula iingxaki ezahlukeneyo zokuhlanganisa kwaye kufuneka zikhethwe ngokwendlela ebekwe ngayo idayisi, ulwakhiwo lwethagethi, izinto zokubopha kunye nejoyinti efunekayo.

Ukuze umsebenzi we-flip-chip usebenze, umatshini udinga indlela efanelekileyo yokuphatha idayethi, indawo yokulungelelanisa, izixhobo, isoftware kunye nokuseta inkqubo ebonisiweyo. Inkcazo yomzekelo yodwa ayiqinisekisi ukuba ezi zinto zikhona.

Indlela Ukuphatha, Ukulungelelanisa kunye Nokubopha Okusebenza Ngayo Kunye

Inkqubo yokubopha ngokuchanekileyo yenziwa ziimisebenzi eliqela edibeneyo. Idayi kufuneka kuqala iboniswe ngendlela evumela ukulandwa ngokukhuselekileyo. Emva koko umatshini uyayithutha, kwaye apho inkqubo ifuna khona, utshintshe indlela eyiyo ngaphambi kokuba uyilungelelanise nesiseko okanye ithagethi.

Kwinqanaba lengqiqo, ulandelelwano lulandelayo:

Veza idayisi → Khetha uze ujonge → Lungelelanisa → Faka izinto okanye ubushushu apho kufuneka khona → Bopha → Hlola okanye urekhode apho kufakwe khona

Le ayisiyonkqubo ye-AFC Plus esisigxina. Inkqubo yokuncamathisela i-face-up die-attach inokulandela indlela eyahlukileyo yokuphatha ukusuka kwi-flip-chip assembly. Inkqubo ye-epoxy ingasebenzisa ukustampa okanye ukukhupha, ngelixa inkqubo ye-eutectic igxininisa ngakumbi kwinkqubo yezinto, ulawulo lobushushu kunye neemeko zokubopha.

I-substrate ikwafuna indlela yokubonisa ezinzileyo. Ii-chucks, izixhobo okanye ezinye izixhaso zingasetyenziselwa ukuyibamba kwindawo ephindaphindwayo kwaye zinike intloko yokubopha ukufikelela kwindawo ekujoliswe kuyo.

Umbono udibanisa idayisi kunye nethagethi ngaphakathi kwale nkqubo. Iikhamera, ii-optics kunye nezibane zichonga iimpawu zesalathiso, ngelixa indlela yokulungelelanisa imisela indawo yazo ngaphambi kokuba zibotshelelwe. Umgangatho wokuqaphela unokuchatshazelwa kukungafani kwezinto, imeko yomphezulu, ukulinganiswa, uzinzo lwezixhobo kunye nentshukumo yobushushu.

Ingxelo yokuchaneka kwinqanaba lemodeli ayinakuchaza zonke iziphumo zeprojekthi kuba ukusebenza kolungelelwaniso kuveliswa yindawo epheleleyo yenkqubo. Iimpawu zethagethi, i-optics efakiweyo, izixhobo, ukulinganisa kunye neemeko zokubopha kufuneka zisebenze kunye.

Iiresiphi zesoftware zilungelelanisa le misebenzi yomzimba. Zinokulawula izikhundla zokuphatha, iireferensi zokulungelelanisa, izigaba zokusetyenziswa kwezinto, ulandelelwano lweentshukumo kunye nezinye iiparamitha zenkqubo. Indlela yokubopha esebenzisekayo ke ngoko yenziwa yihardware, izixhobo, isoftware kunye nokulinganisa okusebenza njengenkqubo enye.

Izinto zokudibanisa kunye nemisebenzi yeNkqubo yokuxhasa

Ukunyathela kunye nokuSasaza i-Epoxy

I-Epoxy stamping idlulisela izinto zokubopha ngesitampu okanye isixhobo esikhethekileyo. Inokuba luncedo xa inkqubo ifuna imo yediphozithi echaziweyo okanye isixa esiphindaphindwayo kwindawo ethile.

