Isixhobo sokugaya i-DISCO wafer DGP8761

I-DISCO DGP8761 ngumatshini wokugaya/wokupolisha ozenzekelayo omele eyona nto iphambili kubuchwepheshe bayo, eyenzelwe ngokukodwa iinkqubo zokunciphisa iiwafer eziyi-12-intshi (300mm) ezisebenzayo kakhulu. Uphawu lwayo oluphambili kukukwazi kwayo ukugqiba yonke inkqubo—ukusuka ekugayeni okurhabaxa ngasemva kunye nokugaya okucolekileyo ukuya ekususeni uxinzelelo—ngokusebenza okukodwa, okuqhubekayo, ukucubungula iiwafer rhoqo ukuya kubukhulu obuncinci kakhulu obungaphantsi kwe-25μm.

Njengoko iphuculwa ngokusesikweni ukuya kwi-DGP8760 eyaziwayo nethengiswa kakhulu, iyazingca ngokusebenza kwayo okugqwesileyo phakathi kwabavelisi abaphambili kwihlabathi liphela kwaye sisixhobo esibalulekileyo sokupakisha okuphucukileyo, izixhobo zamandla, kunye nezinye iinkqubo ezifuna ukwenziwa kwe-wafer encinci kakhulu.

I-Hardware Core: Ubuchule kunye noTshintsho loYilo lwe-Three-Axis

Eyona nto iphambili ekuguqukeni kokusebenza kwe-DGP8761 ikuyilo lwayo oluchanekileyo lwe-three-axis (3 axes) kunye ne-four-chuck-tables (4 chuck tables).

Icandelo leMisebenzi elinee-Axis ezintathu:

I-Z1 Axis (Ukusila Okurhabaxa): Inoxanduva lokususa ngokukhawuleza uninzi lwezinto ezikwicala elingasemva le-wafer.

I-Z2 Axis (Ukusila Okucolekileyo): Yenza ukusila okucolekileyo kumphezulu we-wafer, ifezekisa ulawulo oluchanekileyo lobukhulu.

I-Z3 Axis (Ukucubungula ngeendlela ezahlukeneyo): Oku kubalulekile ekuguquguqukeni kwayo. Abasebenzisi banokukhetha ukupolisha okomileyo (ukunciphisa uxinzelelo), ukugaya ngokuchanekileyo kakhulu (i-Poligrind/UltraPoligrind), okanye iimodyuli ezikhethekileyo ze-CMP ukuze kufezekiswe ukususwa koxinzelelo, ukususwa kwe-getter, kunye neminye imisebenzi, kuxhomekeke kwiimfuno zenkqubo.

I-Spindle Esandul’ Ukuphuhliswa: I-spindle entsha ixhasa ukugaywa ngesantya esiphezulu, inciphisa ngokufanelekileyo ixesha lokucubungula ii-wafers ezincinci. Kwangaxeshanye, uyilo oluphuculweyo lokuthuthwa lunciphisa ixesha lokungacutshungulwa, nto leyo ephucula ukusebenza kakuhle kwayo iyonke.

Iinkcukacha zokusebenza okuphezulu kweSpindle:

I-Z1/Z2 Axis: Amandla e-spindle anyuswe ukuya kwi-6.3 kW, isantya yi-1,000 - 4,000 min⁻¹, uhambo lwe-Z-axis yi-120 mm.

I-Z3 Axis: Amandla e-spindle yi-5.3 kW, uhambo lwe-Z-axis yi-65 mm.

Ukuchaneka kwe-Z-Axis: Izinga lokutya elithe nkqo le-0.0001 - 0.08 mm/s, ubuncinane ukuhamba kwe-0.1 μm kuqinisekisa ukuchaneka komatshini.

Isishwankathelo seenkcukacha ezineenkcukacha

Udidi lweParamitha | Izalathisi ezithile

Ubungakanani boMsebenzi oSebenzayo: Φ200 mm / Φ300 mm (8 intshi / 12 intshi)

Indlela Yokugaya: I-Z1/Z2 Axis: Ukugaya ngaphakathi kokutya (ukujikeleza kwewafer)

I-Z3 Axis: Ukugaya okungaqhelekanga ngaphakathi kokutya (ukujikeleza okukhethekileyo kwe-wafer)

Uqwalaselo lweSpindle: Iispindle ezintathu (ii-axes ezi-3)

Uqwalaselo lweTheyibhile yokusebenzela: Iitafile ezine ze-chuck (iitafile ezine ze-chuck), kusetyenziswa inkqubo yetafile ejikelezayo

Izixhobo Zokugaya/Ukupolisha: I-Z1/Z2 Axis: Ivili lokugaya ledayimani le-Φ300 mm

I-Z3 Axis (DP): Iphedi yokupolisha eyomileyo ye-Φ450 mm

I-Z3 Axis (CMP): Iphedi yokupholisha ye-Φ450 mm CMP

Ubukhulu bezixhobo: 1,690 mm (W) × 3,315 mm (D) × 1,800 mm (H)

Imodeli efakwe kwi-FOUP: × 3,452 mm (D)

Ubunzima beZixhobo: Malunga ne-6,700 kg (DP, uqwalaselo lwePoligrind)

Malunga ne-6,900 kg (uqwalaselo lwe-CMP)

Iimfuno zamandla: Isigaba sesithathu 200/220/380/400 V, 50/60 Hz

Umoya ocinezelweyo: Ngaphezulu kwe-0.5 MPa, icocekile kwaye ayinayo ioyile, inqanaba lombethe lingaphantsi kwe -15℃

Imisebenzi Engundoqo kunye neeNzuzo zeNkqubo:

Ukhuphiswano oluphambili lwe-DGP8761 lulele ekuhlanganisweni kwayo ngempumelelo kweenkqubo ezininzi, nto leyo efezekisa isiphumo "esi-1+1>2".

