Zipangizo Zogwiritsidwa Ntchito Semiconductor Electroplating System Nokota™ ECD

Komata™ ECD ya Applied Materials ndi njira yopangira zinthu zamagetsi yopangidwa mwapadera kuti igwiritsidwe ntchito popanga zinthu zapamwamba.

**Chinsinsi cha Dongosolo: Kuposa Kungopanga Ma Electroplating—Njira Yonse Yogwirira Ntchito**

Dongosolo la Nokota si chida chongogwiritsa ntchito ma elekitiroma okha; limapereka mayankho ambiri opangidwa kuti athetse mavuto omwe amapezeka mu ntchito zapamwamba zopaka ma paketi. Zinthu zake zazikulu zaukadaulo ndi izi:

**Chithandizo cha Chitsulo Chokulirapo ndi Wafer:** Chimathandizira kuyika zitsulo zosiyanasiyana—kuphatikizapo mkuwa, tin-silver alloys, nickel, gold, tin, ndi palladium—ndipo chimagwirizana ndi ma wafer a 150mm, 200mm, ndi 300mm.

**Kusinthasintha kwa Dongosolo:** Ili ndi kapangidwe kapadera ka kusinthika kwa chipinda chimodzi, kosiyana ndi kapangidwe kakale ka zipinda ziwiri. Dongosololi limayambira pa kafukufuku ndi chitukuko ndipo limagwira ntchito yoyesera mpaka kupanga zinthu zambiri, ndipo limatha kukonzedwanso mwachangu mkati mwa tsiku limodzi—zomwe zimapangitsa kuti likhale loyenera kwambiri m'malo opangira zinthu omwe amafunikira kuyankha mwachangu kusintha kwa msika.

**Ubwino Waukulu Utatu**

Malinga ndi momwe Applied Materials imagwirira ntchito, ubwino waukulu wa mpikisano wa Nokota system uli m'magawo atatu otsatirawa:

**Kuteteza Wafer Kosayerekezeka: SafeSeal™ ndi HotSwap™**

Mu njira zopakira, kuteteza wafer ku tinthu tating'onoting'ono n'kofunika kwambiri. Dongosolo la Nokota limathetsa vutoli pogwiritsa ntchito njira ziwiri zatsopano:

**Ukadaulo wa SafeSeal™:** Ukadaulo wodzitetezera wafer wopangidwa ndi makina oyamba mumakampani. Mwa kuchita kafukufuku wa vacuum proof pa wafer musanagwiritse ntchito—ndi kusunga chitetezo mu dongosolo lonse la single-or multi-metal plating—umathandiza kuti ntchito ya "single-seal" iyende bwino, zomwe zimathandiza kuchepetsa chiopsezo cha kuwonongeka komwe kumachitika chifukwa cha kutseka mobwerezabwereza ndi kutsegula.

**Ukadaulo wa HotSwap™:** Imalola kusintha zida zotsekera zokha popanda kusokoneza kupanga, motero imachotsa nthawi yogwira ntchito ya zida chifukwa cha zofunikira pakukonza chisindikizo.

**Kupanga Zinthu Kwambiri**

**Kugwiritsa Ntchito Mtengo Ndi Kupezeka Kwake:** Kuphatikiza kwa ukadaulo komwe kwatchulidwa pamwambapa kumathandiza kuti dongosolo la Nokota lipereke maola ena 330 opangira pachaka, pomwe nthawi yomweyo limachepetsa kuchuluka kwa zidutswa za wafer kudzera mu luso lowonjezera loteteza wafer.

**Zipinda Zogwirira Ntchito Zapamwamba (VMax™):** Zipinda zogwirira ntchito za VMax™ zimakhala ndi njira yabwino kwambiri yonyamulira zinthu zambiri, zomwe zimathandiza kuti ma plating azikhala okwera komanso kuti zinthu zigwirizane bwino. Kuphatikiza apo, chipinda chilichonse chimakhala ndi ntchito yoyeretsa mkati kuti muchepetse kuipitsidwa kwa tinthu tating'onoting'ono.

**Kutha Kusintha Mwachangu komanso Mosinthasintha**

Izi zikuyimira ubwino wina waukulu womwe umabwera chifukwa cha kapangidwe ka makina a makinawa. Sikuti zimangothandiza kusinthana kosasinthasintha pakati pa kukula kosiyanasiyana kwa ma wafer komwe kwatchulidwa pamwambapa komanso zimathandiza kusinthana mwachangu pakati pa njira zosiyanasiyana zopakira (monga bumping, RDL, TSV, ndi zina zotero)—luso lomwe ndi lofunika kwambiri masiku ano la mitundu yosiyanasiyana ya ma packing.

Mafotokozedwe Ofunika ndi Zochitika Zogwiritsira Ntchito

Mafotokozedwe Aukadaulo Mwachidule

Mtundu wa Zida: Kapangidwe ka Wafer-Level Electrochemical Deposition System Yopangira Zinthu Zapamwamba

Kukula kwa Wafer Kothandizidwa: 150mm, 200mm, 300mm; kumathandiza kukonza zinthu ziwiri zosiyana nthawi imodzi mkati mwa dongosolo lomwelo

Zitsulo Zothandizidwa: Mkuwa (Cu), Siliva wa Tin-Siliva (SnAg), Nikel (Ni), Golide (Au), Palladium (Pd), ndi zina zotero.

Kugwiritsa Ntchito Njira: Kugunda (Pillar/Bump), Gawo Logawanso (RDL), Kudzaza Kudzera pa Silicon Via (TSV)

Zinthu Zofunika Kwambiri: Chitetezo cha Wafer Chokhazikika cha SafeSeal™, Mphete Yotseka ya HotSwap™, Chipinda Chogwirira Ntchito Chapamwamba cha VMax™

Kupezeka/Kupanga: Kumapereka maola owonjezera opitilira 330 pachaka; kumapereka mtengo wotsika kwambiri wa umwini wamakampani

Madera Ogwiritsira Ntchito Cholinga

Kupaka Kwapamwamba: Pillars/Bumps, Redistribution Layers (RDL), ndi Through-Silicon Vias (TSV)

Ukadaulo Wopaka Zinthu: Kupaka Zinthu 2.5D/3D, Kupaka Zinthu Zochokera kwa Fan-Out, Kupaka Zinthu Zochepa za Wafer-Level Chip-Scale (WLCSP), ndi zina zotero.

Mapulogalamu Omwe Akubwera: Kupereka chithandizo chothandizira ma phukusi a zida za IoT, masensa, makina olumikizirana a 5G, zida zamagetsi, ndi zina zambiri.

Kompyuta Yogwira Ntchito Kwambiri: Imagwira ntchito yofunika kwambiri popanga ma micro-bumps a High Bandwidth Memory (HBM).

Chidule

Dongosolo la Nokota™ ECD limakwaniritsa zofunikira za phukusi lapamwamba kuti likhale ndi phindu lalikulu, kusinthasintha kwakukulu, komanso kupanga bwino. Kudzera mu ukadaulo monga SafeSeal™ ndi HotSwap™, limathetsa mavuto odalirika omwe amapezeka m'njira zachikhalidwe; komanso, pogwiritsa ntchito nsanja yake yosinthasintha, limapatsa opanga ma chip yankho lomwe limapereka zabwino zonse pamtengo komanso magwiridwe antchito mkati mwa msika wovuta komanso wosinthasintha nthawi zonse.