Ukusasaza izinto kuhambisa izinto ngenkqubo yokusasaza efakiweyo kwaye kunokuxhasa iindawo ezahlukeneyo zokufaka imali, iipateni okanye iivolumu. Nangona zombini ezi ndlela zisebenzisa izinto zenkqubo, zenza iimfuno ezahlukeneyo zezixhobo, ulawulo kunye nesoftware.

Ukustampa kufuna izixhobo ezifanelekileyo zesitampu kunye nejometri yezixhobo. Ukusasaza kufuna inkqubo yokusasaza ehambelanayo, indlela yezinto kunye nolawulo lwenkqubo. Ukusetyenziswa kwazo kuxhomekeke kwindlela yokubopha ecetywayo endaweni yegama le-AFC Plus lodwa.

Ukubopha okufudumeleyo nokushushu

Ukubopha nge-Eutectic kusebenzisa izinto ezilawulwayo kunye nenkqubo yobushushu ukwenza i-joint. Ubushushu, amandla, imeko yomphezulu kunye nezixhobo ezithile zenkqubo zonke zinokuchaphazela isiphumo.

Izinto ezisemthethweni zembali zidibanisa i-AFC Plus nemiyalelo yokubopha ye-eutectic kunye ne-epoxy kwaye zidwelisa izixhobo ezishushu phakathi kweendlela ezikhoyo. Oku kuxhasa ubudlelwane benkqubo, kodwa akukho bushushu bunye, amandla okanye ulandelelwano lokubopha. Ezo xabiso zichazwa yinkqubo yezinto ezikhethiweyo, izixhobo zobushushu, intloko yokubopha, izixhobo kunye neresiphi efanelekileyo.

Ukumapha kweWafer, ukuPhiliswa kwe-UV kunye nokuhlolwa emva kweBond

Ukumapha kwe-wafer kunokuxhasa ukuchongwa kweedayi, ukukhethwa kweendawo okanye olunye ulwazi olusetyenziswa yinkqubo yokuphatha. Ukusetyenziswa kwayo kuxhomekeke kwisoftware efanelekileyo, ii-interfaces kunye nesakhiwo sedatha esixhaswayo.

Ukulungiswa kwe-UV kunokufakwa xa izinto zokubopha zifuna ukuvezwa kwi-ultraviolet emva kokusetyenziswa okanye ukubekwa. Zifuna izixhobo zokulungisa ezihambelanayo kunye nolandelelwano lwenkqubo oluphuhliswe kwizinto ezikhethiweyo.

Ukuhlolwa emva kwebhondi kunokujonga ubukho bedayi, indawo okanye ezinye iziphumo ezichaziweyo emva kokubopha. Izinto ezisemthethweni zembali ziyidwelisa njengomsebenzi we-AFC Plus onokukhetha, ngelixa umda wovavanyo lokwenyani umiselwa zii-optics ezifakiweyo, isoftware, ukulinganiswa kunye nemigangatho yokwamkelwa.

Ubuchule bePlatform kunye noBumbeko oluFakiweyo Azifani

Amaxwebhu eqonga achaza imiyalelo yenkqubo enokuxhaswa lusapho lomatshini. Ayichazi ngokuyimfuneko uqwalaselo lwe-AFC Plus nganye.

Incwadana yembali ingadwelisa ukuphathwa kwe-flip-chip, imephu ye-wafer, izixhobo ezifudunyezwayo okanye ukuhlolwa kwe-post-bond njengeendlela zokukhetha. Iphepha langoku lepotifoliyo linokubeka ngokuchanekileyo indawo kunye neendawo zokusetyenziswa kwethagethi. Zombini imithombo ziluncedo, kodwa akufuneki zidityaniswe zibe ngumatshini oqhelekileyo ocingelwayo.

Umsebenzi ngamnye wenkqubo udinga indibaniselwano echanekileyo yehardware, isoftware kunye nezixhobo. Ukusebenza kwe-flip-chip kunokufuna indlela ekhethekileyo yokuqondisa kunye nezixhobo ezifanayo. Ukumapha kwe-wafer kuxhomekeke kwisoftware ehambelanayo kunye nojongano lwedatha. Ukuhlolwa kuxhomekeke kwindawo yombono efakiweyo, ngelixa ukubophelela okufudumeleyo kufuna izixhobo ezifanelekileyo zobushushu kunye nolawulo.

