Inkqubo yokusika kunye nefom yophando lwe-ACM ULTRA ECP app-p

I-ACM Research's ULTRA ECP app-p yinkqubo yeplating ethe tyaba ekumgangatho wepaneli, ephawulwa ngexabiso layo eliphambili: ukuzalisa umsantsa wenkqubo ebalulekileyo ekuphuhlisweni kweFan-Out Panel-Level Packaging (FOPLP) kwezoshishino.

Njengenkqubo yokuqala yokubeka ubhedu ethengiswayo, eyenziwe ngobuninzi, eyenzelwe imakethi enkulu, ijolise ekwenzeni kube lula ukutshintsha okungenamthungo kokupakisha okuphucukileyo ukusuka kwinqanaba le-wafer elingama-300mm ukuya kwinqanaba lephaneli elingabizi kakhulu. Isebenzisa ubuchwepheshe bayo bokufaka iplating ethe tyaba obunelungelo lobunikazi, ukufana okugqwesileyo, kunye nolawulo olusebenzayo lweephaneli ezigobileyo, le nkqubo ifezekisa ukusebenza kokucubungula okufana nokweenkqubo ze-wafer ezijikelezayo, ngaloo ndlela ihlangabezana neemfuno zokuvelisa ezingqongqo zezixhobo zesizukulwana esilandelayo ezifana nee-AI GPU kunye nee-HBM ezinoxinano olukhulu.

Oku kulandelayo sisishwankathelo esipheleleyo se-ULTRA ECP app-p, esiqokelelwe ngokusekelwe kulwazi olufumanekayo esidlangalaleni:

**Ukubekwa kwezixhobo**

**Uthotho lweeMveliso:** Imodeli yenqanaba lephaneli (ap-p) ngaphakathi kweqonga le-ULTRA ECP (Electrochemical Plating).

**Ukuqatshelwa kweShishini:** Owamkelweyo yiMbasa ethi "3D InCites Technology Enabling Award" ka-2025.

**Iiteknoloji eziphambili kunye neempawu**

Iimbalasane zobugcisa ze-ULTRA ECP app-p zezi zilandelayo:

**Uyilo lwePlating eQokelelweyo:** Isebenzisa ubuchwepheshe be-ACM obunelungelo lobunikazi be-horizontal plating—obungafaniyo ne-standard plating yendabuko—eqinisekisa ukufana okungaqhelekanga kubukhulu beplating kuyo yonke iphaneli ngokujikeleza okuhambelanayo kwe-chuck kunye nentsimi yombane ejikelezayo. Le ndlela ikwanciphisa ngempumelelo ungcoliseko lweekhemikhali phakathi kwamagumbi enkqubo; ngaphezu koko, uyilo lwegumbi elithe tye lunceda ukugcinwa lula kwamagumbi ngamanye, ngaloo ndlela kuphucula ukusebenza kakuhle kwezixhobo ngokubanzi.

**Izixhobo Zokusebenza Ezichanekileyo:** Inesigqubuthelo esomileyo esitywiniweyo esimacala amane, esiphucula ukuthembeka nokucoceka kokuphathwa kwe-wafer/iiphaneli. Igumbi le-copper plating lixhotyiswe ngee-plating paddles ezikhawulezayo ezenzelwe ngokukodwa ukusetyenziswa kwe-high-bump, okuvumela ukwakheka kwamaqhuqhuva angaphezulu kwe-300 microns ukuphakama.

**Inkxaso yeZinyithi ezininzi kunye noLawulo lokuNgcola okuNciphisanayo:** Inika ukuguquguquka kokucubungula izinto ezahlukeneyo zesinyithi—kuquka ubhedu, i-nickel, i-tin-silver, kunye negolide—ngexesha kusetyenziswa imisebenzi yokucoca kwigumbi ukunciphisa ukungcoliswa okunciphisanayo phakathi kweebhafu ezahlukeneyo zesinyithi.

