Semiconductor equipment
Fully automatic ASMPT soft tin die bonding machine system

Ukuzenzekela ngokupheleleyo inkqubo yomatshini wokudibanisa itoti ethambileyo ye-ASMPT

I-SD8312 ye-SD8312 ye-SD8312 ye-solder ethambileyo ezenzekelayo ezenzekelayo sisixhobo esiphambili esenzelwe ukusetyenzwa kwe-wafer ye-intshi eyi-12, enobuchule obuphezulu bokwenza isakhelo kunye nesantya esihamba phambili sokubopha. Inkqubo ifanelekile kwi-semicon yamandla

Ilizwe:Isetyenzisiwe Ikhona: yiba Iwaranti: ubonelelo
Iinkcukacha

Intshayelelo eneenkcukacha:

SD8312 oluzenzekelayo oluthambileyo inkqubo ASM die bonder inkqubo

Iimpawu

● Isizukulwana esitsha se-SD8312 siseta umgangatho omtsha we-12” ye-tin die bonder ethambileyo

● Uyilo olusebenzayo jikelele, olukwazi ukuphatha iifreyimu zelothe eziphezulu

● I-High-speed die bonder edibanisa ubuchule obutsha obuphezulu kunye neteknoloji yenkqubo evuthiweyo

● Ulawulo oluchanekileyo lwamanqanaba e-oksijini ngexesha lokudibanisa i-die

● Ubuchule bokwenza iwafer ye-AB

SD8312

Ngaba ukulungele ukonyusa ishishini lakho ngeGeekvalue?

Yandisa ubuchule kunye namava eGeekvalue ukunyusa uphawu lwakho luye kwinqanaba elilandelayo.

Qhagamshelana nengcali yokuthengisa

Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.

Isicelo sokuthengisa

Silandele

Hlala uqhagamshelene nathi ukuze ufumane izinto ezintsha zamva nje, izibonelelo ezikhethekileyo, kunye nokuqonda okuya kuphakamisa ishishini lakho ukuya kwinqanaba elilandelayo.

kfweixin

Skena ukongeza i-WeChat

Cela iQuote