Yingakho oomatshini ababini be-AFC Plus banokusebenzisa usetyenziso olwahlukileyo kakhulu. Inkqubo eyenzelwe ii-micro-optics inokuba neentloko ezahlukeneyo, izixhobo, ii-optics kunye neenkqubo ezivela kwenye elungiselelwe i-MEMS, i-LED assembly okanye i-semiconductor packaging.

Ukuchaneka okupapashweyo kunye namanani exesha lomjikelo nawo afuna umxholo. Amaxabiso embali anokunxulumana noqwalaselo lomatshini olunexesha, inkqubo echaziweyo okanye imeko ethile yokusebenza, ngelixa izishwankathelo zepotifoliyo ezintsha zinokuchaza indawo ebanzi yeqonga.

Ukujoliswa kwe-die, izixhobo, indlela yokulungelelanisa, ukuphathwa kwezinto, amanyathelo obushushu kunye neendlela ezifakiweyo zonke zinokutshintsha umjikelo wenkqubo osebenzayo kunye nesiphumo. Amanani avela kwimithombo eyahlukeneyo kufuneka agcine imihla yawo yokuqala kunye neemeko endaweni yokudityaniswa kwinkcazo enye yehlabathi.

Iindawo zoSetyenziso Azibonisi Ukuhambelana kweProjekthi

I-ASMPT idibanisa i-AFC Plus ne-micro-optics, i-LED kunye ne-MEMS assembly, i-advanced semiconductor packaging kunye nezinye izicelo zokuvelisa ivolumu. Ezi lebheli zibonisa iimarike apho imisebenzi yokubopha ngokuchanekileyo inokuba luncedo khona.

Abaqinisekisi ukuba yonke imveliso kwezo marike inokusebenza kuyo yonke i-AFC Plus. Iiprojekthi ezimbini ze-photonics okanye ze-MEMS zinokusebenzisa ubungakanani obahlukeneyo bedayi, izinto ze-substrate, i-bonding media, iindlela zokujonga, iireferensi ze-optical kunye neemeko zobushushu.

Ukubaluleka kobuchwephesha kufuneka kuhlolwe ukusuka kwidayi, umphezulu ekujoliswe kuwo, izinto zokubopha kunye nendlela yenkqubo efunekayo. Ukuphathwa kokufakwa kunye nokuphuma, izixhobo, isoftware, uhlolo, iimfuno zokufudumeza kunye namandla emva koko kugqitywe ukuba yeyiphi imisebenzi yomatshini efuna ukuphononongwa ngokusondeleyo.

Nje ukuba ezo nkcukacha zeprojekthi zichaziwe, inyathelo elilandelayo luvavanyo loqwalaselo oluthile lweprojekthi endaweni yokuthelekisa ngokubanzi iinkcazo zemodeli.

Ukusuka kuPhando lwePlatform ukuya kwiConfiguration Matching

Uphando lweqonga lwenze umsebenzi walo xa indibano ecetywayo ingachazwa ngokucacileyo. Uhlolo oluluncedo luqala ngobungakanani bedayi kunye nezinto, isiseko okanye ithagethi, ulwalathiso lwedayi, indlela yokubopha kunye nezinto zokubopha.

Iireferensi zokulungelelanisa, iimfuno zokufudumeza okanye zamandla, ukusetyenziswa kwezinto, ukuphathwa kokufaka kunye nokuphuma, izixhobo ezikhoyo kunye nalo naliphi na inqanaba lokuhlola okanye lokuphilisa nazo kufuneka ziqwalaselwe. Ezi nkcukacha zimisela ukuba yeyiphi intloko yokubopha, ulungiselelo lokuphatha, i-optics kunye neemodyuli ezixhasayo ekufuneka ziphandwe.

SebenzisaUqwalaselo lwe-ASM AMICRA AFC PlusUkuze uthelekise ezo mfuno nemisebenzi yomatshini efanelekileyo, okanye uqhagamshelane neqela lobuchwephesha nge-imeyile okanye nge-WhatsApp ukuze uqalise uphononongo lweprojekthi. Imizobo, imifanekiso yesiseko, iifoto zezixhobo kunye namaxwebhu enkqubo anokuqhotyoshelwa emva kokuba incoko ivuliwe.

