The SRM Z208 is a fully automated die-level test handler manufactured by SRM Integration. Rather than handling packaged chips, it is designed to perform quality assurance and testing on bare dies located on semiconductor wafers. By integrating a series of quality assurance tasks into a single system, the Z208 enables a more efficient and precise production process.
Technical Specifications and Parameters
Key technical parameters of the equipment include:
Equipment Type: Die-level test handler
Maximum Throughput (UPH): Up to 36,000 units/hour
Mean Time Between Failures (MTBF): > 200 hours
Mean Time Between Assists (MTBA): > 60 minutes
Compatible Package Types: QFN, MLP, SOIC, SOT23, SC70, SOT89, SOT223
Supported Die Sizes: 1.4x1.4 (TDFN), 2x2 (QFN), 2.5x3.2 (QFN), etc.
Feeding Method: Vibratory bowl or tube
Output Method: Tape & Reel
Air Supply Requirements: Minimum 5 Bar (70 PSI); flow rate 300–500 L/min
Power Requirements: 208/415 VAC, three-phase
Manufacturing Year: Units typically date from 2013 or 2015
Operating Principle
The SRM Z208 performs testing through the precise coordination of hardware and software:
Vision Positioning: High-resolution cameras capture images of the wafer placed on the work platform.
Precision Measurement: Based on image data, robotic arms utilize specialized inspection components—such as probes and blades—to conduct precise inspections and measurements of the wafer.
Data Analysis: An onboard computer analyzes the measurement data to determine if the wafer meets quality standards.
Defect Detection: The equipment detects minute surface defects on the wafer, such as pits or irregularities.
The entire process is controlled through the coordination of two types of software: quality assurance software (for defect detection) and automation software (for controlling robotic arm tasks). Key Features and Advantages
High Precision and Speed: Achieves a throughput of up to 36,000 units per hour (UPH), ensuring high productivity while maintaining inspection quality through high-resolution cameras and precision calibration tools.
Fully Automated and Intelligent: Integrates vision, measurement, analysis, and sorting into a fully automated workflow, minimizing manual intervention and human error.
Powerful Control Core: Equipped with an 8-axis motion controller and supporting EtherCAT integration, enabling efficient control of the entire production line.
Flexibility and Adaptability: Features a flexible design capable of accommodating future upgrades or modifications.
Support for Multiple Packages: Capable of handling various package types, including QFN, MLP, SOIC, and SOT23.
Versatile Input/Output Options: Supports vibratory bowl or tube feeding, as well as tape-and-reel output.
Application Scenarios
The SRM Z208 primarily serves the semiconductor front-end process, delivering core value in wafer-level testing and yield management:
Wafer Manufacturing: Tests every die on the wafer prior to dicing and packaging, enabling the early screening of defective chips.
Quality Assurance: Serves as a critical quality control step in the production process, ensuring that only qualified dies proceed to the subsequent, costly packaging stages.
R&D and Validation: Suitable for wafer-level characterization and validation of new products.
Summary
In summary, the SRM Z208 is a high-speed, fully automated chip-level sorter designed specifically for semiconductor wafer-level testing. By performing precision inspection on dies prior to packaging, it serves as a vital tool for ensuring chip yield and controlling production costs. Its impressive throughput of 36,000 UPH and broad compatibility with various package types make it a powerful asset in the wafer testing process.
