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Ukuhambisa iphakheji kwi-ASM AERO wire bonder ayisiyonto yokuseta umatshini kuphela.Ukubopha ucingo okuzinzileyo kuxhomekeke kwindlela izinto zocingo ezidityanisiweyo ezisebenza ngayo, i-capillary geometry, ukwakheka kwebhola yomoya okhululekileyo, useto lwebhondi yokuqala, useto lwebhondi yesibini, iprofayili yeluphu, ubushushu bomsebenzi, imeko ye-die pad, umphezulu we-leadframe okanye we-substrate, ulungelelwaniso lombono kunye nokuseta komatshini.
Kwintambo yobhedu okanye ezinye izixhobo zentambo yokuvelisa, ukudluliselwa kwenkqubo akufuneki kuvunywe kuphela kuba umatshini unokuvelisa ibhola kwaye ugqibezele umjikelo owomileyo. Iphakheji ekujoliswe kuyo kufuneka iqinisekiswe ngokulandelelana kokubopha okulawulwayo okujonga ukwakheka kwebhondi yokuqala, ukuhambelana kwebhondi yesibini, ijiyometri yeluphu, uzinzo lokubekwa kunye nempendulo yenkqubo yezinto zokwenyani.
Esi sikhokelo sichaza izinto eziphambili ezitshintshayo ekufuneka zihlolwe xa kudluliselwa iphakheji kwi-ASM AERO wire bonder, kubandakanya ukhetho lwe-capillary, i-wire feed, ukuziphatha kwe-FAB, i-loop, iimeko zobushushu, ukuseta umbono kunye nocwangciso lokuqinisekisa.
Ngamafutshane: Yintoni elawula uzinzo lwe-Wire Bonding kumatshini we-ASM AERO?
Uzinzo lwe-wire bonding lulawulwa yi-full process chain endaweni yokusetyenziswa komatshini omnye. Ezona zinto zibalulekileyo ziquka imeko ye-die pad, i-substrate okanye umphezulu we-leadframe, izinto ze-wire kunye nobubanzi, i-capillary geometry, ukuziphatha kwe-EFO, ii-first-bond parameters, ii-second-bond parameters, i-loop profile, ubushushu bomsebenzi, ukulungelelaniswa kombono kunye nokuqinisekiswa kwenkqubo.
Musa ukutshintsha izinto zentambo ngaphandle kokujonga useto lwe-capillary, i-FAB kunye ne-bond.
Musa ukusebenzisa i-capillary kuba nje isebenza kwiphakheji yangaphambili.
Musa ukwamkela iprofayili yeluphu ukusuka kwindawo enye kwiyunithi enye yesampulu.
Musa ukucinga ukuba ibhondi yokuqala eqinileyo iqinisekisa ukusebenza okuzinzileyo kwebhondi yesibini.
Musa ukuyikhulula inkqubo de kube iphakheji yokwenyani, izixhobo kunye neemeko zemveliso ziqinisekisiwe.
Kutheni ukudluliselwa kwenkqubo ye-AERO kungaphezulu nje kokusetwa komatshini
Ukuseta umatshini yinxalenye enye kuphela yokudluliselwa kwenkqubo. Iphakheji inokufuna ii-capillaries ezintsha, abasebenzi abahlukeneyo, amanqaku okufundisa umbono ohlaziyiweyo, ucwangciso oluhlaziyiweyo lwe-loop, useto olutsha lwe-wire-feed okanye imeko yobushushu etshintshileyo nangona i-AERO wire bonder efanayo sele isebenzisa enye imveliso.
Utshintsho luba novakalelo ngakumbi xa i-die pad metallization, i-leadframe plating, i-substrate finish, i-wire material, i-die thickness, i-pad geometry, i-package clearance okanye i-mold-related irregulations itshintsha. Umatshini wokubopha kufuneka ulungelelaniswe ngokwenkqubo yokwenyani yomzimba kunokuba ube yindlela yokupheka yangaphambili.
Umgaqo wokudlulisela inkqubo:Qinisekisa iphakheji, izinto kunye nendibaniselwano yezixhobo njengenkqubo enye. Musa ukuqinisekisa i-wire bonder yodwa.
Iinguqu ezili-10 ezilawula uzinzo lwe-Wire Bonding
1. I-Die Pad Metallization kunye neMeko yoMphezulu
I-bond yokuqala ixhomekeke kakhulu kwimeko ye-die pad. Uhlobo lwe-metallization, ukucoceka kwe-pad, i-oxidation, ungcoliseko, ubungakanani be-pad, ukuvulwa kwe-passivation, i-topography kunye nembali yokuphathwa kwe-die zonke ezi zinto zinokuchaphazela indlela yokuziphatha kwe-bond.
