Sisitemu yo gusimbuza ibikoresho bya semiconductor Nokota™ ECD

Ariko™ ECD y’ibikoresho byakoreshejwe ni sisitemu yo gushyiramo amashanyarazi ikora neza cyane yagenewe by’umwihariko gupakira ku rwego rwo hejuru rw’umugati.

**Ishingiro rya Sisitemu: Ibirenze Gukoresha Electroplating gusa—Urubuga Rusesuye rw'Ibikorwa**

Sisitemu ya Nokota si igikoresho cyo gupfunyika gusa, ahubwo itanga ibisubizo byinshi byagenewe gukemura ibibazo byihariye biri mu mikorere ihanitse yo gupfunyika. Ibiranga tekiniki byayo by'ingenzi birimo:

**Inkunga y'icyuma kinini n'icyuma gikozwe mu buryo bwa Wafer:** Ishyigikira uburyo ibyuma byinshi bishyirwamo—harimo umuringa, icyuma gikozwe mu buryo bwa tin-silver, nickel, zahabu, tin, na palladium—kandi ijyanye na wafer za 150mm, 200mm, na 300mm.

**Guhindura Sisitemu Ihindagurika:** Ifite imiterere yihariye yo gusesengura icyumba kimwe, iva ku miterere gakondo y’icyumba kimwe. Sisitemu ikura mu buryo butajegajega kuva ku bushakashatsi n’iterambere kugeza ku nganda zikora ibikoresho byinshi, kandi ishobora kongera gushyirwaho vuba mu munsi umwe—ibi bikaba bikwiriye ahantu hakorerwa ibikorwa bisaba kwihuta mu guhindura isoko.

**Ibyiza bitatu by'ingenzi**

Dukurikije uko Applied Materials ihagaze, inyungu z'ingenzi za sisitemu ya Nokota zishingiye ku ipiganwa ryibanda ku bice bitatu bikurikira:

**Ubushobozi bwo Kurinda Wafer Butagira Ikigereranyo: SafeSeal™ na HotSwap™**

Mu gupakira, kurinda wafer kwanduzwa n'udukoko ni ingenzi cyane. Sisitemu ya Nokota ikemura iki kibazo gikomeye ikoresheje ikoranabuhanga ribiri rigezweho:

**Ikoranabuhanga rya SafeSeal™:** Ikoranabuhanga ryo kurinda wafer ryabanje gukoreshwa mu nganda, rikora mu buryo bwikora. Mu gukora igenzura ry’ubuziranenge bw’imashini mbere yo kuyitunganya—no kubungabunga uburinzi mu gihe cyose cyo gushyiramo ibyuma bimwe cyangwa byinshi—bituma habaho imikorere ya "gufunga rimwe", bigabanye neza ibyago byo kwangirika bijyana no gufunga kenshi no gufungura.

**Ikoranabuhanga rya HotSwap™:** Yemerera gusimbuza ibice byo gufunga mu buryo bwikora nta kubangamira umusaruro, bityo ikavanaho burundu igihe cyo kudakora kw'ibikoresho biterwa n'ibisabwa mu kubungabunga igipfundikizo.

**Umusaruro uyoboye inganda**

**Ikiguzi n'Uburyo Iboneka:** Uruhurirane rw'ikoranabuhanga rwavuzwe haruguru rutuma sisitemu ya Nokota itanga amasaha 330 y'inyongera yo gukora buri mwaka, mu gihe kimwe bigabanya igipimo cy'ibisigazwa by'ibishishwa bya wafer binyuze mu kongera ubushobozi bwo kurinda wafer.

**Ibyumba Bikora ku Mikorere Minini (VMax™):** Ibyumba Bikora ku Mikorere ya VMax™ bifite uburyo bwo gutwara abantu benshi, bigatuma habaho uburyo bwo hejuru bwo gupfunyika no guhuza neza. Byongeye kandi, buri byumba bikubiyemo uburyo bwo gusukura ahantu runaka kugira ngo bigabanye ubwandu bw'udukoko.

**Ubushobozi bwo Gutunganya Byihuse kandi Bworoshye**

Ibi bigaragaza indi nyungu ikomeye itangwa n'igishushanyo mbonera cya sisitemu. Ntabwo ishyigikira gusa guhinduranya neza hagati y'ingano zitandukanye za wafer zavuzwe haruguru, ahubwo inatuma habaho impinduka zihuse hagati y'uburyo butandukanye bwo gupakira (nk'ubusa, RDL, TSV, nibindi)—ubushobozi buhambaye muri iki gihe bw'ubwoko butandukanye bwo gupakira.

Ibisobanuro by'ingenzi n'ingero z'ikoreshwa

Ibisobanuro bya tekiniki muri make

Ubwoko bw'Ibikoresho: Sisitemu yo Gupfunyikamo Ibikoresho by'amashanyarazi mu buryo bwo hejuru

Ingano za Wafer zishyigikiwe: 150mm, 200mm, 300mm; zishyigikira gutunganya icyarimwe ingano ebyiri zitandukanye muri sisitemu imwe.

Ibyuma bishyigikiwe: Umuringa (Cu), Tin-Feza (SnAg), Nickel (Ni), Zahabu (Au), Palladium (Pd), nibindi.

Imikoreshereze y'Inzira: Gutera Ingufu (Inkingi/Ingufu), Urupapuro rwo Gukwirakwiza (RDL), Gushyiramo Silicone (TSV)

Ibiranga by'ingenzi: Uburinzi bwa SafeSeal™ bwikora, Impeta y'urupapuro rwa HotSwap™ ishyushye, Icyumba cy'imikorere myiza cya VMax™

Kuboneka/Umusaruro: Itanga amasaha arenga 330 yo gukora ku mwaka; itanga ikiguzi gito cyane cyo gutunga inganda

Uturere tw’ingenzi dukoreshwamo

Pakingi igezweho: Pillars/Bumps, Redistribution Layers (RDL), na Through-Silicon Vias (TSV)

Ikoranabuhanga ryo gupakira: Gupakira mu buryo bwa 2.5D/3D, Gupakira mu buryo bwa Fan-Out, Gupakira mu buryo bwa Wafer-Level Chip-Scale Packaging (WLCSP), n'ibindi.

Porogaramu zigezweho: Gutanga ubufasha mu gupakira ibikoresho bya IoT, sensors, sisitemu z'itumanaho za 5G, ibikoresho by'amashanyarazi, n'ibindi.

Ikoranabuhanga Rihambaye: Rigira uruhare runini mu gukora uduce duto tw’amakuru dukoreshwa mu kwibuka ikoranabuhanga rya High Bandwidth (HBM).

Incamake

Sisitemu ya Nokota™ ECD ikemura neza ibyifuzo byihutirwa byo gupakira ibikoresho bigezweho kugira ngo umusaruro ube mwinshi, woroshye kandi utange umusaruro mwinshi. Binyuze mu ikoranabuhanga nka SafeSeal™ na HotSwap™, ikemura ibibazo by’ubwizerwe biri mu nzira gakondo; byongeye kandi, ikoresheje urubuga rwayo rworoshye rwo gukoresha modular, iha abakora chips igisubizo gitanga inyungu ku giciro no ku musaruro mu isoko rigoye kandi rihora rihinduka.