Ukuhambelana, iindlela ezifakiweyo, ukusebenza, ixabiso kunye nokuhanjiswa kufuneka kuxoxwe kuphela emva kokuba iimfuno zeprojekthi kunye noqwalaselo lomatshini olufanelekileyo luthelekisiwe.

Imibuzo Ebuzwa Rhoqo Malunga ne-ASM AMICRA AFC Plus

Ingaba i-ASM AMICRA AFC Plus yi-die bonder okanye yi-flip-chip bonder?

Inxulunyaniswa nemiyalelo yenkqubo ye-die-bonding kunye ne-flip-chip. I-die bonding ngumsebenzi obanzi wokuhlanganisa, ngelixa amandla e-flip-chip asebenzisekayo afuna ulungelelwaniso olufanelekileyo, ulungelelwaniso, izixhobo, isoftware kunye noqwalaselo lwenkqubo.

Yintoni umahluko phakathi kwe-die bonding kunye ne-flip-chip bonding kwi-AFC Plus?

Umahluko ophambili kukujonga indlela esebenza ngayo i-die orientation kunye nolwalamano lwayo nethagethi. I-Flip-chip bonding ibeka icala elisebenzayo okanye elidibeneyo kumphezulu wokudibana, itshintsha indlela yokuphatha, ukulungelelanisa, ukusebenzisa izixhobo kunye nolandelelwano lokubopha.

Ngaba yonke i-AFC Plus ibandakanya i-flip-chip bonding?

Hayi. Izinto ezisemthethweni zembali zichaza ukubopha kwe-flip-chip njengokhetho. I-hardware efanelekileyo, isoftware, izixhobo kunye nokuseta inkqubo kufuneka zibekho kumatshini ngamnye.

Yintoni eyenziwa yi-epoxy stamping kunye ne-dispensing?

Zombini izinto zenkqubo yokudlulisa, kodwa zisebenzisa iindlela ezahlukeneyo. Ukunyathela kusebenzisa izinto ngesixhobo esikhethekileyo, ngelixa ukusasaza kuzihambisa ngenkqubo yokusasaza efakiweyo.

Yintoni i-eutectic bonding kwi-AFC Plus?

Lulwalathiso lokubopha apho inkqubo yezinto ezilawulwayo, inkqubo yobushushu kunye nezixhobo ezithile zenkqubo zinegalelo ekwakhekeni kwamalungu. Ubushushu, amandla kunye nolandelelwano zichazwa yinkqubo esetyenziswayo kunye nefakiweyo.

Ngaba i-AFC Plus ingayixhasa i-photonics, i-MEMS okanye iiprojekthi zokupakisha eziphambili?

Ezi zizikhokelo zesicelo eziqatshelweyo zeqonga, kodwa azibonisi ukuhambelana nayo yonke imveliso. Idayi, isiseko, inkqubo yezinto, ulwalathiso, izixhobo, ulungelelwaniso kunye neemodyuli ezifunekayo kufuneka zihlolwe kwiprojekthi.

Isiphelo:I-ASM AMICRA AFC Plus yiplatifomu yokubopha echanekileyo ye-die kunye ne-flip-chip, kodwa iindlela ezimbini zokubopha ziquka iindlela ezahlukeneyo zokujonga i-die, iimfuno zokulungelelanisa kunye neemfuno zezixhobo. Umbono, ukusetyenziswa kwezinto, ukufudumeza, imephu ye-wafer, ukuphilisa kunye nokuhlola kuxhasa iindawo ezahlukeneyo zenkqubo kwaye kunokufuna iimodyuli ezithile ezifakiweyo. Iinkcazo zeplatifomu zinokumisela ukubaluleka kobuchwephesha, ngelixa ukuhambelana kweprojekthi kufuna uphononongo loqwalaselo olusekwe kwi-die yokwenyani, i-substrate, indlela yokubopha kunye neemeko zenkqubo.