Ngaphambi kokuba utshintshe useto lomatshini, hlola ukuba ingxaki ye-first-bond inxulumene ne-die pad ngokwayo. Inkqubo eyayizinzile kumthombo omnye we-die inokusebenza ngendlela eyahlukileyo xa kuqaliswa i-wafer lot entsha, i-pad finish okanye umthengisi we-die.
2. Umphezulu we-Leadframe, i-Substrate okanye i-Package Bonding
Ibhondi yesibini iphenjelelwa yimeko yomphezulu webhondi ofumanayo. Iplati yefreyimu yentsimbi, ukugqitywa kwesinyithi se-substrate, i-geometry yeminwe yebhondi, ukungcola, ukuthamba, inkxaso yephakheji kunye nokuziphatha kobushushu kunokuchaphazela ukwakheka kwestitshi kunye nokuhambelana kwebhondi.
Xa kuvela utshintsho lwesibini sebhondi, ingxaki isenokungabangelwa kuphela ngamandla okanye amandla e-ultrasonic. Hlaziya izinto ezikwiphakheji, imeko yeplating, i-fixturing kunye nozinzo lwabasebenzi njengenxalenye yophando.
3. Izinto zocingo, ububanzi kunye nokungaguquguquki kweLoti
Izinto zocingo kunye nobubanzi bocingo zichaphazela ukwakheka kwe-FAB, ukusebenzisana kwe-capillary, ukuguqulwa kwebhondi, ukuziphatha kwe-loop kunye nefestile yenkqubo. Utshintsho kuhlobo locingo, ububanzi, ukugquma, imeko yokugcina okanye indawo yomthengisi kufuneka luphathwe njengotshintsho lwenkqubo elawulwayo.
Intambo kufuneka iqinisekiswe ngaphambi kokuba kuqhutywe udluliselo lwemveliso. Qinisekisa ukulayisha ngokuchanekileyo, ukuhambisa, ukujongwa kwe-spool, ukucoceka kwendlela yokutya kunye nokuhambelana neresiphi ye-capillary kunye ne-bonding efakiweyo.
4. Ijiyometri yeCapillary kunye nokuNxitywa kweZixhobo
I-Capillary geometry yenye yezona zinto zibalulekileyo ekubopheleleni kwebhola. Ichaphazela indlela ibhola ephuma ngayo emoyeni, ukuguquka kwebhondi yokuqala, unyawo lwebhondi, ukwakheka kwestitshi, imo yeluphu kunye neemeko zokususwa kwebhanti.
Ii-capillaries kufuneka zikhethwe ngokuhambelana nobubanzi bentambo, i-pad geometry, ithagethi yebhola ebotshelelweyo, uyilo lwefreyimu yentsimbi okanye i-substrate, imfuneko yeluphu kunye nokwakhiwa kwephakheji. I-capillary esebenza kwisixhobo esinye isenokungafaneleki kwenye iphakheji.
Ukonakala kwezixhobo, ungcoliseko, umonakalo okanye ijiyometri engaguqukiyo kunokubangela ukubopha okungazinzanga nokuba iiparameter zomatshini zibonakala zingatshintshanga.
5. Ukwenziwa kweNtambo, iClamp kunye nomsila
Ukutya kwentambo okuzinzileyo kuyimfuneko ukuze kusekwe i-FAB ephindaphindwayo kunye nokuveliswa kweluphu. Indlela yentambo, imeko ye-clamp, ixesha le-clamp, ubude bomsila, ujongano lwe-capillary kunye nempendulo ye-feed kufuneka zihlolwe ngaphambi kokuba kwenziwe utshintsho olukhulu kwiiparameter ze-bond.
Iimpawu ezinje ngeebhola zomoya ezikhululekileyo ezingahambelaniyo, ukuqhekeka kweengcingo okungalindelekanga, ukuphakama kweluphu engazinzile okanye ukuziphatha okungacwangciswanga kwe-first-bond kunokunxulunyaniswa nokutya kweengcingo, intshukumo ye-clamp okanye imeko yokulawula umsila.