**Ukuhambelana kunye nokuZenzekela:** Ixhasa zombini izinto eziphilayo kunye nezeglasi. Inkqubo yayo yokuzenzekela yenzelwe ngokukodwa iiphaneli ezinkulu—kuquka imisebenzi ebalulekileyo efana nokujika iiphaneli—ukufikelela kwinqanaba lolawulo lwenkqubo olusebenzayo olufana nemigangatho esekwe ekucutshungulweni kwinqanaba le-wafer. Iinkcukacha ezineenkcukacha

Ngokusekelwe kulwazi olufumanekayo eluntwini, iinkcukacha eziphambili zezi zilandelayo:

Ubungakanani bePaneli: Ixhasa ubungakanani obuqhelekileyo be-510mm x 515mm, kunye nokukwazi ukukhulisa okukhethwayo ukuya kuthi ga kwi-600mm x 600mm.

Ukuhambelana kweNkqubo: Ixhasa amanyathelo okufaka i-electroplating kwiinkqubo ezahlukeneyo, kubandakanya ukwakheka kwePillar, iBump, kunye neRedistribution Layer (RDL).

Uqwalaselo Lomthamo: Ingalungiselelwa ngamagumbi okufaka iipleyiti ukuya kuthi ga kwi-16, encediswa ngamagumbi amabini asele emanzi kunye namagumbi okucoca amabini ukuqinisekisa ukuba iphuma kakuhle.

Ulawulo lweWarpage: Iyakwazi ukucubungula iiphaneli ezinamanqanaba ewarpage afikelela kwi-7mm (malunga ne-10mm), amandla abalulekileyo kwiinkqubo zokupakisha eziphambili.

IiMetriki zoKusebenza:

Ukulingana Kwangaphakathi Kwephaneli (i-WIWU): < 5% ((ubuninzi-min)/2Ave.)

Ukulingana Ngaphakathi Kwesiphelo (i-WIDU): < 5% ((ubuninzi-min)/2Ave.)

Ukuphinda-phinda: < 3%

Iindawo eziphambili zokusetyenziswa

Ngokuyintloko ijolise kwizicelo eziphambili zokupakisha ze-semiconductor, kuquka kodwa kungaphelelanga apho:

Ukupakisha iFan-Out Panel-Level Package (FOPLP)

Ukwenziwa kwePillar kunye neBump, kunye nokwakheka kweRedistribution Layer (RDL)

Ukuzaliswa kwe-Through-Silicon Via (TSV) kunye ne-Through-Glass Via (TGV)

Iimveliso ze-High-Density Fan-Out (HDFO)

Isikhundla seMarike kunye noKhuphiswano

I-ULTRA ECP app-p ibambe isikhundla esiphambili kwimarike esakhasayo yokufakelwa kwe-electroplating kwinqanaba lephaneli. Abakhuphisana nayo abaphambili ngabavelisi bezixhobo ze-semiconductor abaphambili bamazwe ngamazwe—njenge-Applied Materials kunye ne-Lam Research—abakwaphuhlisa izisombululo ze-electroplating zenqanaba lephaneli (i-PLP). Inzuzo ephambili ye-ACM ikwimeko yayo njengovulindlela, ekubeni ibe yeyokuqala ukunikezela ngempumelelo izixhobo zorhwebo kweli candelo.

Isishwankathelo

Ngamafutshane, i-ACM Research's ULTRA ECP app-p imele iqonga lobuchwepheshe elijonge phambili. Ayisebenzi nje kuphela njengesincedisi esibalulekileyo kutshintsho oluphambili lweshishini lokupakisha ukusuka "kwii-wafers ezijikelezileyo" ukuya "kwiiphaneli ezingxande," kodwa ikwabonelela ngezisombululo ezintsha zokuphucula ukusebenza kakuhle kwemveliso kunye nokusebenza kakuhle kweendleko zezixhobo ze-semiconductor eziphezulu, ezifana neetships ze-AI.