Isisombululo Esipheleleyo: Ngengalo yangaphakathi yerobhothi, i-wafer ingagqibezela ngokuzenzekelayo yonke inkqubo yokusila rough → ukusila kakuhle → ukupolisha okomileyo → ukucoca nokomisa, iphephe umngcipheko wokuqhekeka okubangelwa kukuphathwa okuninzi kwaye inciphise kakhulu umjikelo wemveliso. I-DGP8761 inokufikelela rhoqo kwi-total thickness variation (TTV) engaphantsi kwe-3μm ngelixa igcina amandla aphezulu okugoba.

Ukupholisha Omileyo kunye nokuChola okuKhanyayo (Ukufumana): Le yenye yezona zinto zidumileyo ze-DGP8761. Isebenzisa i-Z3-axis dry polishing ukususa umaleko woxinzelelo lokusila, ongapheleli nje ekubeni luncedo kokusingqongileyo kuneenkqubo zemveli zokumanzi (akukho khemikhali okanye manzi asetyenziswayo), kodwa ikwadala umaleko womonakalo omncinci olawulekayo ngaphakathi kwe-wafer, osebenza njenge "getter zone" yokubamba ukungcola kwesinyithi, ukuphucula isivuno kunye nokuthembeka kwe-chip. Itekhnoloji eyahlukileyo ye-DISCO ye-UltraPoligrind micro-abrasive igcina isiphumo se-getter ngelixa ifumana amandla aphezulu e-chip awayengenakufikelelwa ngaphambili.

Uqwalaselo oluguquguqukayo kunye neNkqubo yeSicelo

I-DGP8761 ayisosixhobo esizimeleyo; ingadibaniswa ngokulula kwiinkqubo ezahlukeneyo zokwenza izinto ngokuzenzekelayo.

Ukwandiswa koQhagamshelo: Ingadityaniswa ne-DFM2800 multi-functional wafer attachment ukuze iqhotyoshelwe ngqo kwi-DAF (Die Attach Film) emva kokuncipha. Ingasetyenziselwa ukwakha iinkqubo zenkqubo eziphambili ezifana ne-DBG (Dicing Before Grinding) ukuphucula isivuno se-wafers ezincinci.

Ukugcinwa kunye neeNdawo zokuSebenza: Ziyahambelana neDISCO Olu luhlu lwe-8000 lugcina ukuhambelana okuphezulu, kunye nezinto eziphambili ezifana namavili okugaya kunye neepleyiti zokunxiba zinokutshintshiselana, okwenza kube lula ukugcinwa kunye nokunciphisa iindleko zeendawo zokuSebenza.

Isoftware kunye nokuSebenza: Ukusebenzisa ujongano lwe-GUI olusekelwe kubuchwepheshe obuvuthiweyo be-8000 series, i-united operating logic inciphisa ixesha loqeqesho lomqhubi.

Indawo yeMarike kunye nezicelo: I-DGP8761 isetyenziswa kakhulu kwiipakethe eziphambili (i-HPC/AI/3D IC), ii-power semiconductors, kunye nezixhobo ze-MEMS. I-DISCO ikwabonelela ngeenkonzo zokusika nokugaya izixhobo kusetyenziswa esi sixhobo kumaziko ayo etekhnoloji yehlabathi (njengaseTshayina naseSingapore).

Izinto ekufuneka ziqwalaselwe kulondolozo: Ukuqinisekisa ukuchaneka, ukunamathela ngokungqongqo kwi-DISCO's okusingqongileyo (ubushushu kunye nokufuma ngaphakathi kwe-±1°C, umoya ococekileyo ocinezelweyo) kunye neemfuno ezisetyenziswayo kubalulekile. Ngaphezu koko, i-Z3 axis motion logic (kuquka ulandelelwano lwe-machining olu-5 kunye neeparamitha zesikhundla) ichaphazela ngokuthe ngqo i-machining yield; useto olungafanelekanga lweeparamitha lunokubangela iingxaki zenkqubo.

Isishwankathelo: I-DISCO I-DGP8761 ngumatshini wokugaya/wokupolisha okumgangatho ophezulu odibanisa ngokugqibeleleyo ukuchaneka okuphezulu, ukusebenza kakuhle okuphezulu, kunye nokuguquguquka kwenkqubo. Ayivuli nje kuphela indlela yokwenziwa kweetships ezincinci kakhulu kodwa, ngokusebenzisa amandla ayo okukhulisa inkqubo, iba yinxalenye ephambili ekwakheni iifektri ezihlakaniphileyo ze-semiconductor eziphambili. Kubavelisi abaphambili abafuna ukusebenza okuphezulu kunye nokuzinza kwenkqubo, imele utyalo-mali olubalulekileyo.