6. I-EFO kunye nokwakheka kweBhola ekhululekileyo
Ukwakheka kwebhola yomoya okhululekileyo yinxalenye esisiseko yokubopha ibhola. Inkqubo ye-EFO, imeko ye-electrode, umsila wentambo, ukutya kwentambo, ukuseta i-capillary kunye nendawo yegesi zonke ezi zinto zinokuchaphazela ubungakanani, imo kunye nokuhambelana kwebhola.
Ngexesha lokudluliselwa kwenkqubo, misela i-FAB ezinzileyo ngaphambi kokuba uzame ukulungiswa kokugqibela kwebhondi yokuqala. Inkqubo yebhondi yokuqala ayinakulungiswa ngokuthembekileyo xa ibhola engenayo yomoya okhululekileyo ingahambelani.
7. Ibhalansi yeParamitha yeFirst-Bond
Ukusebenza kwe-first-bond kuchatshazelwa ngamandla, amandla e-ultrasonic, ixesha le-bonding, ubushushu, imeko ye-capillary, imeko ye-FAB, umgangatho we-die pad kunye nokuchaneka kokulungelelaniswa. Ezi zinto ziguquguqukayo kufuneka zilungiswe ngendlela elawulwayo kunokuba zilungiswe ngotshintsho olubanzi ngaxeshanye.
Xa iziphumo ze-first-bond zingangqinelani, sebenzisa uphononongo olucwangcisiweyo: qinisekisa imeko ye-die pad, hlola ukuguguleka kwe-capillary, qinisekisa indlela esebenza ngayo i-FAB, qinisekisa ulungelelwaniso, uze uvavanye amandla, amandla, ixesha kunye neemeko zobushushu.
8. Ukwakheka kweBond yesibini kunye neStitch
Umgangatho webhondi yesibini uxhomekeke kumphezulu ofumanayo, iiparameter zokuthunga, i-capillary geometry, uxinzelelo lwentambo, indlela yokujikeleza, imeko yomsebenzi kunye nozinzo lobushushu. Ibhondi yokuqala eqinileyo ayiqinisekisi ibhondi yesibini eqinileyo.
Hlola inkangeleko yesititshi kunye nokuhambelana kwebhondi kwiindawo ezahlukeneyo zephakheji. Utshintsho kwelinye icala lefreyimu yentsimbi okanye isiseko sentsimbi lunokubonisa inkxaso yesixhobo, ukuba sithe tyaba, ubushushu okanye iingxaki zokulungelelaniswa kwendawo endaweni yengxaki yeresiphi yehlabathi.
9. Iprofayili yeLoop, iSpan kunye nokuphakama kweLoop
Ukujika kufuneka kuyilwe kujikeleze uyilo lwephakheji. Ukuphakama kwe-loop, ububanzi bayo, i-geometry yesithende, ukususwa kwentambo, umgama ophakathi kwe-die-to-lead, iingcingo ezikufutshane, ukuhamba kwesikhunta kunye nemida yephakheji kufuneka zonke ziqwalaselwe.
Iprofayili yeluphu kufuneka ihlolwe kuyo yonke iphakheji, kungekuphela nje kwindawo enye yokubopha ephakathi. Iindawo zomphetho, ii-long spans, iingcingo ezikufutshane kunye neekona zephakheji ezinzima zinokutyhila imiba engabonakaliyo kuvavanyo olulula lokuseta.
10. Ubushushu boMsebenzi kunye noZinzo loBushushu
Ubushushu buchaphazela indlela izinto ezisebenza ngayo, uzinzo lwe-substrate, impendulo ye-leadframe, ukwakheka kwe-bond kunye nokuhambelana kwexesha elide. Umsebenzi, i-heater plate, uqhagamshelwano lwe-fixture kunye nenkxaso yephakheji kufuneka zihlolwe ngaphambi kokuba kuchazwe umahluko kuphela kwiiparamitha ze-bonding.
Kwiiphakheji ezinobuthathaka kubushushu okanye kwiimveliso ezinde, vavanya ukuba ubushushu buhlala buzinzile na kubasebenzi bonke kunye nokuba inkxaso yeephakheji iyatshintsha ukusuka kwenye indawo ukuya kwenye.
Indlela yokuqhuba inkqubo ye-ASM AERO yokudlulisa i-FAT
I-FAT yokudlulisa inkqubo kufuneka iqinisekise ukuba umatshini onikiweyo ungaqhuba indlela yokwenyani yephakheji ngezixhobo ezimeleyo, izixhobo ezifanelekileyo kunye neziphumo ezibhaliweyo. Akufuneki iphele ekuqalisweni komatshini okanye umboniso wokubopha ucingo oluqhelekileyo.
