ACM Enkola y’okunoonyereza ku kusala n’okukola ULTRA ECP ap-p

ACM Research’s ULTRA ECP ap-p nkola ya groundbreaking panel-level horizontal plating system, eyawulwamu olw’omuwendo gwayo omukulu: okujjuza ekituli ekikulu mu nkola mu kukola amakolero ga Fan-Out Panel-Level Packaging (FOPLP).

Nga enkola esooka ey’okutunda, ekolebwa mu bungi ey’okutereka ekikomo eyategekebwa ku katale k’ebipande ebinene, egenderera okwanguyiza enkyukakyuka etaliimu buzibu ku kupakinga okw’omulembe okuva ku ddaala lya wafer eya mm 300 okudda ku ddaala lya panel eritali lya ssente nnyingi. Nga ekozesa tekinologiya waayo ow’ekika kya patented horizontal plating, obutafaanagana obw’enjawulo, n’okuddukanya obulungi ebipande ebikyusiddwa, enkola eno etuuka ku mutindo gw’okulongoosa ogugeraageranyizibwa ku ogw’enkola za wafer ez’enkulungo, bwe kityo n’etuukiriza ebyetaago ebikakali eby’okukola eby’ebyuma eby’omulembe oguddako nga AI GPUs ne high-density HBMs.

Wammanga bye bimu ku bikwata ku ULTRA ECP ap-p, ebikung’aanyiziddwa okusinziira ku mawulire agasangibwa mu lujjudde:

**Okuteeka ebyuma mu kifo**

**Product Series:** Omuze ogw’omutindo gwa panel (ap-p) munda mu ULTRA ECP (Electrochemical Plating) platform.

**Okusiimibwa mu Makolero:** Yafuna engule ya 2025 eya "3D InCites Technology Enabling Award."

**Tekinologiya Omukulu n'Ebirimu**

Ebikulu mu by’ekikugu mu ULTRA ECP ap-p bye bino wammanga:

**Horizontal Plating Design:** Ekozesa tekinologiya wa ACM ow’okusiiga mu bbanga (horizontal Plating technology) —okuva ku kusiiga okw’ennono okw’okwesimbye-okukakasa obumu obw’enjawulo mu buwanvu bw’okusiiga okubuna ekipande kyonna okuyita mu kuzimbulukuka okukwatagana okwa chuck n’ekifo ky’amasannyalaze eky’enjuyi ennya ezikyukakyuka. Enkola eno era ekendeeza bulungi ku bucaafu bw’eddagala wakati w’ebisenge by’enkola; n’ekirala, dizayini y’ekisenge ekiwanvu (horizontal chamber design) kyanguyiza okuddaabiriza ebisenge ssekinnoomu mu ngeri ennyangu, bwe kityo ne kyongera ku bulungibwansi bw’ebyuma okutwalira awamu.

**Optimized Precision Hardware:** Eriko chuck ey’enjuyi nnya essiddwako ssimu ng’ekwatagana enkalu, eyongera okwesigika n’obuyonjo bw’okukwata wafer/panel. Ekisenge ky’okusiiga ekikomo kirimu ebiwujjo eby’okusiiga eby’amaanyi ebikoleddwa mu ngeri ey’enjawulo okukozesebwa mu bikonde ebinene, ekisobozesa okukola ebikonde ebisukka mu microns 300 mu buwanvu.

**Obuwagizi bw’ebyuma ebingi n’okufuga obucaafu obw’omusalaba:** Ewa obusobozi okulongoosa ebintu eby’enjawulo eby’ebyuma-omuli ekikomo, nikele, bbaati-ffeeza, ne zaabu-nga ekozesa emirimu gy’okwoza mu kisenge okukendeeza ku bucaafu obusalasala wakati w’ebinabiro eby’enjawulo eby’okusiiga ebyuma.

**Okukwatagana ne Automation:** Ewagira byombi organic ne glass substrates. Enkola yaayo ey’okukola mu ngeri ey’obwengula erongooseddwa nnyo ku bipande ebinene-nga mw’otwalidde n’emirimu emikulu nga okukyusakyusa ebipande —okutuuka ku ddaala ly’okufuga enkola okulungi okugeraageranyizibwa ku mutindo ogwateekebwawo mu kukola ku ddaala lya wafer. Ebikwata ku nsonga eno mu bujjuvu

Okusinziira ku mawulire agasangibwa mu lujjudde, ebikulu ebikwata ku nsonga eno bye bino wammanga:

Panel Size: Ewagira sayizi eya bulijjo eya mm 510 x mm 515, ng’esobola okugaziya okutuuka ku mm 600 x mm 600.

Okukwatagana kw’enkola: Kuwagira emitendera gy’okusiiga amasannyalaze mu nkola ez’enjawulo, omuli okutondebwa kwa Pillar, Bump, ne Redistribution Layer (RDL).

Ensengeka y’obusobozi: Esengekebwa n’ebisenge ebikuba ebipande ebituuka ku 16, nga bijjuzibwa ebisenge 2 ebifukiddwa nga tebinnaba kutonnya n’ebisenge 2 eby’okwoza okukakasa nti biyita bulungi.

Okuddukanya Warpage: Esobola okukola obulungi panels ezirina warpage levels ezituuka ku 7mm (nga 10mm), obusobozi obukulu ennyo mu nkola z’okupakinga ez’omulembe.

Ebipimo by’emirimu:

Okufaanagana munda mu kipande (WIWU): < 5% ((max-min)/2Ave.)

Munda-Die Uniformity (WIDU): < 5% ((max-eddakiika)/2Ave.)

Okuddiŋŋana: < 3%

Ebitundu Ebikulu eby’Okusaba

Okusinga etunuulidde enkola ez’omulembe ez’okupakinga semikondokita, omuli naye nga tekikoma ku:

Fan-Out Panel-Level Okupakinga (FOPLP) .

Okukola Empagi ne Bump, wamu n’okukola Redistribution Layer (RDL).

Okujjuza okuyita mu Silicon Via (TSV) ne Through-Glass Via (TGV).

Ebintu ebikolebwa mu ngeri ya High-Density Fan-Out (HDFO).

Embeera y’akatale n’okuvuganya

ULTRA ECP ap-p erina ekifo ekinene eky’okukulembera mu katale akakyakula mu kukola ebyuma ebikuba amasannyalaze ku ddaala lya panel. Abavuganya nayo abakulu be banene mu nsi yonna abakola ebyuma bya semikondokita —nga Applied Materials ne Lam Research —nga nabo bakola eby’okupakinga ku ddaala lya panel (PLP) electroplating solutions. Enkizo enkulu ya ACM eri mu kifo kyayo nga payoniya, nga ye yasoose okutuusa obulungi ebyuma eby’ettunzi mu mulimu guno.

Okubumbako

Mu bufunze, ACM Research’s ULTRA ECP ap-p ekiikirira omukutu gwa tekinologiya ogutunudde mu maaso. Tekola nga ekintu ekikulu ekisobozesa mu mulimu gw'okupakinga eby'omulembe mu nkyukakyuka enkulu okuva ku "round wafers" okudda ku "rectangular panels," naye era kiwa eby'okugonjoola ebiyiiya okutumbula obulungi okufulumya n'okukendeeza ku nsimbi z'ebyuma eby'omulembe ebya semiconductor, nga AI chips.