EN
id
sk
sr
sv
it
pt
bn
ms
be
nl
fr
th
vi
ru
ja
ko
de
hy
az
bs
bg
my
cs
da
dv
el
et
fil
fi
ga
gl
gn
he
hi
km
hr
hu
is
kn
rw
lo
lv
lt
lb
lg
mi
mt
ne
no
ny
or
om
per
pl
ro
sa
so
es
sw
ta
tr
uk
ur
cy
xh
Ultra-High Capacity Flip Chip Die Bonder for Mass Production
The Datacon 8800 FC QUANTUM Advanced is ideal for Wire Bonder applications, providing ultra-high speed and precision for flip-chip assembly processes.
For large-scale flip-chip production, the Flip Chip Bonder ensures maximum throughput and cost efficiency while maintaining ±5 µm placement accuracy.
As part of our BESI Die Bonder lineup, this machine integrates advanced motion control and CRYSTAL flux technology to achieve stable, high-yield production.
Why Choose the Datacon 8800 FC QUANTUM Advanced?
Maximum throughput up to 10,000 UPH for high-volume production
Industry-leading placement accuracy ±5 µm @ 3 Sigma
Innovative CRYSTAL flux system for fast, uniform, and clean chip mounting
Advanced motion control with SMART path filtering for smooth high-speed operation
Comprehensive full-process control ensuring stable yield
Supports diverse substrates and carriers: BGA, FR4, ceramic, flexible boards, strips, leadframes, etc.
Core Applications
Consumer Electronics: Smartphones, tablets, and wearable devices
Memory Modules: DRAM, Flash, and next-gen storage packages
Automotive Electronics: ECUs, sensors, and safety-critical modules
General High-Volume Flip Chip Packaging
Key Technical Specifications
| Specification | Details |
|---|---|
| Placement Accuracy (X/Y) | ±5 µm @ 3 Sigma |
| Bond Force Range | 200g - 5000g |
| Chip Size Range | 0.4mm - 30mm (Fast mode for<12mm chips) |
| Substrate / Carrier | BGA, FR4, Ceramic, Flexible Board, Strip, Leadframe |
| Max Operating Area | 13″ × 12″ |
| Wafer Size Support | 4″ to 12″ |
| Maximum Capacity | Up to 10,000 chips/hour |
| Dimensions (W×D×H) | 1600mm × 1200mm × 1940mm |
| Weight | Approx. 2000 kg |
Innovative Features
CRYSTAL Flux System: Rapid, uniform flux application with integrated visual inspection for clean and precise bonding
Advanced Motion Control: SMART path filtering and optimized trajectories reduce vibration for smooth chip placement
Enhanced Pseudo X-Ray: Quickly detects misalignment post-bonding to maintain yield
Matrix BMC Testing: Continuous monitoring and calibration of placement accuracy
Comparison with Datacon 8800 CHAMEO Advanced
| Feature | 8800 FC QUANTUM Advanced | 8800 CHAMEO Advanced |
|---|---|---|
| Core Positioning | Mass Production Leader – speed & cost-efficiency | Advanced Packaging Pioneer – process flexibility |
| Placement Accuracy | ±5 µm @ 3 Sigma | ±5 / ±3 µm @ 3 Sigma |
| Chip Support | Flip-chip only (Face-down) | Flip-chip & Face-up (high flexibility) |
| Unique Capabilities | CRYSTAL Flux; Extreme Speed | WL-FOP & Advanced Packaging |
Available Equipment Options
Refurbished QUANTUM Advanced Machines
Fully Tested and Production Ready
Rapid Deployment (Lean Production, 4-week delivery)
Global Installation and Engineering Support
Spare Parts Supply
besi datacon bonding machine FAQ
-
What is the Datacon 8800 FC QUANTUM Advanced used for?
The Datacon 8800 FC QUANTUM Advanced is specifically engineered for the mass production of flip-chip assemblies. It is ideal for high-volume semiconductor manufacturing in consumer electronics, memory modules, automotive electronics, and other sectors where speed and precision are critical. This system is optimized to deliver high throughput while maintaining placement accuracy, ensuring stable yield in production lines.
-
What is the maximum throughput of this die bonder?
The QUANTUM Advanced can achieve up to 10,000 chips per hour (UPH) under optimal conditions. Actual throughput depends on factors such as chip size, substrate type, bonding mode, and process configuration. Its high-capacity design and innovative CRYSTAL flux system enable rapid flux application and inspection, contributing to exceptional production speed.
-
How precise is the placement?
The system provides ±5 µm placement accuracy at 3 Sigma, even at maximum speed. This level of precision ensures reliable bonding for flip-chip packages, minimizing misalignment and improving overall yield. Continuous Matrix BMC testing monitors and calibrates placement to maintain consistent results for each chip.
-
What types of substrates and carriers can it handle?
The QUANTUM Advanced supports a wide range of substrates and carriers, including BGA, FR4, ceramic, flexible boards, strips, and leadframes. It can accommodate wafers from 4″ to 12″, and operating areas up to 13″ × 12″, making it versatile for different production requirements.
-
How does it ensure stable yield in high-speed production?
The system uses full-process production control combined with enhanced pseudo X-ray inspection. This allows operators to quickly detect misalignment after bonding, correct errors immediately, and prevent defective units from proceeding. The built-in Matrix BMC testing continuously monitors placement accuracy, ensuring each chip meets the desired specifications.
-
Is it suitable for different production scales and applications?
Yes. The QUANTUM Advanced is ideal for high-volume mass production but also flexible enough for medium-scale manufacturing. It is designed to handle various flip-chip applications in consumer electronics, automotive modules, memory devices, and other sectors requiring both speed and precision.
