Izixhobo ezisetyenzisiweyo zeSemiconductor Inkqubo yeElectroplating yeNokota™ ECD

I-Nokota™ ECD yezixhobo ezisetyenzisiweyo yinkqubo yokufaka iikhemikhali ze-electrochemical enemveliso ephezulu eyenzelwe ngokukodwa ukupakisha okusemgangathweni we-wafer.

**Isiseko seNkqubo: Okungaphezulu Kokusebenzisa Umbane Nje—Iqonga leNkqubo eBanzi**

Inkqubo yeNokota ayisosixhobo sokufaka i-electroplating nje kuphela; inika uluhlu olubanzi lwezisombululo ezenzelwe ukujongana nemingeni ethile ekhoyo kwimisebenzi yokupakisha ephucukileyo. Iimpawu zayo zobugcisa eziphambili ziquka:

**Inkxaso yeNsimbi eBanzi kunye neWafer:** Ixhasa ukufakwa kweendidi ezahlukeneyo zesinyithi—kuquka ubhedu, i-tin-silver alloys, i-nickel, igolide, itin, kunye ne-palladium—kwaye iyahambelana neewafers ze-150mm, 200mm, kunye ne-300mm.

**Ukuguquguquka kweNkqubo:** Inoyilo olukhethekileyo lokulungiselelwa kwegumbi elinye, olusuka kuyilo lwendabuko lwamagumbi amabini. Inkqubo ikhula ngokulula ukusuka kwi-R&D kwaye iqhuba ngovavanyo ukuya kwimveliso ephezulu, kwaye inokulungiswa ngokukhawuleza kusuku olunye—okwenza ukuba ifaneleke ngokufanelekileyo kwiindawo zemveliso ezifuna impendulo ekhawulezayo kwiinguqu zemarike.

**Iingenelo ezintathu eziphambili**

Ngokwendlela esemthethweni yokubeka izinto kwi-Applied Materials, iingenelo eziphambili zokhuphiswano lwenkqubo yeNokota zigxile kwiindawo ezintathu ezilandelayo:

**Izixhobo zokukhusela iWafer ezingenakuthelekiswa nanto: iSafeSeal™ kunye neHotSwap™**

Kwiinkqubo zokupakisha, ukukhusela i-wafer ekungcolisweni zizinto ezincinci kubaluleke kakhulu. Inkqubo yeNokota ijongana nale ngxaki ibalulekileyo ngokusebenzisa ubuchwepheshe obutsha obubini:

**Ubuchwepheshe beSafeSeal™:** Iteknoloji yokukhusela i-wafer ezenzekelayo ngokupheleleyo, eyokuqala kushishino. Ngokwenza uhlolo lokuthembeka kwe-vacuum kwi-wafer ngaphambi kokuba isetyenzwe—nokugcina ukhuseleko kuyo yonke i-single-or multi-metal plating sequence—ivumela ukuhamba komsebenzi "kwe-single-seal", ngokufanelekileyo ukunciphisa umngcipheko womonakalo ohambelana nokutywinwa okuphindaphindiweyo kunye nokuvulwa kwemijikelo.

**Iteknoloji yeHotSwap™:** Ivumela ukutshintshwa ngokuzenzekelayo kwezinto zokutywina ngaphandle kokuphazamisa imveliso, ngaloo ndlela isusa ngokupheleleyo ixesha lokungasebenzi kwezixhobo elibangelwa ziimfuno zokugcinwa kwesitywina.

**Imveliso Ehamba Phambili Kushishino**

**Ukusebenza kakuhle kweendleko kunye nokufumaneka kwazo:** Indibaniselwano yetekhnoloji ekhankanyiweyo apha ngasentla ivumela inkqubo yeNokota ukuba ikwazi ukubonelela ngeeyure ezingama-330 ezongezelelweyo zexesha lokuvelisa ngonyaka, ngelixa ngaxeshanye inciphisa amaxabiso e-wafer scrap ngokusebenzisa amandla okukhusela i-wafer.

