Isixhobo sokugaya i-DISCO wafer DFG8541

I-DISCO DFG8541 ngumatshini wokusila ozenzekelayo ngokupheleleyo owenzelwe ukuhlangabezana neemfuno zokuncitshiswa kwe-wafer kwii-wafers ezi-8-intshi nezincinci. Njengophuculo oluya kwi-predecessor yayo, i-DFG8540 ethengiswa kakhulu, inokubekwa "njengemodeli ephambili yokuncitshiswa kwe-wafers ezi-8-intshi," eyaziwa ngokuchaneka kwayo okuphezulu, ucoceko oluphezulu, kunye nozinzo olugqwesileyo, olufaneleke ngakumbi ekucutshungulweni kwezinto eziqinileyo nezibuthathaka ezifana ne-silicon carbide (SiC).

Oku kulandelayo yintshayelelo eneenkcukacha ngomgaqo wayo wokusebenza, imisebenzi ephambili, iinkcukacha, kunye nexabiso lemarike.

Umgaqo Wokusebenza: Ulungelelwaniso oluPhambili lweNtlanganiso kunye nokuLungela

I-DFG8541 isebenzisa uyilo lwe-"dual-spindle, three-suction-cup".

Ulwahlulo olucacileyo lwaBasebenzi: I-spindle enye iphethe ivili lokusila elirhabaxa ukuze isuse ngokukhawuleza izinto eziphambili ngasemva kwe-wafer; enye i-spindle iphethe ivili lokusila elincinci ukuze igqibezele kakuhle umphezulu, ifumane iziphumo zokugqibela ezigudileyo, ezithe tyaba, nezingenamonakalo.

Inkqubo Esebenza Kakhulu: I-wafer ifakwa kwi-vacuum-sorbed kwitafile yokusebenza. Ngokucwangciswa kwenkqubo ngokuchanekileyo, umsebenzi ozenzekelayo "wokubamba kanye, ukucubungula okuqhubekayo" uyafezekiswa, kuthintelwe iingozi zongcoliseko kunye nomonakalo obangelwa kukudluliselwa kwezinto phakathi kwezixhobo ezahlukeneyo.

Izicelo kunye neendima: Ngaphaya kweSilicon

Njengesixhobo esisetyenziswa ngokubanzi, sidlala indima ebalulekileyo kwicandelo le-semiconductor yesizukulwana sesithathu.

Umsebenzi oPhambili: Ukucutha ii-wafers ezincinci eziziisentimitha ezi-8 (Si/SiC) ukuze zibe nobukhulu obujoliswe kuzo, ukuqinisekisa ukufana kobukhulu (TTV), kunye nokususa iileya zomonakalo womphezulu obangelwe ziinkqubo zangaphambili.

I-Emerging Mainstay: Ngokukhetha i-spindle ene-torque ephezulu, i-DFG8541 inokucubungula ngokuzinzileyo izinto zobunzima obuphezulu kakhulu ezifana ne-SiC. Esi sesona sizathu sokuba ithandwa kakhulu kwimarike yangoku ye-power semiconductor.

Isishwankathelo seeParamitha eziphambili

Udidi lweParamitha | Iinkcukacha ezithile

Izinto Zokusebenza Ezisebenzayo: Φ8 intshi (200mm) nangaphantsi; ziyahambelana nee-Φ4, 5, 6, kunye nee-8-intshi zeewafers ezisebenzisa i-chuck yendalo yonke

Indlela Yokugaya: Ukugaya okujikelezayo okujikelezayo okungaphakathi kokutya

Uqwalaselo lweSpindle: Iispindle ezimbini (ii-axes ezi-2), i-spindle yokuthwala umoya we-hydrostatic (esemgangathweni)

Isantya seSpindle: 1,000 - 7,000 rpm

Amandla eSpindle: Umgangatho oyi-4.2 kW

Uqwalaselo lweTheyibhile yoMsebenzi: Iitafile zoMsebenzi ezintathu (iitafile ezi-3 ze-chuck)

Iinkcukacha zevili lokuGrila: Ivili lokuGrila ledayimani le-Φ200 mm

Ubukhulu beZixhobo (Ububanzi x Ububanzi x Ububanzi): Malunga ne-1,100 × 2,800 × 1,800 mm

Ubunzima beZixhobo: Malunga ne-3,000 kg

Imisebenzi ephambili kunye neempawu

I-DFG8541 imele uphuculo olubalulekileyo ukusuka kwi-DFG8540.

Iimpawu/Imisebenzi Inkcazo eneenkcukacha

Amandla Okucoca Aphezulu: Ii-nozzles ze-multi-station ezine-two fluid: Xa kuthelekiswa nokucoca kwamanzi omoya okuqhelekileyo, oku kususa ngamandla amasuntswana othuli ancamathela kwi-wafer emva kokusila. Le teknoloji isetyenziswa kakhulu kwiindawo zokusebenza eziphambili ezifana neekomityi zokufunxa kunye nezinto zokusebenza, nto leyo enciphisa ngempumelelo umngcipheko wokwaphuka kwe-wafer encinci.

Ulungelelwaniso olungadibaniyo: Isebenzisa ikhamera ukufumana iziko le-wafer, ithatha indawo yoqhagamshelwano lomzimba kwaye isuse imikrwelo okanye umonakalo ongasecaleni ngexesha lenkqubo yokulungelelanisa.

Imveliso Ekrelekrele: Iresiphi yeWafer nganye: Ivumela iiwafer ezahlukeneyo ngaphakathi kwekhasethi yewafer efanayo ukuba zicutshungulwe ngokuzenzekelayo ngokweendlela zokupheka ezicwangcisiweyo (ubukhulu bokugaya, isantya, njl.njl.), zilungelelanisa ngokugqibeleleyo nemveliso eyahlukeneyo, encinci.

