Ebikozesebwa mu nkola Enkola y’okusiba amasannyalaze ga Semiconductor NokotaTM ECD

Applied Materials’ NokotaTM ECD nkola ya electrochemical deposition system ekola ennyo eyakolebwa naddala okupakinga eby’omulembe ku wafer-level.

**Omusingi gw'Enkola: Okusinga Okussaako Amasannyalaze—Enkola Enkulu**

Enkola ya Nokota si kya kukozesa masanyalaze gokka; egaba ekibinja ekijjuvu eky’okugonjoola ebigendereddwamu okukola ku kusoomoozebwa okwetongodde okuzaalibwa mu nkola z’emirimu ez’okupakinga ez’omulembe. Ebintu byayo ebikulu eby’ekikugu mulimu:

**Broad Metal and Wafer Support:** Ewagira okuteekebwa kw’ebyuma eby’enjawulo-omuli ekikomo, ebbaati-ffeeza alloys, nickel, zaabu, bbaati, ne palladium—era ekwatagana ne wafers za mm 150, mm 200, ne mm 300.

**Flexible System Scalability:** Erimu dizayini ey’enjawulo ey’okusengeka ekisenge kimu, ng’eva ku nsengeka z’ebisenge eby’ennono ebibiri. Enkola eno ekula bulungi okuva ku R&D n’okugezesa okudduka okutuuka ku kukola ebintu mu bungi, era esobola okuddamu okutegekebwa amangu mu lunaku lumu-ekigifuula esaanira ennyo embeera z’okufulumya ezeetaaga okuddamu amangu enkyukakyuka mu katale.

**Ebirungi bisatu ebikulu**

Okusinziira ku kifo ekitongole kya Applied Materials, ebirungi ebikulu eby’enkola ya Nokota mu kuvuganya bikuŋŋaanyiziddwa mu bintu bino ebisatu:

**Obusobozi bw'okukuuma Wafer obutavunaanibwa: SafeSealTM ne HotSwapTM**

Mu nkola z’okupakinga, okukuuma wafer okuva ku bucaafu bw’obutundutundu kye kisinga obukulu. Enkola ya Nokota ekola ku nsonga eno enkulu ey’obulumi ng’eyita mu tekinologiya abiri omuyiiya:

**SafeSealTM Technology:** Tekinologiya asoose mu makolero, akola mu bujjuvu okukuuma wafer. Nga tukola okukebera obulungi bw'obuziba ku wafer nga tennalongoosebwa-n'okukuuma obukuumi mu mutendera gwonna ogw'okusiiga ekyuma ekimu oba ebingi-kisobozesa enkola y'emirimu "ezisiba emu", mu ngeri ennungi okukendeeza ku bulabe bw'okwonooneka okukwatagana n'enzirukanya y'okusiba n'okusumulula enfunda eziwera.

**HotSwapTM Technology:** Asobozesa okukyusa ebitundu ebisiba mu ngeri ey’otoma awatali kutaataaganya kukola, bwe kityo mu musingi ne kimalawo obudde bw’ebyuma okuyimirira obuva ku byetaago by’okuddaabiriza seal.

**Ebivaamu Ebikulembedde mu Makolero**

**Ensimbi n’okubeerawo:** Okugatta tekinologiya okwayogeddwako waggulu kusobozesa enkola ya Nokota okutuusa essaawa endala 330 ez’obudde bw’okufulumya buli mwaka, ate mu kiseera kye kimu n’ekendeeza ku miwendo gy’ebisasiro bya wafer okuyita mu busobozi obw’okukuuma wafer obwongezeddwa.

**Ebisenge by’enkola ebikola emirimu egy’amaanyi (VMaxTM):** Ebisenge by’enkola ya VMaxTM birimu entambula y’amasasi erongooseddwa, ekisobozesa emiwendo gy’okusiiga egy’oku ntikko n’okukwatagana okw’ekika ekya waggulu. Ekirala, buli kisenge kigatta omulimu gw’okuyonja mu kifo okukendeeza ku bucaafu obuva mu butundutundu.

**Obusobozi bw'okusengeka obw'amangu era obukyukakyuka**

Kino kitegeeza enkizo endala enkulu ewereddwa enkola ya modular design. Tekoma ku kuwagira kukyusakyusa mu ngeri etaliimu buzibu wakati wa sayizi za wafer ez’enjawulo ezoogeddwako waggulu naye era esobozesa enkyukakyuka ez’amangu wakati w’enkola ez’enjawulo ez’okupakinga (nga okukuba, RDL, TSV, n’ebirala) —obusobozi obukulu ennyo mu mbeera ya leero ey’ebika by’okupakinga eby’enjawulo.

Ebikulu ebikwata ku nsonga n’embeera z’okukozesa

Ebikwata ku by’ekikugu mu kutunula

Ekika ky’Ebyuma: Enkola y’okusiba eby’amasannyalaze ey’okusiba eby’amasannyalaze

Sayizi za Wafer eziwagirwa: mm 150, mm 200, mm 300; ewagira okukola mu kiseera kye kimu kwa sayizi bbiri ez’enjawulo munda mu nkola y’emu

Ebyuma Ebiwanirirwa: Ekikomo (Cu), Ebbaati-Feeza (SnAg), Nikeri (Ni), Zaabu (Au), Palladium (Pd), n’ebirala.

Enkola y’okukozesa: Okukuba (Empagi/Okukuba), Okuddamu okugabanya Layer (RDL), Okujjuza okuyita mu Silicon Via (TSV).

Ebikulu: SafeSealTM Obukuumi bwa Wafer obukola mu bujjuvu, HotSwapTM Seal Ring Hot-Swapping, VMaxTM Ekisenge eky’omutindo ogwa waggulu

Okubeerawo/Okukola: Etuusa essaawa ezisukka mu 330 ez’okufulumya ez’okwongerako buli mwaka; egaba omuwendo omutono mu mulimu guno ogw’obwannannyini

Ebitundu Ebigendereddwamu Okusaba

Okupakinga okw’omulembe: Empagi/Ebitundu, layers ez’okuddamu okugabanya (RDL), ne Through-Silicon Vias (TSV)

Tekinologiya w’okupakinga: Okupakinga mu 2.5D/3D, Okupakinga mu Fan-Out, Okupakinga mu Wafer-Level Chip-Scale (WLCSP), n’ebirala.

Enkola ezigenda okuvaayo: Okuwa obuyambi bw’okupakinga ebyuma bya IoT, sensa, enkola z’empuliziganya eza 5G, ebyuma by’amasannyalaze, n’ebirala.

High-Performance Computing: Ekola kinene nnyo mu kukola micro-bumps for High Bandwidth Memory (HBM).

Okubumbako

Enkola ya NokotaTM ECD ekola bulungi ku byetaago eby’amangu eby’okupakinga eby’omulembe okusobola okufuna amakungula amangi, okukyukakyuka ennyo, n’okukola ennyo. Okuyita mu tekinologiya nga SafeSealTM ne HotSwapTM, egonjoola ensonga z’obulumi obwesigika obuzaaliranwa mu nkola ez’ennono; n’ekirala, ng’ekozesa enkola yaayo eya modular ekyukakyuka, egaba abakola chip eky’okugonjoola ekituusa enkizo mu nsaasaanya n’obulungi mu mbeera y’akatale enzibu era ekyukakyuka buli kiseera.