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The core function of the vision system in the ASM MS90 sorter is to guide high-precision motion, enable precise positioning, and perform comprehensive quality inspection, ultimately ensuring the effic...
In the ASM MS90 sorting machine, the swing arm is the core actuator that enables rapid and precise chip picking and placing.
Aluminum wire machine fixture is a key component used in ASMPT automatic wire bonding machine and die bonding machine. It is mainly used to fix and position aluminum wire to ensure the stability and a...
ASMPT wire bonder spark rod is mainly used in the LED production process to achieve the welding of gold wire, copper wire, alloy wire and other media through high voltage discharge. The spark rod is ...
The IKO CRWG3-50 is a crucial mechanical component—a crossed roller guide—in the high-precision motion system of the ASM MS90 sorting machine.
Asmpt ball bonder splitter plays an important role in the field of microelectronic packaging and is mainly used for cutting transistor wafers in ball bonder machines.
The hardness of gold bonding wire can be adjusted by doping with different elements, such as silver, palladium, magnesium, iron, copper, silicon, etc., thereby changing its hardness, rigidity, ductili...
Characteristics of silver wireCheap: The price of silver wire is about one-fifth that of gold wire, which gives it a significant cost advantage.Good conductivity: Silver wire has excellent conduc...
Copper wire is a common conductor material, widely used in wires, cables, brushes and other fields, and is favored for its good conductivity and processing performance.
The die bonder motherboard is the core control unit of the die bonder, responsible for the operation and coordination of the entire device. Its main functions include:Control various actions of the d...
It is an important accessory for ASM wire bonding machine, mainly used to connect the wire bonding machine and the welding wire to ensure the stability and efficiency of the welding process
The core function of the asmpt Sunbird turret-style sorter is to classify packaged chips based on test results, directing those that pass into one channel and those that fail into another.
The core pick-and-place module of the sorter is responsible for chip transfer
The main function of the control card is to receive instructions from the host computer, plan multi-axis movements (such as the XYZ axes of the turret and nozzle), and generate signals to precisely drive the machine operation
Precisely and gently pick up the chips, transfer them to the test station, and subsequently sort and place them into designated locations based on the test results
BESI die bonders are positioned in the global mid-to-high-end market, and with their leading flip-chip and hybrid bonding technologies, they hold a dominant position in the field of high-precision advanced packaging
BESI die bonders are positioned in the global mid-to-high-end market, and their products are widely used in AI chips and high-performance computing, which is the core driving force for their rapid growth
Our clients are all from large publicly listed companies.
SMT Technical Articles
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Semiconductor accessories FAQ
MORE+Learn how to inspect used ASM SIPLACE 2x8 and 3x8 feeders before shipment. Review tape paths, lanes, latches, cover tape, tests and FAT evidence.
Fuji smt mounter is an efficient and accurate surface mount device that is widely used in the electr
Why do regular maintenance on Fuji smt mounters? In fact, many people ignore this point. In the mode
In the electronics manufacturing industry, SMT (Surface Mount Technology) equipment is an essential
Even the most advanced equipment requires regular maintenance and care to ensure long-term stable op
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