Imisebenzi yoKhuseleko lweWafer: Idibanisa iindlela ezininzi zokukhusela, kubandakanya imephu yewafer (i-wafer echasene nokungahambi kakuhle/i-wafer engenanto), ukuhlolwa kwangaphambili kobukhulu (i-tape echasene ne-double), kunye nokubamba i-vacuum (i-alamu yokusilela kombane ngequbuliso), ukuqinisekisa ukhuseleko lweewafers ezinexabiso eliphezulu.

Ukulungiswa Kokuthambeka Okuhlengahlengiswa Ngombane: Ukuthambeka kwekomityi yokufunxa kunokulungiswa ngombane ngokusebenzisa amaxabiso akwisikrini, kuphucula imo yokucubungula kunye nokunciphisa ixesha lokungasebenzi ngesandla lokulinganisa.

Ukusebenziseka Okuphuculweyo Kakhulu: I-GUI Yesikrini Esikhulu Eyi-19-intshi: Xa ithelekiswa nesikrini se-DFG8540 se-15-intshi, isibonisi asisikhulu nje kuphela kodwa sikwanojongano lomsebenzisi olucacileyo nolunemizobo.

Ulondolozo Oluphuculweyo: Ulwakhiwo oluphuculweyo lokucoca ngaphakathi lwenza ulondolozo lube lula.

Ukonga Amandla kunye noYilo oluNcinci: I-spindle entsha yomoya inciphisa ukusetyenziswa komoya ngama-50%; uyilo lwepompo ye-vacuum eyakhelwe ngaphakathi inciphisa umgama wayo nge-15% xa kuthelekiswa nowangaphambili, nto leyo efezekisa ukonga okuluhlaza kwizixhobo zokusebenza nakwimisebenzi yazo.

Indawo yeMarike kunye neXabiso: Xa kuthelekiswa ne-flagship DGP8761 ejolise kwimarike ye-12-intshi, i-DFG8541 igxile kakhulu kwimarike ye-8-intshi, okwenza ibe ngumatshini oqhelekileyo "osebenza kakuhle, onexabiso eliphantsi":

Ukubekwa Kwendlela Yokusebenza: I-DFG8541 yindlela yokusebenza ebalaseleyo kwiigrinder ze-intshi ezi-8. Ngokukhetha i-spindle ene-torque ephezulu, iyoyisa ngempumelelo imingeni yokuncitshiswa kwezinto eziqinileyo nezibuthathaka ezifana ne-SiC, idibanisa inzuzo yayo epheleleyo kwimarike ye-intshi ezi-8.

Ixabiso loTyalo-mali: Njengophuculo oluzinzileyo ukuya kwiqonga elivuthiweyo, linokuthenjwa ngokubhekiselele ekusebenzeni okuzinzileyo kwexesha elide kunye nemveliso eqhubekayo, okwenza ukuba libe lukhetho olusebenzayo, olunomngcipheko omncinci, nolunokuthenjwa lotyalo-mali lwezixhobo zomgca wemveliso eziziisentimitha ezi-8. Iiyunivesithi eziphambili zasekhaya (ezifana neYunivesithi yaseXi'an Jiaotong) sele zithenge ezi zixhobo zophando oluphambili.

Iimfuneko zoLondolozo kunye noFakelo: Ukuqinisekisa ukusebenza okuzinzileyo nokuchaneke kakhulu kwe-DFG8541, ukunamathela ngokungqongqo kwiimfuno zeDISCO kwindawo yokufakela kuyimfuneko:

Ucoceko lweNdalo: Kufuneka ifakwe kwigumbi lokucoca elinococeko oluphezulu. Ubushushu bomoya kufuneka buhlale buzinzile kwi-20-25℃, kwaye ukuguquguquka kulawulwa ngaphakathi kwe-±1℃. Umswakama ohambelanayo uhlala kufuneka ube ngaphantsi kwe-55%.

Ukunikezwa Amandla:

Umoya Ocinezelweyo: Umoya ocinezelweyo ococekileyo, owomileyo, nongenawo amafutha ococekileyo ophezulu oxinezelekileyo kuxinzelelo lwe-0.5 MPa okanye ngaphezulu uyafuneka.

Umbane: Kufuneka umbane onezigaba ezintathu ohambelana neemfuno zombane zesixhobo.

Amanzi Okupholisa: Amanzi acocekileyo (amanzi e-DI) anesantya sokuhamba esizinzileyo kunye nobushushu obungaguquguqukiyo kuyafuneka ukuze kuphole i-spindle. Ubushushu bamanzi bufanele bulingane nobushushu begumbi kunye nobushushu obuncinci obutshintshatshintshayo.

Ukuhlola nokutshintsha amavili okugaya rhoqo, ukucoca ii-vacuum chucks, kunye nokugcina i-air spindle ikwimeko entle kubalulekile ekwandiseni ubomi bezixhobo nokuqinisekisa ukuba imveliso iyasebenza.

Ngamafutshane, i-DISCO DFG8541 sisisombululo esivuthiweyo nesithembekileyo sokuncitshiswa kwe-wafer esiyi-intshi ezi-8. Ifezekisa ukusebenza okuphambili kushishino kwiindawo zayo eziphambili kwaye yenziwe ngokupheleleyo ukuze izenzekele, icoceke, kwaye isebenziseke lula ukuhlangabezana neemfuno zemveliso yanamhlanje.