**Iigumbi zeNkqubo eziSebenza ngokuPhezulu (VMax™):** Iigumbi zeNkqubo zeVMax™ zinothutho oluphezulu, oluvumela amazinga aphezulu okufaka iipleyiti kunye nokuhambelana okuphezulu. Ngaphezu koko, igumbi ngalinye lidibanisa umsebenzi wokucoca ngaphakathi ukuze kuncitshiswe ungcoliseko lweenxalenye.

**Izakhono zoCwangciso oluKhawulezayo noluguquguqukayo**

Oku kubonisa enye inzuzo enkulu enikwa yilo lenkqubo yemodyuli. Ayixhasi nje kuphela ukutshintsha okungenamthungo phakathi kobukhulu obahlukeneyo be-wafer obukhankanyiweyo ngaphambili kodwa ikwavumela utshintsho olukhawulezileyo phakathi kweendlela ezahlukeneyo zokupakisha (ezifana nokugoba, i-RDL, i-TSV, njl.njl.)—ubuchule obubalulekileyo kwimeko yanamhlanje yeentlobo ezahlukeneyo zokupakisha.

Iinkcukacha eziphambili kunye neemeko zokusetyenziswa

Iinkcukacha zobugcisa ngokukhawuleza

Uhlobo lweZixhobo: Inkqubo yokuPakisha iWafer eNqanaba eliPhezulu

Ubungakanani beWafer obuxhaswayo: 150mm, 200mm, 300mm; ixhasa ukucutshungulwa ngaxeshanye kobukhulu obubini obahlukeneyo kwinkqubo enye

IiMetali ezixhaswayo: I-Copper (Cu), i-Tin-Silver (SnAg), i-Nickel (Ni), iGolide (Au), iPalladium (Pd), njl.

Izicelo zeNkqubo: Ukugquma (iNtsika/ukugquma), Umaleko woKwabiwa kwakhona (i-RDL), Ukuzalisa nge-Through-Silicon Via (TSV)

Iimpawu eziphambili: Ukhuseleko lweWafer oluzenzekelayo lweSafeSeal™, iHotSwap™ Seal Ring Hot-Swapping, iVMax™ High-Performance Chamber

Ukufumaneka/Imveliso: Ibonelela ngeeyure zemveliso ezongezelelweyo ezingaphezu kwama-330 ngonyaka; inika ixabiso eliphantsi lobunini kushishino

Iindawo ezijoliswe kuzo izicelo

Ukupakisha Okuphambili: IiPillars/Bumps, IiRedistribution Layers (RDL), kunye neThrough-Silicon Vias (TSV)

Iiteknoloji zokuPakisha: UkuPakisha kwe-2.5D/3D, UkuPakisha kweFan-Out, UkuPakisha kweChip-Scale yeWafer-Level (WLCSP), njl.

Izicelo Ezivelayo: Ukubonelela ngenkxaso yokupakisha izixhobo ze-IoT, izinzwa, iinkqubo zonxibelelwano ze-5G, izixhobo zamandla, nokunye.

Ikhompyutha Esebenza Kakhulu: Idlala indima ebalulekileyo ekwenziweni kwee-micro-bumps zeMemori yeBandwidth Ephezulu (i-HBM).

Isishwankathelo

Inkqubo ye-Nokota™ ECD ijongana ngokuchanekileyo neemfuno ezingxamisekileyo zokupakisha okuphucukileyo ukuze kubekho isivuno esiphezulu, ukuguquguquka okuphezulu, kunye nemveliso ephezulu. Ngokusebenzisa ubuchwepheshe obufana ne-SafeSeal™ kunye ne-HotSwap™, isombulula iingxaki zokuthembeka ezikhoyo kwiinkqubo zemveli; ngaphezulu koko, isebenzisa iqonga layo eliguquguqukayo lemodyuli, inika abavelisi beetshiphusi isisombululo esibonelela ngeengenelo zexabiso kunye nokusebenza kakuhle ngaphakathi kwemarike enzima nehlala itshintsha.