Enkola ya ASMPT eya SD8312 fully automatic soft solder die bonder system kyuma kya mulembe ekyakolebwa okukola wafer ya yinsi 12, nga erina obusobozi bw’okukola lead frame mu density enkulu n’okukulembera sipiidi y’okusiba die. Enkola eno esaanira semicon y’amaanyi
SD8312 mu bujjuvu otomatiki soft tin ASM die bonder enkola
Ebintu eby'enjawulo
●Omulembe omupya SD8312 series guteekawo omutindo omupya ku 12” soft tin die bonder
●Universal worktable design, esobola okukwata high-density lead frames
●High-speed die bonder nga egatta tekinologiya ow'omulembe omuyiiya ne tekinologiya ow'enkola akuze
●Okufuga obulungi emiwendo gya oxygen mu kiseera ky'okukwatagana (die bonding).
●Obusobozi bw'okukola wafer za AB
Leverage Geekvalue 's obukugu n'obumanyirivu okusitula brand yo ku ddaala eddala.
Tuukirira omukugu mu by’okutunda
Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.
© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS
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