Kukonza ndi kukonza mawonekedwe a ACM Research ULTRA ECP app-p

Pulogalamu ya ACM Research ya ULTRA ECP app-p ndi njira yatsopano yopangira ma plating yopingasa pamlingo wa panel, yodziwika ndi kufunika kwake kwakukulu: kudzaza kusiyana kofunikira pakukweza mafakitale a Fan-Out Panel-Level Packaging (FOPLP).

Monga njira yoyamba yogulitsira mkuwa yopangidwa mochuluka yomwe idapangidwira msika waukulu, cholinga chake ndikuthandizira kusintha kosalekeza kwa ma CD apamwamba kuchokera pa mulingo wa 300mm wafer kupita pa mulingo wa panel wotsika mtengo. Pogwiritsa ntchito ukadaulo wake wopangidwa ndi patent wopingasa, kufanana kwapadera, komanso kuyang'anira bwino mapanelo opindika, dongosololi limakwaniritsa magwiridwe antchito ofanana ndi a njira zozungulira za wafer, potero likukwaniritsa zofunikira kwambiri zopangira zida zam'badwo wotsatira monga ma AI GPU ndi ma HBM okwera kwambiri.

Izi ndi chidule chathunthu cha pulogalamu ya ULTRA ECP, yokonzedwa kutengera zomwe zikupezeka pagulu:

**Kuyika Zida**

**Mndandanda wa Zogulitsa:** Chitsanzo cha gulu (ap-p) mkati mwa nsanja ya ULTRA ECP (Electrochemical Plating).

**Kuzindikiridwa kwa Makampani:** Wolandira Mphotho ya 2025 ya "3D InCites Technology Enabling Award."

**Ukadaulo Wapakati ndi Zinthu Zake**

Mfundo zazikulu zaukadaulo za ULTRA ECP app-p ndi izi:

**Kapangidwe ka Ma Plating Opingasa:** Imagwiritsa ntchito ukadaulo wa ACM wopangidwa ndi patent wopingasa—wosiyana ndi ma plating achikhalidwe—omwe amatsimikizira kufanana kwapadera mu makulidwe a plating kudutsa gulu lonse kudzera mu kuzungulira kogwirizana kwa chuck ndi gawo lamagetsi lozungulira la rectangular. Njirayi imachepetsanso bwino kuipitsidwa kwa mankhwala pakati pa zipinda zogwirira ntchito; komanso, kapangidwe ka chipinda chopingasa kamathandizira kukonza mosavuta zipinda zosiyanasiyana, motero kumawonjezera magwiridwe antchito a zida zonse.

**Zipangizo Zokonzedwa Bwino:** Zili ndi chuck yotsekedwa mbali zinayi youma, yomwe imawonjezera kudalirika ndi ukhondo wa wafer/panelo. Chipinda chopangira ma plating cha mkuwa chili ndi ma plating paddles othamanga kwambiri omwe amapangidwira makamaka kuti agwiritsidwe ntchito pa ma flamp okwera, zomwe zimathandiza kupanga ma bumps opitilira 300 microns kutalika.

**Kuthandizira Zitsulo Zambiri ndi Kuletsa Kuipitsidwa:** Kumapereka kusinthasintha kokonza zinthu zosiyanasiyana zachitsulo—kuphatikizapo mkuwa, nickel, tin-silver, ndi golide—pogwiritsa ntchito ntchito zotsukira m'chipinda kuti muchepetse kuipitsidwa pakati pa mabafa osiyanasiyana achitsulo.

**Kugwirizana ndi Kudzipangira Wekha:** Imathandizira zinthu zachilengedwe komanso zagalasi. Dongosolo lake lodzipangira wekha limakonzedwa bwino kwambiri kuti ligwiritsidwe ntchito pa mapanelo akuluakulu—kuphatikizapo ntchito zofunika monga kutembenuza mapanelo—kuti likwaniritse bwino njira zowongolera zomwe zimafanana ndi miyezo yokhazikitsidwa mu kukonza kwa wafer-level. Zambiri Zofunikira

Kutengera ndi zomwe zikupezeka pagulu, mfundo zazikulu ndi izi:

Kukula kwa Panel: Imathandizira kukula kokhazikika kwa 510mm x 515mm, yokhala ndi kuthekera kowonjezera mpaka 600mm x 600mm.

Kugwirizana kwa Njira: Kumathandizira masitepe a electroplating mkati mwa njira zosiyanasiyana, kuphatikizapo Pillar, Bump, ndi Redistribution Layer (RDL) mapangidwe.

Kukhazikitsa Mphamvu: Kungathe kukonzedwa ndi zipinda zolumikizira mpaka 16, zomwe zimathandizidwa ndi zipinda ziwiri zonyowa kale ndi zipinda ziwiri zoyeretsera kuti zitsimikizire kuti zikugwira ntchito bwino.

Kuwongolera Ma Warpage: Kutha kukonza bwino mapanelo okhala ndi milingo ya ma warpage mpaka 7mm (pafupifupi 10mm), kuthekera kofunikira kwambiri pakukonza zinthu zapamwamba.

Ziwerengero za Magwiridwe Antchito:

Kufanana kwa Magulu (WIWU): < 5% ((mphindi yochulukirapo)/2Ave.)

Uniformity ya mkati mwa Die (WIDU): < 5% ((mphindi yochulukirapo)/2Ave.)

Kubwerezabwereza: < 3%

Madera Ofunika Kwambiri Ogwiritsira Ntchito

Makamaka cholinga chake ndi mapulogalamu apamwamba opangira ma semiconductor, kuphatikizapo koma osati kokha:

Kupaka Mapaipi Ochokera Pa Fan-Out (FOPLP)

Kupanga Pillar ndi Bump, komanso kupanga Redistribution Layer (RDL)

Kudzaza kwa Through-Silicon Via (TSV) ndi Through-Glass Via (TGV)

Zogulitsa za High-Density Fan-Out (HDFO)

Udindo wa Msika ndi Mpikisano

Pulogalamu ya ULTRA ECP ili ndi udindo waukulu pamsika watsopano wa ma electroplating a pamlingo wa panel. Opikisana nawo akuluakulu ndi opanga zida za semiconductor padziko lonse lapansi—monga Applied Materials ndi Lam Research—omwe akupanganso mayankho a electroplating a panel-level (PLP). Ubwino waukulu wa ACM uli m'malo ake monga woyambitsa, popeza wakhala woyamba kupereka bwino zida zamalonda m'munda uno.

Chidule

Mwachidule, pulogalamu ya ULTRA ECP ya ACM Research ikuyimira nsanja yaukadaulo yoyang'ana patsogolo. Sikuti imangothandiza kwambiri pakusintha kwakukulu kwa makampani opanga ma CD kuchokera ku "ma wafer ozungulira" kupita ku "ma panel ozungulira," komanso imapereka njira zatsopano zowonjezerera kupanga bwino komanso kugwiritsa ntchito bwino ndalama za zida zapamwamba za semiconductor, monga ma chips a AI.