Towa Molding Machine CPM1080

The Towa CPM1080 is a compression molding system for advanced semiconductor packaging, hailed as a new solution for "high precision and high productivity in WLP/PLP molding processes."

Its core technology, "compression molding," fundamentally differs from traditional "transfer molding": Compression molding involves placing liquid or granular resin into a mold, then immersing the chip or substrate in the resin and pressing and curing it.

Advantages: Effectively protects gold wires, fills the bottom, avoids voids, and saves costs.

The CPM1080 is a platform encompassing various levels of automation to adapt to the needs of different customers and production stages. The core models are compared below: CPM1080 Series Equipment Core Specifications and Features

**Equipment Model**

**Core Features**

**Process Capabilities**

**Suitable Applications**

**Automation and Capacity**

**CPM1080-HP (High Precision)**

**Ultra-high precision model suitable for the most advanced packaging such as HBM/2.5D/3D/Chiplet.**

**Handles molding of ultra-thin/ultra-thick products and MUF bottom filling.**

**HBM, 2.5D/3D IC, Chiplet, and other cutting-edge heterogeneous integrated packaging.**

**Exceptional mold flatness and ultra-high vacuum.**

**Modular design allows for flexible addition or removal of modules to adapt to capacity changes.**

CPM1080 Fully Automatic**

**Fully automated production platform suitable for high-quality, low-cost PLP/WLP molding processes.**

**Industry's first equipment compatible with both particulate and liquid resins.**

**Large-scale production scenarios such as FOWLP (Fan-out Wafer-Level Packaging) and PLP (Panel-Level Packaging).**

**Equipped with a self-developed handling robot capable of handling warped or heavy workpieces.**

**Equipped with automatic resin measurement and replenishment functions.**

CPM1080 Fully Automatic** The CPM1080 semi-automatic system offers flexibility for R&D or small-batch production. It's the industry's first machine compatible with both granular and liquid resins. It supports 12-inch (φ300mm) FOWLP/FIWLP and 320mm x 320mm FOPLP/FIPLP. The substrate requires manual operator setup, but resin is automatically supplied.

Core Technologies and Benefits

Regardless of the model chosen, the CPM1080 shares the following core technological advantages:

Advanced compression molding technology: It virtually eliminates wire sweep and internal bubbles, crucial for fine-pitch and high-density interconnects. Compared to traditional transfer molding, it achieves near 100% resin utilization, enabling "zero-waste" production.

Pioneering resin compatibility: It is the industry's first machine to simultaneously process granular (powdered) and liquid resins in the same unit. Manufacturers can freely choose cost-effective or high-performance materials based on product characteristics, providing significant process flexibility.

Precision-Controlled Material Handling: Equipped with TOWA's proprietary handling robot, the equipment can reliably handle substrates/panels with severe warping due to thinning or significant weight, effectively addressing the process challenges of large-size packaging.

Optimized Cost and Film Consumption: Its patented Release Film Precutting System saves approximately 25% on release film usage per molding cycle, significantly reducing operating costs in long-term production.

Key Process Parameters: Capable of handling wafers up to 300mm (12 inches) in diameter and panels up to 320×320mm in size. Supports device packaging with bonding wire lengths up to 110mm.

Summary and Applications: In summary, the Towa CPM1080 is a platform designed for high-precision, cost-effective advanced packaging. Its "HP" model serves as a bridge to next-generation packaging technologies, while the "Fully Automated" model represents a cost-effective option for future large-scale production. This equipment can package not only conventional devices such as ICs, microprocessors, and sensors, but also power semiconductors (such as MOSFETs and IGBTs) and optoelectronic devices (such as LEDs).