Towa molding machine CPM1180

The core positioning of the Towa CPM1180 is crystal clear: it is a compression molding system engineered specifically for the mass production of large-format Panel-Level Packages (PLP). Its primary design objective is to resolve a critical industry challenge within the advanced packaging sector: "how to package large-format substrates effectively and cost-efficiently."

**CPM1180: Technical Principles and Structure**

At the heart of the CPM1180 lies Compression Molding technology—a process fundamentally distinct from the Injection Molding process utilized in the previously discussed Y-series:

**Compression Molding:** In this process, liquid or granular resin is first deposited into a mold cavity; the chips or substrate are then immersed into the resin, pressed down, and cured. This process demonstrates particularly pronounced advantages as package dimensions increase, effectively safeguarding delicate gold wires and ensuring void-free encapsulation.

**Key Structural Design:** The system employs a patented "Cavity Down" structure. Simply put, this design positions the mold cavity (the molding surface) facing downward during the encapsulation process. This configuration effectively leverages gravity to assist the top-down flow of the resin, thereby ensuring exceptional uniformity in resin distribution across large-format substrates—a core technological innovation essential for achieving high-quality molding results.

**CPM1180: Key Functional Highlights**

The value proposition of the CPM1180 is best demonstrated through several key features, particularly its groundbreaking capabilities regarding panel dimensions and processing throughput.

**Ultra-Large-Format Packaging Capability (Core Advantage):** This constitutes the CPM1180's most prominent highlight. The system supports automated substrate processing up to a maximum size of 625mm x 620mm. This capability not only significantly surpasses the 320mm x 320mm specifications of its predecessor, the CPM1080, but also enables the molding of 18-inch (450mm) wafers. Furthermore, in manual or semi-automated modes, the system can accommodate even larger substrates, reaching dimensions of up to 660mm x 620mm. By encapsulating a larger substrate area in a single cycle—thereby increasing the number of chips produced per unit of time—the system achieves a significant reduction in the cost per individual chip.

**High-Precision, High-Quality Packaging:** Through the synergistic combination of the "Cavity Down" structure and a uniform granular resin dispensing mechanism, the system achieves substantial improvements in both molding quality and process stability.

**Modular Design:** The system features a modular architecture that allows for flexible capacity adjustments by adding or removing modules, thereby offering enhanced configuration flexibility to meet diverse production requirements. Low Material Loss and Clean Production: The equipment utilizes pre-cut separation films; compared to previous products, this design saves approximately 25% on consumable materials per molding cycle and enables near-zero waste generation during the molding process, making it highly environmentally friendly.

Core Specifications for CPM1180 Series Models

As a mature product platform, the CPM1180 offers various configurations designed to meet a wide range of requirements—from R&D and prototyping to large-scale mass production. I have compiled the core capabilities of each model into the following table to facilitate quick comparisons:

Equipment Model | Operating Mode | Key Features | Max. Substrate Size | Typical Application Scenarios

CPM1180

(Fully Automatic) | Fully Automatic | Automated molding for ultra-large substrates, "Cavity Down" structure, automated resin supply | 625mm x 620mm | Large-scale mass production for Panel-Level Packaging (PLP)

CPM1180

(Semi-Automatic) | Semi-Automatic | Molding for ultra-large substrates, revolutionary cost reduction, automated resin supply, manual substrate loading | 660mm x 620mm | Batch production of large-format panels, balancing cost-efficiency with operational flexibility

CPM1180

(Manual) | Manual | Dual-purpose (wafer/large panel) capability, exceptional cost-effectiveness, high-mix/low-volume production, manual loading for both substrates and wafers | 625mm x 620mm (Panel) /

φ450mm (Wafer) | Molding for 18-inch wafers, R&D prototyping, small-batch production

Note: The "Max. Substrate Size" listed in the table represents official specifications. Data discrepancies may exist between certain models due to differences in specific processes or measurement standards; therefore, final specifications should be confirmed through direct consultation.

Application Scenarios and Unique Advantages

The CPM1180 was developed specifically to address critical industry pain points, and its value is most vividly demonstrated within specific application scenarios:

Targeting Next-Generation Packaging: This equipment is designed for adoption by panel substrate manufacturers, with its core advantage lying in its ability to help the industry "advance packaging technology while simultaneously reducing costs."

Directly Addressing Warpage Challenges: During large-area packaging processes, substrates—such as large-format carriers for FOWLP (Fan-Out Wafer-Level Packaging) or PLP—are prone to warpage. Manual loading is an arduous task; however, the fully automated CPM1180 model achieves stable, automated material handling through a proprietary high-speed, high-rigidity robotic system—a capability that serves as the key to resolving critical bottlenecks in mass production.

Yield is the lifeline: as the packaging area expands, the complexity of yield management rises exponentially. The "Cavity Down" structure ensures uniform resin filling across large substrates, thereby preventing fatal defects such as voids; meanwhile, the modular design guarantees equipment reliability during prolonged periods of high-intensity operation.

Forward-Looking Positioning: From CPM1080 to CPM1180

From a product series perspective, the CPM1180 can be viewed as a "large-format variant" of the CPM1080, shouldering the critical mission of enabling the mass production of Panel-Level Packages (PLP) in the 625mm x 620mm class. Complementing this, the CPM series also features the "CPM1080-HP" at the high-end—a model engineered specifically to address the demands of cutting-edge heterogeneous integration packaging technologies, such as HBM, 2.5D, 3D, and Chiplets.

Consequently, for Towa, the strategic positioning of the CPM1180 differs distinctly from that of the CPM1080-HP: the latter is dedicated to overcoming the precision-related technical hurdles associated with frontier technologies like Chiplets, whereas the CPM1180 focuses squarely on enabling large-scale, cost-effective manufacturing within the PLP domain.

Summary

In conclusion, the Towa CPM1180 is a compression molding system custom-tailored for the scaled mass production of large-format Panel-Level Packages (PLP). Through three core technological pillars—ultra-large substrate packaging capability, the Cavity Down structure, and uniform granular resin dispensing—it effectively resolves the efficiency, quality, and yield challenges inherent in large-format packaging.