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The hardness of gold bonding wire can be adjusted by doping with different elements, such as silver, palladium, magnesium, iron, copper, silicon, etc., thereby changing its hardness, rigidity, ductility and conductivity.
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Specifications
Diameter: The diameter of gold bonding wire is usually between 0.02 and 0.05 mm, and the diameter of ultra-fine gold alloy bonding wire has reached 0.015 mm.
Composition: The main component of gold bonding wire is gold, with a purity of 99.999%, and may be doped with silver, palladium, magnesium, iron, copper, silicon and other elements.
Application: Gold bonding wire is widely used in semiconductor packaging technology for bonding chip interfaces and substrate interfaces.
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