Inyathelo 1 — Qinisekisa iiPakeji kunye neeNgxelo zezinto
Lungisa imizobo yephakheji, ulwazi lwe-die pad, iinkcukacha ze-leadframe okanye ze-substrate, izinto zocingo, ububanzi bocingo, isiphakamiso se-capillary, iimfuno zomsebenzi kunye neprofayili ye-loop elindelekileyo ngaphambi kokuba uqale uvavanyo.
Inyathelo lesi-2 — Faka i-Capillary kunye ne-Tooling eqinisekisiweyo
Sebenzisa uqwalaselo lwe-capillary kunye nolwe-workholder olufanelekileyo kwisixhobo ekujoliswe kuso. Bhala phantsi uhlobo lwe-capillary, imeko yesixhobo, uhlobo lwentambo, ubume besixhobo kunye nokuseta umatshini ngaphambi kokuvavanya.
Inyathelo lesi-3 — Misela ukwakheka kwebhola ekhululekileyo ezinzileyo
Qinisekisa ukwakheka kwe-FAB okuphindaphindwayo ngaphambi kokuba ugqibezele useto lwe-first-bond. Jonga ukuhambelana kwebhola, uzinzo lwe-wire-tail kunye nokusebenzisana phakathi kwe-EFO, ulawulo lwe-clamp kunye nokuseta i-capillary.
Inyathelo lesi-4 — Qinisekisa i-First Bond kwii-Representative Die Pads
Yenza uvavanyo lwe-first-bond olulawulwayo kwii-die pads zokwenyani okanye ezimeleyo. Hlola inkangeleko ye-bond, ukuguquguquka kwayo, indawo, ukuphindaphindeka kwayo kunye nempendulo yenkqubo ngaphambi kokuba uye kuvavanyo olupheleleyo lwe-loop.
Inyathelo lesi-5 — Qinisekisa iBond yesiBini kwiindawo zokwenyani zePakeji
Qinisekisa ukwakheka kwestitshi, ukuhambelana kwebhondi yesibini kunye nokuchaneka kwendawo kwifreyimu yokwenyani yentsimbi, isiseko okanye umphezulu wesinyithi ofumanayo. Faka iindawo ezinzima zebhondi apho kunokwenzeka.
Inyathelo lesi-6 — Qinisekisa iProfayili yeLoop kuzo zonke iindawo zePakeji
Vavanya ubude beluphu, ububanzi, imilo, ukuvuleka kunye nokuphindaphindwa kweendawo eziphakathi, ezisemaphethelweni kunye nezithuba ezinde. Rekhoda inkqubo yeluphu kunye nayo nayiphi na imida yenkqubo echongiweyo ngexesha lovavanyo.
Inyathelo lesi-7 — Hlaziya uLungelelaniso loMbono kwaye uFundise uzinzo
Qinisekisa ukuba ii-die pads, ii-leads, ii-substrates okanye iireferensi zeepakeji zinokubonwa rhoqo. Qinisekisa amanqaku okufundisa, useto lwekhamera, ukukhanya kunye nokusebenza kokulungelelanisa usebenzisa ipakeji ekujoliswe kuyo.
Inyathelo lesi-8 — Iiparamitha zeRekhodi, Iziphumo kunye neMida yokufaneleka
Bhala phantsi izinto zocingo, iinkcukacha ze-capillary, iimeko ze-EFO, iiparameter zebhondi, useto lwe-heater, inkqubo ye-loop, useto lombono, iziphumo zovavanyo kunye neemeko ezifuna ukuqinisekiswa kwakhona.
Iimpawu zeCommon Wire Bonding kunye neeVariables zokuqala ekufuneka zihlolwe
| Iimpawu ezibonisiweyo | Iinguqu Zokuqala Zokuphononongwa |
|---|---|
| Ibhola yomoya ekhululekileyo encinci okanye engaguqukiyo | Imeko ye-EFO, imeko ye-electrode, i-wire feed, intshukumo ye-clamp, ubude bomsila, izinto ze-wire kunye nokuseta i-capillary. |
| Ukungangqinelani kwebhondi yokuqala | Umphezulu we-die pad, i-capillary geometry, imeko ye-FAB, ulungelelwaniso, amandla, amandla e-ultrasonic, ixesha lokubopha kunye nobushushu. |
| Utshintsho lwebhondi yesibini | Umphezulu wefreyimu okanye i-substrate, iiparameter zokuthunga, ukuguguleka kwe-capillary, uxinzelelo lwentambo, inkxaso yabasebenzi kunye nemeko yobushushu. |
| Ukushukuma kokuphakama kweluphu | Iresiphi yeluphu, i-wire feed, ixesha le-clamp, ubude bomsila, imeko ye-capillary, ukulinganiswa komatshini kunye nozinzo lwephakheji. |
| Ukutshiza ngentambo okanye iprofayili yeluphu engaguqukiyo | Uyilo lweluphu, ububanzi bentambo, ijiyometri yephakheji, iimeko zokucoca, ukuhamba kwezinto, imida enxulumene nokungunda kunye nolandelelwano lwenkqubo. |
| Ukuqhawuka rhoqo kweengcingo | Indlela yentambo, imeko ye-clamp, umonakalo we-capillary, ukuziphatha kwe-EFO, ukutya kwentambo, ukungcola kwezixhobo kunye nebhalansi yeparameter. |
| Ukwahluka kolungelelwaniso phakathi kweendawo zephakheji | Amanqaku okufundisa ngokubona, ukugxila kwekhamera, ukukhanya, ukuba tyaba kwezinto, indawo ebekwe kuyo iphakheji, imeko yeqonga kunye neempawu zesalathiso sendawo. |
Xa Inkqubo Yokubopha Iintambo Kufuneka Iphinde Ifaneleke
Iresiphi yokubopha intambo kufuneka ihlolwe kwaye ifanele ihlolwe kwakhona xa naluphi na utshintsho olubalulekileyo kwinkqubo. Oku kuquka utshintsho kwizinto zentambo, ububanzi bentambo, uhlobo lwe-capillary, ukugqitywa kwe-die pad, i-leadframe okanye i-substrate plating, i-package geometry, umsebenzi, imeko ye-heater, umlawuli womatshini, intloko yokubopha, uqwalaselo lombono okanye indawo enkulu yesoftware.
Ukufaneleka kwakhona akusoloko kufuna ukwakhiwa kwakhona kwenkqubo yonke ukusuka kwi-zero. Nangona kunjalo, utshintsho oluguquliweyo kufuneka luchongwe, luhlolwe umngcipheko kwaye luqinisekiswe ngokuchasene nendlela yokwenyani yepakeji ngaphambi kokuba ikhutshwe iye kwimveliso.
Yintoni Efanele Ibhalwe Ngexesha Lokudluliselwa Kwenkqubo ye-AERO?
Imodeli yomatshini echanekileyo, inombolo yeserial kunye noqwalaselo olufakiweyo
Umzobo wephakheji, uyilo lwe-die pad kunye nomphezulu wokubopha ofumanayo
Izinto zocingo, ububanzi, indawo yomthengisi kunye nemeko yokugcina
Uhlobo lwe-capillary, i-geometry, imeko kunye neendlela zokutshintsha
Ukuseta i-EFO, imeko ye-FAB kunye noseto lwe-wire-tail
Iseti yeparameter yebhondi yokuqala kunye nebhondi yesibini
Iprofayili yeluphu, ubude beluphu, ubude besithuba kunye neemfuno zokususwa kwephakheji
Ukuchonga umsebenzi, isifudumezi kunye nezixhobo
Amanqaku okufundisa umbono, useto lwekhamera kunye nendlela yokulungelelanisa
Ukuqwalaselwa kokuhlolwa, iikhrayitheriya zokwaliwa kunye nezizathu zokufaneleka
Ingcebiso yokugqibela: Qinisekisa iNkqubo epheleleyo yokubopha
I-ASM AERO wire bonder inokubonelela ngeqonga lenkqubo eliqinileyo xa ulungelelwaniso lokwenyani lomatshini, izixhobo ze-capillary, izinto zentambo, umsebenzi, i-package geometry, ukuseta umbono kunye nendlela yokuqinisekisa zilungelelanisiwe.
Ngaphambi kokuba ukhuphe imveliso edluliselwe kwimveliso, qinisekisa ukwakheka okuzinzileyo kwe-FAB, umgangatho webhondi yokuqala, ukuhambelana kwebhondi yesibini, iprofayili yeluphu, ulungelelwaniso lombono kunye nokuphindaphinda kwinqanaba lephakheji. Oku kuthintela impazamo eqhelekileyo yokudluliselwa kwenkqubo: ukuqinisekisa umjikelo womatshini ngaphandle kokuqinisekisa indibaniselwano yokwenyani yephakheji kunye nezinto.
Izixhobo ezinxulumene ne-ASM Wire Bonder
Imibuzo Ebuzwa Rhoqo Malunga Nokudluliselwa Kwenkqubo Ye-ASM AERO Wire Bonder
Yeyiphi eyona nto ibalulekileyo kwi-copper wire bonding?
Akukho nguqu inye isebenza ngokuzimeleyo. Izinto zocingo, ijiyometri ye-capillary, imeko ye-FAB, umphezulu wephedi, iiparameter zokubopha, iimeko zobushushu kunye noyilo lweluphu kufuneka zivavanywe kunye njengenkqubo enye yenkqubo.
Imeko ye-capillary iyichaphazela njani i-first-bond consistency?
Ijiyometri ye-capillary, ukuguguleka, ungcoliseko kunye nomonakalo kunokuchaphazela ukusebenzisana kwe-FAB, ukuguquguquka kwe-bond, ukudluliselwa kwe-ultrasonic, indawo ye-bond kunye nokuchaneka kwendawo. Imeko ye-capillary kufuneka ihlolwe ngaphambi kokuba kwenziwe utshintsho olubanzi lweeparameter.
Kutheni kubalulekile ukwakheka kwebhola yomoya okhululekileyo?
I-FAB yimeko yokuqala yebhondi yokuqala. Ubungakanani bebhola obungaguqukiyo, imilo okanye ukuziphatha kwentambo-umsila kunokudala iziphumo zebhondi yokuqala ezingazinzanga nokuba ezinye iiparameter zebhondi azitshintshanga.
Yintoni echaphazela ukuphakama kweluphu kunye nokuzinza kweluphu?
Ukuphakama kunye nozinzo lweluphu kuchaphazeleka yinkqubo yeluphu, i-wire feed, ixesha le-clamp, imeko ye-capillary, izinto zeluphu, umgama ohambelana nomgca, i-package geometry, inkxaso yabasebenzi kunye nokulinganiswa komatshini.
Iresiphi yokubopha ucingo kufuneka iphindwe nini?
Iresiphi kufuneka ihlolwe xa izinto zocingo, uhlobo lwe-capillary, imeko ye-die pad, ukugqitywa kwe-leadframe okanye i-substrate, i-package geometry, umsebenzi, intloko ye-bonding, ukuseta umbono, imeko ye-heater okanye ezinye izinto ezibalulekileyo kwinkqubo zitshintsha.
Ngaba i-capillary enye ingasetyenziselwa uyilo lweepakethe ezahlukeneyo?
Ngamanye amaxesha, kodwa ukufaneleka kuxhomekeke kububanzi bentambo, i-pad geometry, imfuneko yebhola ebotshelelweyo, uyilo lwe-lead okanye i-substrate, i-loop target kunye ne-package clearance. Ukuhambelana kwe-capillary kufuneka kuqinisekiswe kwindlela nganye yenkqubo.
Kutheni umgangatho we-second-bond wahlukile phakathi kwe-substrate lots?
Utshintsho lunokuchatshazelwa kukugqitywa komphezulu, imeko yeplati, ungcoliseko, ukuba tyaba, inkxaso yezixhobo, ukuziphatha kobushushu, iiparameter zokuthunga kunye neemeko zolungelelwaniso lwendawo. Umphezulu wokwamkela kufuneka uhlolwe kunye nezicwangciso zokubopha.
Yintoni ekufuneka ibhalwe phantsi ngexesha lokudluliselwa kwenkqubo ye-ASM AERO?
Bhala phantsi uqwalaselo lomatshini, iinkcukacha zocingo kunye nee-capillary, imeko ye-EFO, iiparameter zebhondi, inkqubo yeluphu, ukuseta umsebenzi, useto lombono, izixhobo zephakheji, iziphumo zokuhlolwa kunye nemida yokufaneleka kwakhona.
Ngaba ufuna uncedo lokujonga inkqubo yokubopha intambo ye-ASM AERO?
Yabelana ngomzobo wephakheji, uyilo lwe-die pad, iinkcukacha ze-leadframe okanye ze-substrate, izinto zentambo, ububanzi bentambo, ulwazi lwe-capillary, iprofayili ye-target loop, iimeko zomsebenzi kunye neemfuno zemveliso ezilindelekileyo. Uhlolo oluluncedo luqala ngenkqubo epheleleyo yephakheji endaweni yepharamitha enye yokubopha yodwa.
